General - Nokia 6260 Repair Hints

Customer Care / Service & Support Readiness
Competence Transfer Team
Copyright © 2005 Nokia

General

- How to use this document
Put the colored schematics behind this manual.
Now you are able to follow these specifications with graphical layouts, and it is easier for you to find the
components and measuring points.
- Component characteristics
Some components contain important data such as tuning values or security data; therefore, several steps
described are only feasible if you are able to reflash/ realign the phone and/or rewrite IMEI/SIMlock in certain
cases. Please pay attention to separate notes.
- Broken balls / underfill, µBGAs
All replaceable (not underfilled) µBGA components must be renewed after removing. Reflow with
uncontrolled hot-air fan is strictly forbidden! It is also not recommended only to reflow the old µBGA using a
µBGA rework station! µBGA must only be soldered with Nokia approved µBGA rework machines (e.g. Zevac/
OK-Metcal/ Martin) to get durable solder joints.
Check soldering points after removing a µBGA; if necessary rework oxidated solderings (broken balls)
carefully by tinplating these areas with few flux and a hot soldering iron. Before placing a new component
remove the tin and clean the PWB; e.g. with help of solder wick and flux cleaner such as "Kontakt LR".
Use only recommended flux type and an appropriate amount of it – avoid drowning the PWB in flux as this
will lead to additional faults!
Also check underfilled parts for broken underfill material below. In this case carefully evaluate possible repair
actions as the phone probably was exposed to strong mechanical stress.
"rework" done with uncontrolled
hot air
Edited by:
TBE
PWB drowned in flux
Checked by:
SCCE
CONFIDENTIAL
03.02.2005
broken underfill of a µBGA part
4 (21)
Repair Hints
Version 1.0 Approved
6260 / RM-25
Approved by:
MKO/PRZ