Printed Wiring Board -Hand Main Section - Sony SPP-888 Service Manual

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SPP-888
• Semiconductor
Location
Ref. No.
Location
D3
A-1
D101
C-4
IC1
B-6
Q1
B-9
Q101
D-2
Q102
C-3
Q103
C-2
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
: Through hole.
r
• b : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
5-12. PRINTED WIRING BOARD — HAND MAIN SECTION —
36
36
(Page 38)
(Page 38)

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