LG -P990 Service Manual page 238

Level LocationNo. Description
Inductor,
6 L900
Multilayer, Chip
R212,
R215,
R222,
R223,
R436, PCB ASSY, MAIN,
6
R447, PAD OPEN
R459,
R460,
R519,
R625
6 U301 IC, MCP, NAND
Inductor, Wire
6 L602
Wound, chip
Inductor, Wire
6 L605
Wound, Chip
ANT1201,
6 Contact
ANT1203
Inductor, Wire
6 L604
Wound, chip
L1207,
Inductor, Wire
6 L201,
Wound, Chip
L202
R234,
PCB ASSY, MAIN,
6 R237,
PAD SHORT
R612
Inductor, Wire
6 L603
Wound, chip
C232, Capacitor,
6
C233 Ceramic, Chip
6 CN901 Connector, BtoB
C1221,
C1233,
C206,
C207, Capacitor,
6
C213, Ceramic, Chip
C809,
C828,
C901
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
PartNumber
LK1005 R27K-T 270NH 10% - 25mA 0.91OHM 120MHZ 10
ELCH0010402 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,
LTD
SAFO0000401 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
H8BCS0QG0MMR-46M NAND/1G SDRAM/512M 0VTO0V
EUSY0425901 8.0x9.0x1.0 TR 130P NAND+DRAM BGA - HYNIX
SEMICONDUCTOR INC.
MIPSZ2012D2R2 MIPSZ2012D2R2, 2.2 uH, N,
ELCP0008013
2.0X1.2X1.0, R/TP FDK CORPORATION.
MIPS2520D100 10UH 30% - 200mA 0.28OHM - - SHIELD
ELCP0008016
2.5X2X1MM NONE - FDK CORPORATION.
COMPLEX LGP999BN ZZ:Without Color LG-P999
MCE62252901
CLIP_SUB
LQM2HPN1R0MG0 LQM2HPN1R0MG0, 1 uH, N,
ELCP0009408 2X2.5X1.0, R/TP, Chip power MURATA
MANUFACTURING CO., LTD.
CIG21L3R3MNE 0H 20% - 800mA 0.22OHM - - SHIELD
ELCP0012101 2X1.25X1MM NONE - SAMSUNG ELECTRO-
MECHANICS CO., LTD.
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
MIPS2520D1R5 1.6 uH, N, 2.5*2.0*1.0, R/TP, 0.0000015,
ELCP0012801 30%, 1.2A, 0.1 OHM, 2.5X2X1MM, NONE, R/TP, Inductor,
Wire Wound, Chip FDK CORPORATION.
MCH032A180JK 18pF 5% 25V NP0 -55TO+125C 0603
ECCH0009504
R/TP - ROHM.
GB042-24P-H10-E3000 24P 0.40MM STRAIGHT PLUG
ENBY0034101
SMD R/TP 1M - LS Mtron Ltd.
C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C
ECZH0001215
1005 R/TP - TDK KOREA COOPERATION
- 38 -
Spec
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