LG KG920 Service Manual
  1. Manuals
  2. Brands
  3. LG Manuals
  4. Cell Phone
  5. KG920
  6. Service manual
LG KG920 Service Manual

LG KG920 Service Manual

Hide thumbs Also See for KG920:
Table of Contents

Advertisement

Quick Links

Download this manual See also: User Manual
kg920 cover
2006.5.15 10:6 AM
˘
` 1
Service Manual
KG920
Date: April, 2006 / Issue 1.0

Advertisement

Table of Contents
loading

Related Manuals for LG KG920

Summary of Contents for LG KG920

  • Page 1 2006.5.15 10:6 AM ˘ Service Manual KG920 Date: April, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION........5 4.12 Camera Trouble........108 4.13 Speaker Trouble ........120 1.1 Purpose ............. 5 4.14 Headphone Trouble .......122 1.2 Regulatory Information ....... 5 4.15 Receiver Trouble ........124 1.3 Abbreviations ..........7 4.16 Microphone Trouble.......126 2. PERFORMANCE ........9 5. DOWNLOAD AND CALIBRATION...128 2.1 H/W Features..........9 5.1 Download..........128 2.2 Technical Specification ......18...
  • Page 3 - 4 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company”s employees, agents, subcontractors, or person working on your company”s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electrostatic Discharge...
  • Page 7 1. INTRODUCTION Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM...

  • Page 8: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features 1) System Specification Item Target Specification Form Factor Twisted Bar Size 108 x 50 x 18mm Weight 150g Battery 3.7V, 820 mAh LI-Ion Talk Time Up to 3h : GSM Tx Level 7 Standby Time Up to 180 hrs : Paging Period 9, RSSI 85dBm Antenna...
  • Page 9 2. PERFORMANCE 2) Feature Function Target Specification RSSI (5 Level) Battery Charging (5 Level) Display Multi-Language (English, French, German, Spanish, Dutch, etc.) Quick Access Mode(HOT KEY) PLMN/Service Indicator Number of Keys : 30 Key (including Soft key, side key, Hot key) Soft Function Keys : 3 Keypad International Access (+)(long 0)
  • Page 10 2. PERFORMANCE Read Cell Broadcast Cell Broadcast Cell Broadcast Categories Cell Broadcast Message Language Number Store and Recall Alpha Store and Recall Search the Phone Book in call Scroll by alpha Last Number Dialled (20) Last Number Missed (10) Phone Book Last Number Received (10) Copy &...
  • Page 11 2. PERFORMANCE Call Forwarding All Incoming Calls Call Forwarding On Busy Call Forwarding No Reply Call forwarding Not-reachable Call Barring All Outgoing Calls Supplementary Services Call Barring All Outgoing International Calls Call Barring All incoming Calls Call Barring All incoming Calls when roaming Conference Call (up to 5 calls) Plug-In Type : 3V Only Service Provider Lock &...
  • Page 12 2. PERFORMANCE Text Input T9 (Predictive word input) Organizer Calendar & Memo Setting Local time World Time Number of Selectable Cities: 76 Unit converter Currency/Surface/Length/Weight/Temperature/Volume/Velocity/Shoes /Clothes Calculator Addition, Subtraction, Multiplication, Division, trigonometrical function , logarithmic function Scheduler , Memo Sync Phone Book Sync PC Sync Internet Kit supporting PC OS (2000,ME,XP)
  • Page 13 2. PERFORMANCE Read and Save MMS Message Preview MMS Message Send and Receive MMS Message Previous, Next slide Set timer MMS (3GPP R5) Remove media Delete slide Attach MMS media (Text, Audio, Picture) Audio: SP-MIDI, I-Melody (AMR: supported), MIDI, SMAF, WAV Picture: GIF87,GIF89a, PNG, JPEG, WBMP version 2.0 @ TELECA JAVA...
  • Page 14 2. PERFORMANCE 3) RF Transmitter Item EGSM DCS1800 100kHz ~ 1GHz -36dBm -36dBm 1GHz ~ 12.75GHz -30dBm MS allocated 1GHz ~ 1710MHz -30dBm Channel 1710MHz ~ 1785MHz -36dBm 1785MHz ~ 12.75GHz -30dBm 100kHz ~ 880MHz -57dBm -57dBm Conducted 880MHz ~ 915MHz -59dBm -59dBm Spurious...
  • Page 15 2. PERFORMANCE Item EGSM DCS1800 Frequency Error Under 3dB below reference sensitivity 3dB below reference sensitivity Multipath and Interference RA250: ±300Hz RA130: ±400Hz Condition HT100: ±180Hz HT100: ±350Hz TU50: ±160Hz TU50: ±260Hz TU3: ±230Hz TU1.5: ±320Hz 0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB 200kHz...
  • Page 16 2. PERFORMANCE 2) Receiver Item GSM900 DCS1800 Sensitivity (TCH/FS Class II) -105dBm -105dBm Co-Channel Rejection C/Ic= 7dB C/Ic= 7dB (TCH/FS Class II, RBER, TUhigh/FH) 200kHz C/Ia1= -12dB C/Ia1= -12dB Adjacent Channel Rejection 400kHz C/Ia2= -44dB C/Ia2= -44dB Wanted Signal: -98dBm Wanted Signal: -96dBm Intermodulation Rejection 1’st interferer: -44dBm...

  • Page 17: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification EGSM TX: 890 + (n-1024) x 0.2 MHz RX: 935 + (n-1024) x 0.2 MHz (n=975~1024) Frequency Band TX: 1710 + (n-512) x 0.2 MHz RX: 1805 + (n-512) x 0.2 MHz (n=512~885) TX: 1810 + (n-512) x 0.2 MHz RX: 1905 + (n-512) x 0.2 MHz (n=512~885) RMS <...
  • Page 18 2. PERFORMANCE Item Description Specification EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Output RF Spectrum 6,000 DCS, PCS (due to modulation) Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 19 2. PERFORMANCE Item Description Specification DCS, PCS Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status EGSM BER (Class II) < 2.439% @-102 dBm Bit Error Ratio DCS, PCS BER (Class II) <...
  • Page 20 2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% System frequency 2.5ppm (26 MHz) tolerance 32.768KHz tolerance 30ppm...
  • Page 21 2. PERFORMANCE Item Description Specification Forced shut down Voltage 3.35 0.03 V 2 Li-Ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 820mAh Switching-mode charger Travel Charger Input: 100 ~ 240 V, 50/60 Hz Output: 5.2 V, 800 mA - 22 -...

  • Page 22: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Transceiver (SI4210) The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part. The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital Cellular handsets and wireless data modems.
  • Page 23 3. TECHNICAL BRIEF (1) Receiver Part The Aero I transceiver uses a low-IF receiver architecture which allows for the on chip integration of the channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in conventional super-heterodyne architectures.
  • Page 24 3. TECHNICAL BRIEF Figure. 3-2 SI4210 RECEIVER PART B. Intermediate frequency (IF) and Demodulation A quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes.
  • Page 25 3. TECHNICAL BRIEF (2) Transmitter Part The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-locked loop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (1850- 1910MHz) bands.

  • Page 26: Pam (Sky77328)

    3. TECHNICAL BRIEF B. OPLL The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the GSM 850 and E-GSM 900 bands.

  • Page 27: 26 Mhz Clock (Vctcxo)

    3. TECHNICAL BRIEF 3.3 26 MHz Clock (VCTCXO) The 26 MHz clock(X501) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 26 MHz. It is used within the Si4210, analog base band chipset (U100, AD6535), digital base band chipset (U101, AD6527) 2V75_VVCXO X501 R523...
  • Page 28 3. TECHNICAL BRIEF VBAT 2V85_RF U504 MIC5255-2.85BM5 CLKON C543 C544 C545 C546 C547 4.7u 0.01u Figure 3-6. RF LDO CIRCUIT DIAGRAM - 29 -...

  • Page 29: Digital Main Processor (Ad6527B)

    3. TECHNICAL BRIEF 3.5 Digital Main Processor (AD6527B) Figure 3-7. SYSTEM INTERCONECTION OF AD6527 EXTERNAL INTERFACE - 30 -...
  • Page 30 3. TECHNICAL BRIEF • AD6527 is an ADI designed processor. • AD6527 consists of 1. Control Processor Subsystem • 32-bit ARM7TDMI Control Processor • 58.5 MHz operation at 1.7V • On-board 16KB instruction/Data Cache • 1 Mbits of on-chip System SRAM 2.
  • Page 31 3. TECHNICAL BRIEF 3.5.1 Interconnection with external devices A. RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz B. LCD module interface The LCD module is controlled by AD6527 and MV8620. In operating mode, the AD6527 controls the LCD module through LCD_CS, LCD_RS, L_DATA[15:00], LCD_BACKLIGT, LCD_RESET, LCD_WR, 2V8_MM.
  • Page 32 3. TECHNICAL BRIEF C. RF interface The AD6527 controls RF parts through PA_BAND, ANT_SW1, ANT_SW2, CLKON, PA_EN, S_EN, S_DATA, S_CLK, RF_RST. Signals Description PAM Band Select PA_BAND (GPO 17) ANT_SW1 (GPO 9) Antenna switch Band Select ANT_SW2 (GPO 11) Antenna switch Band Select CLKON RF LDO Enable/Disable PA_EN (GPO 16)
  • Page 33 3. TECHNICAL BRIEF D. SIM interface The AD6527 provides SIM Interface Module. The AD6527 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals-SIM_DATA, SIM_CLK, SIM_RST(GPIO_23)-are required.
  • Page 34 3. TECHNICAL BRIEF 3.5.2 AD6527 Architecture Figure 3-10. AD6527 Architecture The internal architecture of AD6527 is shown above Figure 3-10. AD6527 regroups three Main subsystems connected together through a dynamic and flexible communication bus network. It also includes onboard system RAM (SRAM) and interfaces with external Flash Memory, Baseband converter functions, and terminal functions like MMI, SIM and Universal System Connector (USC).

  • Page 35: Analog Main & Power Management Processor (Ad6535)

    3. TECHNICAL BRIEF 3.6 Analog Main & Power Management Processor (AD6535) Figure 3-11. AD6535 FUNCTIONAL BLOCK DIAGRAM - 36 -...
  • Page 36 3. TECHNICAL BRIEF • AD6535 is an ADI designed Analog Baseband processor. AD6535 covers the processing GMSK modulation interface, Aux ADC, Voice signal processing and Power Management. • AD6535 consists of 1. BB Transmit section • GMSK Modulation • I-channel & Q-channel Transmit DACs and Filters •...
  • Page 37 3. TECHNICAL BRIEF 3.6.1 Baseband Transmit Section 1. The AD6535 Baseband Transmit Section is designed to support GMSK for both single slot and multi-slot application. 2. The AD6535 includes a digital GMSK modulator which is used for GSM application. The GMSK modulator uses a ROM lookup table to modulate the serial data stream from the BSPORT.
  • Page 38 3. TECHNICAL BRIEF 3.6.3 Auxiliary Section 1. This section includes an Automatic Frequency Control(AFC) DAC, voltage reference buffers, an Auxiliary ADC, and light controllers. • AFC DAC: 13 bits 2. This section also contains AUX ADC and Voltage Reference • IDAC: 10 bits •...
  • Page 39 3. TECHNICAL BRIEF 3.6.4 Audio Section 1. The AD6535 Audio section supports communications and personal audio applications. 2. The Audio Section provides an audio codec with two digital-to-analog converter, a ring tone volume controller, a microphone interface, and analog input and output channels. Figure 3-15.

  • Page 40: Power Management

    3. TECHNICAL BRIEF 3.6.5 Power Management Figure 3-16. AD6535 POWER MANAGEMENT SECTION 1. Power-on sequence logic 1. The AD6535 controls Power-on sequence 2. Power-on sequence - If a battery is inserted, the battery powers the 8 LDOs up. - Then if PWRONKEY is detected, the LDOs outputs turn on. - REFOUT is also enabled - Reset is generated and sent to the AD6527 - 41 -...
  • Page 41 3. TECHNICAL BRIEF Figure 3-17. AD6535 POWER MODE LOGIC 2. LDO Block 1. There are 8 LDOs in the AD6535. - VCORE : supplies Digital baseband Processor core and AD6535 digital core - VMEM : supplies external memory and the interface to the external memory on the digital baseband processor (1.8V or 2.8V, 150mA) - VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA) - VSIM : supplies the SIM interface circuitry on the digital processor and SIM card (2.85V, 20mA)

  • Page 42: Battery Charging Block

    3. TECHNICAL BRIEF 3.7 Battery Charging Block Charging IC VCHARGE VBAT 2V8_VEXT D201 CUS02 VUSBIN VUSBIN U206 ISL6299 CRDL IMIN _PPR (GPIO_16) _CHG CHG_STAT ICDL USBON R215 (GPIO_0) CHG_EN PGND C236 C237 C238 C239 (1%) Figure 3-18. CIRCUIT FOR BATTERY CHARGING The ISL6299 is designed for a single-cell Li-ion or Li-polymer battery charging circuit that accepts both a USB port and a desktop cradle as its power source.
  • Page 43 3. TECHNICAL BRIEF USB Charge Current When the USB port is selected as the power source, the charge current is enabled by the logic input at the USBON pin. When the USBON is driven to logic LOW, the charger is disabled. When the USBON is driven to logic HIGH, the charge current is fixed at a typical value of 380mA.
  • Page 44 3. TECHNICAL BRIEF Figure 3-19. BLOCKDIAGRAM Cradle Charge Current The cradle charge current is enabled by the EN pin only. The USBON pin has no control on the cradle charge current. The cradle charge current is programmed with the external resistor connected between the ICDL pin and the GND pin.
  • Page 45 3. TECHNICAL BRIEF Trickle Charge Current When the battery voltage is below the minimum battery voltage VMIN given in the electrical specification, the charger operates in a trickle/preconditioning mode, where the charge current is typically 14% of the programmed charge current for the cradle input. If power comes from the USB input, the trickle mode current is approximately 53mA.

  • Page 46: Mumti-Media Interface

    3. TECHNICAL BRIEF 3.8 MUMTI-MEDIA INTERFACE Strobe and Flash LED AF(IRIS/Shutter) control MICOM MBGM01 (256MBits SDRAM + AD6527 32MBits Flash) Camera Modoule JPEG Serial Interface MV8620 Mini-SD 320 x 240, 262k, TFT LCD Camera Audio Microphone Codec I2C/I2S Input SPEAKER Figure 3-20.

  • Page 47: Camera Module

    3. TECHNICAL BRIEF 3.8.1 Camera Module Figure 3-21. The IU495C-L is a lens module that uses a diagonal 7.17mm (Type 1/2.5) 5.13M effective pixels interline type CCD solid-state image sensor with a square pixel array. This module has an on-chip AF (auto focus) function actuator that allows it to focus on subjects from macro (4cm) to infinite range.
  • Page 48 3. TECHNICAL BRIEF 3.8.2 AFE(Analog Front End) Figure 3-22. - 49 -...
  • Page 49 3. TECHNICAL BRIEF • Function - CDS( Correlation Double Sampling) - PGA (Programmable Gain Amp) - Serial interface control - 12 bit ADC - P-LFBGA0808-113 package • Feature - PGA have to High sensitivity of -8 ~ 34.84 dB 10 bit gradation - CDS is in control of CCD Reset Noise - Serial interface is in control of PGA gain, plus timing and so on.
  • Page 50 3. TECHNICAL BRIEF 3.8.3 Strobe and Flash LED Module Figure 3-23. Features High Light Intensity - over 3,500 lux at 1m far from flashtube (with 10uF photo flash capacitor) Small Size - 11.25 * 32.475 * 37.851mm (±0.2) - φ6.3X18.5 mm Max- Capacitor Low-voltage Operation - 2.7 ~ 7 V External MCU control available...
  • Page 51 3. TECHNICAL BRIEF 3.8.4 MICOM This chip is 8-bits micro processor and work for AF(Auto Focus), Shutter and IRIS. MICOM_PWR MICOM INTERFACE MICOM_CLK MICOM_CLK MICOM_DO MICOM_DO MICOM_DI MICOM_DI 3V3_M3M 2V8_M3M MICOM_PWR MICOM_RUN_STBY P65_SCK P6_INT6 AF_SPEED_CON3 P66_SOT P5_INT5 AF_SPEED_CON2 P67_SIN P4_INT4 AF_SPEED_CON1 P37_AN7 P3_INT3...
  • Page 52 3. TECHNICAL BRIEF 3.8.5 MBGM01(5M CCD ISP) Figure 3-25. - 53 -...
  • Page 53 3. TECHNICAL BRIEF • FR71E Core - Fujitsu FR series 32-bit RISC core for compatible instruction equipped, 5-level pipelines and execution rate of 1 instruction/1 cycle - 4 KBytes instruction cache and 8 KBytes data RAM equipped - 24-bit address bus, 16-bit data bus - Capable of directly accessing the external flash memory, SDRAM and SRAM - Built-in peripheral functions: DMAC(5 ch), UART(2 ch), 16-bit reload timer(3 ch) and interrupt controller...
  • Page 54 3. TECHNICAL BRIEF • Display Interface - Analog composite signal output for video, or YC signal output - Digital LCD signal output - REC656 output - YUV output - Plane exclusive for OSD which can be defined by VGA (640x480) or QVGA (320x240), and hardware cursor plane available for use •...
  • Page 55 3. TECHNICAL BRIEF 3.8.6 MV8620(5M back-end IC + Multi-Media Function) Figure 3-26. - 56 -...
  • Page 56 3. TECHNICAL BRIEF • Architecture multimedia processor for mobile platforms (mobile phones), and general embedded multi-media applications 32-Bit RISC architecture and powerful instruction set with ARM9 CPU core Internal Advanced Micro-controller Bus Architecture (AMBA) (AMBA2.0, AHB/APB) • System interface Provide USB 1.1 interface with mass storage or communication device Support NandFlash Memory Interface from 64Mbit to 8Gbit with 8bit data bus Can connected with Video DAC(or External TV encoder) for TV_out function •...
  • Page 57 3. TECHNICAL BRIEF • 3D Accelerator Support OpenGL-ES 1.0 Graphics Library by Software Engine • Display Management 2D Graphics Accelerator : BitBLT OSD (up to 320 x 240) PIP (picture in picture) function 2LCD Interface (Main, Sub) 8bit, 12bit, 16bit, 18bit •...

  • Page 58: Midi Ic(Ymu787)

    3. TECHNICAL BRIEF 3.9 MIDI IC(YMU787) Figure 3-27. YMU787 BLOCKDIAGRAM - 59 -...
  • Page 59 3. TECHNICAL BRIEF 64POLY MIDI VBAT 1V8_MIDI 2V8_MIDI 2V8_VEXT R220 R221 120p C201 U201 MIC2211-GMYML VOUT1 VOUT2 C203 R204 0.1u SPK_P_SM 1000p C202 C205 C206 C207 BGND C208 C209 0.01u C204 (GPIO_12) MIDI_RST _RST C211 26MHZ CLKI SPOUT2L MIDI_SPK- 1000p BLCK SPOUT1L C212...
  • Page 60 3. TECHNICAL BRIEF CONTROL REGISTER;ROM/SRAM The Control register and ROM/SRAM are accessed from “Instantaneous write register”, “Delayed write register”, and “Instantaneous read register”in the intermediate register. In the control register, there is a register to control the following synthesizer mainly. The voice parameter for FM(GM 128 voices+DRUM 40 voices)and wave data for WT are stored in ROM.
  • Page 61 3. TECHNICAL BRIEF DIGITAL EQUALIZER SECTION This is a digital equalizer. Voice of signals from the Hybrid Synthesizer section and voice of digital audio signals are adjusted. DVX ARITHMETIC CONTROL Two-channel virtual speaker image function that is based on DVX technology makes it possible to create natural stereo sound under the two closely spaced speakers.

  • Page 62: Memory

    3. TECHNICAL BRIEF 3.10 MEMORY(512Mbits NOR + 128Mbits PSRAM) 512Mbits FLASH/128Mbits pSRAM 2V8_VMEM U202 SN74AUC2G08YZPR ROM_CS1 R206 ROM_CS2 MEM_CS1 R207 MEM_CS2 GPCS2 GPCS1 C210 0.1u 2V8_VMEM U203 ROM_CS1 R222 ADD24 GPCS1 C215 SN74AUC1G08YZPR 0.1u DATA15 DATA14 DATA13 ADD24 DATA12 ADD23 DATA11 ADD22 DATA10...
  • Page 63 3. TECHNICAL BRIEF OVERVIEW The 1.8 Volt Intel StrataFlash® wireless memory with 3-Volt I/O (L30) device provides read-while-write and read-while-erase capability with package-compatible density upgrades through 256-Mbit. This family of devices provides high performance at low voltage on a 16-bit data bus. Individually erasable memory blocks are sized for optimum code and data storage.
  • Page 64 3. TECHNICAL BRIEF Write Operation To perform a write operation, both CE# and WE# are asserted while RST# and OE# are deserted. All device write operations are asynchronous, with CLK being ignored. During a write operation, address and data are latched on the rising edge of WE # or CE#, whichever occurs first. Output Disable When OE# is deserted, device outputs D[15:0] are disabled and placed in a high-Impedance (High-Z) state.

  • Page 65: Keypad Switches And Scanning

    3. TECHNICAL BRIEF 3.11 Keypad Switches and Scanning KEY MATRIX SIDE_KEY VBAT SW301 R308 KEY_ROW1_1 KEY_COL5 R102 POWERKEY VA302 EVLC18S02015 HOT1 SW302 KEY_ROW2_1 AUTO FOCUS KEY_ROW1_1 HOT2 SHOT KEY_ROW2_1 KEY_COL4_1 SW303 R125 SEND KEY_ROW3_1 KEY_ROW0 CN304 VA100 EVLC18S02015 HOT3 SW304 DOWN VOL_UP KEY_ROW1...
  • Page 66 3. TECHNICAL BRIEF Figure 3-32. Keypad I/F The KEYPAD I/F consists of a number of tri-state KEYPADCOL outputs and KEYPAD ROW inputs. It has been expanded to a full 8 by 8 matrix. This gives the possibility of up to 64 keys (with an additional 8 if a ghost column is used).

  • Page 67: Main Microphone

    3. TECHNICAL BRIEF 3.12 Main Microphone The microphone is placed to be contacted to KEYPAD PCB through FPCB. The audio signal is passed to AIN1P and AININ pins of AD6535. The voltage supply VMIC is output from AD6535, and is a biased voltage for the AIN1P. The AIN1P and AIN1N signals are then A/D converted by the voiceband ADC part of AD6535.

  • Page 68: Main Receiver

    3. TECHNICAL BRIEF 3.13 Main Receiver The receiver is placed to be contacted to SUB PCB through 80pins B to B Connector. Receiver is connected to AOUT1P/AOUT1N. AOUT1P/N”s output impedance is 32ohm. AIN3L AIN3R AIN2P AUX_MIC_P AIN2N AUX_MIC_N AIN1P MIC_IN+ AIN1N MIC_IN- NC_R12...

  • Page 69: Headset Interface

    3. TECHNICAL BRIEF 3.14 Headset Interface Headset connector has 12pins function, Differential Microphone input, Stereo Single-Ended Receiver Output and four function key buttons. Microphone input is connected to AIN2P/AIN2N and Stereo Output is connected to AOUT3L/AOUT3R. CN401 R409 KEY_COL2 (HOOK_DETECT) R410 KEY_COL3 (MP3_FF)

  • Page 70: Bluetooth(Lbma-2C67B2)

    3. TECHNICAL BRIEF 3.15 BLUETOOTH(LBMA-2C67B2) Bluetooth Module Features - Output power(Class2) : 1.0 dBm Typ. - Receiver Sensitivity : -83 dBm Max. - Dimensions : 6.9 * 7.9 * 1.5 (unit: mm) - Wide operating temperature range(Target) : -40 to85C (Storage: -40 to 100C) - D.C Supply voltage range : 1.8V or 3.0V(Nominal) - Interfaces : UART and SPI for data and PCM for voice - Stack layer : HCI or RFCOMM...

  • Page 71: Mini-Sd

    3. TECHNICAL BRIEF 3.16 Mini-SD Mini SD interface is connected to Main PCB and KEYPAD PCB through FPCB and B to B connector. Mini-SD interface supports 1 bit and 4bits interface. Maximum capacity is 1GByte. MINI SD CARD INTERFACE 2V8_SDPWR AXA19201106 S101 CD_DET_A...

  • Page 72: Flip Switch

    3. TECHNICAL BRIEF 3.17 FLIP SWITCH Flip switches operate 0 degree and 180 degree only. Flip switch output is open drain output so needs pull-up resistor. FLIP SWITCH 2V8_VEXT 2V8_VEXT 2V8_VEXT 2V8_VEXT U305 U306 EM-6681-T3 EM-6681-T3 (GPIO_5) (GPIO_6) SWING0 SWING1 C323 C324 VA301...

  • Page 73: Vibrator

    3. TECHNICAL BRIEF 3.18 VIBRATOR The vibrator is placed in the folder cover and connected to KEYPAD PCB through FPCB. The vibrator is driven from AD6527 by PWM. VBAT EVL5M02200 C322 VA300 MOTOR- R339 Q300 VIBRATOR 2SC5585 1.5K VIBRATOR Figure 3-39. 3.19 Audio CODEC The device integrates complete interfaces to stereo or mono microphones and a stereo headphone.

  • Page 74: Key Backlight

    3. TECHNICAL BRIEF 3.20 KEY backlight This phone has 21 backlight units. AD6527 controls backlights by PWM method. VBAT VBAT SIDEKEY LED (GPO_22) Q301 KEY_BACKLIGHT KRC402V KEY BACKLIGHT VBAT R103 R104 R105 R106 R107 R108 R109 R110 R111 R112 R113 R114 R115 R116...

  • Page 75: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component TEST POINT FL501 SW501 U502 U501 X501 U504 Figure 4-1. U501 Power Amp Module(SKY77328) U502 RF Main Chip (SI4210) U504 2.85V, 26MHz Clock X501 VCTXO, 26MHz Clock FL501 SW501 Mobile Switch Table 4-1.
  • Page 76 4. TROUBLE SHOOTING 4.1.1 RX Trouble CHECKING FLOW START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting (1) Check regulator circuit (2) Check VCTCXO (3) Check Mobile SW &FEM (4) Check RX IQ Redownload SW or...
  • Page 77 4. TROUBLE SHOOTING (1) Checking Regulator Circuit TEST POINT U504. 5 (OUT) U504 U504. 3(EN) Figure 4-3. CIRCUIT VBAT 2V85_RF U504 MIC5255-2.85BM5 CLKON C543 C544 C545 C546 C547 4.7u 0.01u Figure 4-4. CHECKING FLOW Voltage at Level at Change main board Pin5 of U502 Pin3 of U502 Is 2.85V?
  • Page 78 4. TROUBLE SHOOTING (2) Checking VCTCXO Circuit CHECKING FLOW TEST POINT X501.3 (OUT) VCTCXO Circuit is OK VCTCXO Circuit is OK Check Pin 3. 26 MHzO.K? See next Page to check See next Page to check Refer to Graph 4(b) Mobile SW Mobile SW Check Pin 4.
  • Page 79 4. TROUBLE SHOOTING (3) Checking Mobile SW & FEM TEST POINT VC_DCSPCS C522 SW501.RF FL501 SW501 VC_EGSM C528 SW501.ANT Figure 4-9. CIRCUIT WAVEFORM TP501 TP502 TP503 C516 R516 Graph 4-3. GSM Tx mode (GPO_11) ANT_SW2 C524 270p GND13 PCS_RX2 GND12 PCS_RX1 GND11 DCS_RX2...
  • Page 80 4. TROUBLE SHOOTING CHECKING FLOW For the test, TX Stand alone Mode is needed. Refer to chapter 11 (PL=7 for GSM, PL=2 for DCS) Check C522,C528 Check whether Ant SW Check VC_EGSM, Changing board Set as TX mode VC_DCSPCS Refer to Graph 5 Refer to Table 4-3 Check RF Level of Pin9 : ~29.5dBm...
  • Page 81 4. TROUBLE SHOOTING (4) Checking RX IQ TEST POINT WAVEFORM C523 U502 C526 Figure 4-12. Graph 4-5. CIRCUIT C520 C521 C522 0.1u 100p C523 XOUT C526 U502 SI4210D SDIO S_DATA (GPO_20) _SEN (GPO_19) S_EN (GPO_21) SCLK S_CLK Figure 4-13. CHECKING FLOW Check C523,C526.
  • Page 82 4. TROUBLE SHOOTING 4.1.2 TX Trouble CHECKING FLOW START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting (1)Check regulator circuit (2)Check VCTCXO (3)Check Mobile SW & FEM (4)Check PAM control signal (5)Check TX IQ...
  • Page 83 4. TROUBLE SHOOTING (1) Checking PAM Control Signal TEST POINT WAVEFORM R502(PAM_EN) U501 R515(TX_RAMP) Figure 4-16. Graph 4-6. CIRCUIT R502 (GPO_16) PA_EN C508 1000p RSVD_GND 3dB ATTEN ENABLE SKY77328 R507 GSM_OUT U501 GSM_IN DCS_PCS_OUT DCS_PCS_IN R508 R509 2dB ATTEN 2V8_VEXT R510 C513 C514...
  • Page 84 4. TROUBLE SHOOTING (2) Checking TX IQ TEST POINT WAVEFORM C523 U502 C526 Figure 4-19. Graph 4-7. CIRCUIT C520 C521 C522 0.1u 100p C523 XOUT C526 210D SDIO (GPO_20) S_DATA (GPO_19) _SEN S_EN (GPO 21) S CLK Figure 4-20. CIRCUIT Check if there is Any Major Difference Replace U101...

  • Page 85: Bt Trouble

    4. TROUBLE SHOOTING 4.2 BT Trouble TEST POINT DUBUG_RX R323 BT_EN M300 R311 DUBUG_TX R326 BT_RST C305 Figure 4-22. CIRCUIT DIAGRAM BLUETOOTH VBAT 2V8_VBT ANT300 R308 R342 FEED U300 VOUT BGND R311 (GPIO_2) BT_EN STBY BH28FB1WHFV C300 C301 C302 C303 2.2u 4.7u 0.1u...
  • Page 86 4. TROUBLE SHOOTING Checking Flow Is BT_RST signal shape similar Replace U101 to Fig.1 during Powering on Bluetooth Replace U101 2V8_VBT at C300=2.8V BT_EN at R311=2.8V Bluetooth Power off Replace U300 Is DEBUG_TX signal similar to Replace U101 Fig.2 during Powering on Bluetooth? Is DEBUG_RX signal similar to Replace M300...
  • Page 87 4. TROUBLE SHOOTING Graph 4-8. BLUE-RST Graph 4-9. DEBUG_TX,RX Graph 4-10. PCM_SYNCS,TX,RX,USC0 - 88 -...

  • Page 88: Power On Trouble

    4. TROUBLE SHOOTING 4.3 Power On Trouble TEST POINT C126 C122 (2V8_VEXT) (2V75_VVCXO) U100 U101 C120 (2V75_VABB) C116 C121 (1V8_VCORE) (2V5_VMIC) C117 C119 (2V8_VMEM) (2V85_VSIM) Figure 4-25. CIRCUIT R100 C116 VCORE1 VCORE2 C117 VMEM1 VMEM2 C118 0.1u VRTC C119 VSIM C120 2.2u (1608)
  • Page 89 4. TROUBLE SHOOTING CHECKING FLOW START Check Battery Voltage Charge or Change Battery > 3.35V Push power-on key Check the contact of power key And check the level change Or dome-switch of PWRKEY Check the voltage of Replace U100 The LDO outputs at U100 VCORE=1.8V VVCXO=2.75V VMEM=2.8V...

  • Page 90: Charging Trouble

    4. TROUBLE SHOOTING 4.4 Charging Trouble TEST POINT R216 U206 D201 Figure 4-28. CIRCUIT Charging IC VCHARGE VBAT 2V8_VEXT D201 CUS02 VUSBIN VUSBIN U206 ISL6299 CRDL IMIN _PPR (GPIO_16) _CHG CHG_STAT ICDL USBON R215 (GPIO_0) CHG_EN PGND C236 C237 C238 C239 (1%) Figure 4-29.
  • Page 91 4. TROUBLE SHOOTING Checking Flow START Resolder the CN300 I/O Connector(CN300) Pin 4,5 : VCHARGE Is well-soldered ? Pin12,19,26 : GND The TA is out of order Voltage at anode of Change the TA D200 = 5.2V ? Resolder the D200, U205 are D200,U205 well-soldered?

  • Page 92: Vibrator Trouble

    4. TROUBLE SHOOTING 4.5 Vibrator Trouble TEST POINT R339 Q300 CN103 Figure 4-31. Figure 4-32. CIRCUIT VBAT EVL5M02200 C322 VA300 VBAT MOTOR- CN103 MOTOR- R339 Q300 VIBRATOR 2SC5585 1.5K VIBRATOR Figure 4-33. - 93 -...
  • Page 93 4. TROUBLE SHOOTING CHECKING FLOW SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu START Is the voltage at pin 2 Check the soldering of Q300 high ? of R339, R340 Resolder R339, R340 Is the voltage at pin 2 Check the soldering of D300 = VBAT ?

  • Page 94: Sim Card Trouble

    4. TROUBLE SHOOTING 4.6 SIM Card Trouble TEST POINT J300 Figure 4-35. CIRCUIT SIM CONNECTOR 2V85_VSIM 2V85_VSIM 2V85_VSIM J300 R337 GND1 SIM_RST (GPIO_23) SIM_DATA SIM_CLK GND5 GND2 C326 GND4 GND3 C325 C327 C328 220n 1000p Figure 4-36. - 95 -...
  • Page 95 4. TROUBLE SHOOTING Checking Flow START Change the SIM Card. Our phone Does the SIM cards supports only 3V SIM card. supports 3V ? Voltage output Voltage at pin1 of Resolder J300 of VSIM LDO J300 is 2.85V? Is 2.85V? Replace J300 Change the SIM Card Redownload SW.

  • Page 96: Key Backlight Trouble

    4. TROUBLE SHOOTING 4.7 KEY backlight Trouble TEST POINT R122 Q101 Q101 Figure 4-39. LD101~LD119 Figure 4-38. - 97 -...
  • Page 97 4. TROUBLE SHOOTING CIRCUIT KEY BACKLIGHT VBAT R103 R104 R105 R106 R107 R108 R109 R110 R111 R112 R113 R114 R115 R116 R117 R118 R119 R120 R121 R122 Q101 KEY_BACKLIGHT UMT2222A 4.7K R123 4.7K Figure 4-40. CHECKING FLOW START Is the level at R122 Check U101(Main board) High? Are all LEDs...

  • Page 98: Side Key Backlight Trouble (Sub Board)

    4. TROUBLE SHOOTING 4.8 Side KEY backlight Trouble (SUB board) TEST POINT Q301 LD302 LD301 Figure 4-42. CIRCUIT VBAT VBAT SIDEKEY LED (GPO_22) Q301 KEY_BACKLIGHT KRC402V Figure 4-43. - 99 -...
  • Page 99 4. TROUBLE SHOOTING CHECKING FLOW START Is the level at Check U101(Main board) Pin2 of Q301 High? Are all LEDs Check the soldering Working? each R and LED R302~R303 LD301~LD302 Replace or resoldering Backlight will work properly. component Figure 4-44. - 100 -...

  • Page 100: Rtc Trouble

    4. TROUBLE SHOOTING 4.9 RTC Trouble TEST POINT X100 U101 R106 Figure 4-45. CIRCUIT GPCS1 NGPCS1 MIDI_CS NAUXCS1 MM_CS MM_CS GPIO_42_NMAIN_LCD_CS M3M_CS M3M_CS GPIO_43_NSUB_LCD_CS C135 1000p C134 26MHZ CLKIN MC-146_7pFX100 CLKON CLKON OSCOUT OSCIN PWRON PWRON _RESET NRESET 32.768KHz C136 CHG_EN GPIO_0_IRDA_TX MM_RESET...
  • Page 101 4. TROUBLE SHOOTING CHECKING FLOW START Is the voltage level at R106 Check the soldering of R106. about 1.2V Replace X100 and try again. RTC will work properly Figure 4-47. - 102 -...

  • Page 102: Swivel Trouble

    4. TROUBLE SHOOTING 4.10 Swivel Trouble TEST POINT U306 U305 Figure 4-48. Figure 4-49. CIRCUIT FLIP SWITCH 2V8_VEXT 2V8_VEXT 2V8_VEXT 2V8_VEXT U305 U306 EM-6681-T3 EM-6681-T3 (GPIO_5) (GPIO_6) SWING0 SWING1 C323 C324 VA301 VA303 0.01u 0.01u EVL5M02200 EVL5M02200 SWING0 SWING1 HIGH HIGH Figure 4-50.
  • Page 103 4. TROUBLE SHOOTING CHECKING FLOW START Is there the magnet Place the magnet properly. in the KEY ASSíY? Voltage at pin 3 Voltage of VEXT at U100 of U305 = 2.8V ? = 2.8V? Resolder U305 Replace U100 Voltage at pin 3 Replace U306 of U306 = GND ? Swivel,...

  • Page 104: Lcd Trouble

    4. TROUBLE SHOOTING 4.11 LCD Trouble TEST POINT FL404 FL403 FL401 FL402 FL400 CN 400 Figure 4-52. LCD Module connection 35Pin LCD Module Figure 4-53. - 105 -...

  • Page 105: Lcd Interface

    4. TROUBLE SHOOTING CIRCUIT LCD INTERFACE (GPIO_15) R417 LCD_RESET C411 0.1u CN400 2V8_MM R418 LCD_IFMODE 100K ICVE10184E070R101FR R416 LCD_VSYNC LCD_CS INOUT_A1 INOUT_B1 LCD_RS INOUT_A2 INOUT_B2 LCD_WR INOUT_A3 INOUT_B3 LCD_RD INOUT_A4 INOUT_B4 (100ohm,7.5pF) ICVE10184E070R101FR (100ohm,7.5pF) FL404 L_DATA00 INOUT_B1 INOUT_A1 INOUT_B2 INOUT_A2 L_DATA01 ICVE10184E070R101FR INOUT_B3...
  • Page 106 4. TROUBLE SHOOTING CHECKING FLOW START Is the connection of FPCB with connector on Reassemble FPCB with CN300 connector PCB(CN300) ok ? Check the soldering of Resoldering CN300 CN300 ? Check the soldering of Resoldering EMI filter(FL400~FL404) EMI filter ? Does LCD work Replace LCD module properly ?

  • Page 107: Camera Trouble

    4. TROUBLE SHOOTING 4.12 Camera Trouble TEST POINT Camera Sensor Camera Lens Connector Connector ( 30Pin, Female ) ( 20Pin, Female ) CON200 CON100 Figure 4-57. Camera Sensor Connector ( 30Pin, male ) Camera Lens Connector 20Pin, Female ) Camera Sensor Figure 4-58.
  • Page 108 4. TROUBLE SHOOTING CIRCUIT Figure 4-59. Figure 4-60. WAVEFORM Figure ? Graph 4-11. - 109 -...
  • Page 109 4. TROUBLE SHOOTING TEST POINT U602 FB602 Figure 4-61. C113 U100 C114 Q100 Q101 Figure 4-62. - 110 -...
  • Page 110 4. TROUBLE SHOOTING CIRCUIT 2V8_VEXT 2V8_M3M 2V8_MM VBAT MIC5219-2.8YML U603 FB602 FB603 PGND C616 C617 C618 C614 C615 C619 4.7u 470p Figure 4-63. M3MOM POWER SUPPLY Change To MIC2211-NSYML 3V3_M3M VBAT 2V8_CAM U100 MIC2211-MSYML VOUT1 (SLPH3) CAM_PWREN VOUT2 (SLPH4) 3V3_M3M_PWREN C113 C114 BGND...
  • Page 111 4. TROUBLE SHOOTING TEST POINT C137 C102 U103 C113 U101 Figure 4-66. Figure 4-65. WAVEFORM Graph 4-12. - 112 -...
  • Page 112 4. TROUBLE SHOOTING CIRCUIT Figure 4-67. Figure 4-68. - 113 -...
  • Page 113 4. TROUBLE SHOOTING TEST POINT CON201 VD_OUT C116 HD_OUT U102 Figure 4-69. SUB PCB to Camera FPCB Connector ( 50Pin, male ) CAM_Hsync (R130) U200 CAM_Vsync (R129) U101 Camera PCB to Camera FPCB CN301 Connector ( 50Pin, male ) Figure 4-71. Figure 4-70.
  • Page 114 4. TROUBLE SHOOTING CIRCUIT Figure 4-72. R111 (1%) VCOUT VCYOUT VCVREF R113 2.7K VCVR0 VCAVD1 (1%) C105 (1%) VCAVD2 0.1u VCAVS1 VCAVS2 R129 VLVD CAM_VSYNC R130 VLHD CAM_HSYNC VLCLK CAM_PCLK CAM_DATA0 VLDATA0 CAM_DATA0 VLDATA1 CAM_DATA1 VLDATA2 CAM_DATA2 VLDATA3 CAM_DATA3 VLDATA4 CAM_DATA4 VLDATA5 CAM_DATA5...
  • Page 115 4. TROUBLE SHOOTING WAVEFORM Graph 4-13. - 116 -...
  • Page 116 4. TROUBLE SHOOTING CHECKING FLOW START Does the LCD itself Go to the LCD trouble Has no trouble ? Is the connection of CCD Sensor FPCB Reassemble CCD Sensor FPCB with With Connector on PCB CON100, CON200 connector (CON100,CON200) Check the Soldering of Resoldering CON100, CON200 connector CON100,CON200 Check the Voltage...
  • Page 117 4. TROUBLE SHOOTING CHECKING FLOW Prior Page Check the Voltage Replace the U103 or Of U103 on Camera PCB Check the signal of 1 Pin,3 Pin at U103 Is +3.3V ? Check the Signal is Right Change the Camera Sensor module CCD_OUT Signal ? Is the connection Of Camera FPCB...
  • Page 118 4. TROUBLE SHOOTING CHECKING FLOW Prior Page Check the signal is right CAM_Vsync, CAM_Hsync, Change the SUB PCB CAM_PCLK, CAM_DATA0 Signal ? Does LCD work Replace LCD module Properly ? Camera will work properly Figure 4-76. - 119 -...

  • Page 119: Speaker Trouble

    4. TROUBLE SHOOTING 4.13 Speaker Trouble TEST POINT Connect to CN700 U201 U603 U204 U700 L401 Connect to L402 U404 CN102(Key) U405 U401 Figure 4-79. U403 CN102(Key) Figure 4-77. Figure 4-78. CIRCUIT AUDIO_CODEC 64POLY MIDI VBAT 1V8_MIDI 2V8_MIDI 2V8_MM 2V8_VEXT R220 R221 120p...
  • Page 120 4. TROUBLE SHOOTING CHECKING FLOW MP3 Trouble MIDI Trouble Play MP3 Play MIDI Re-Place U602 Check the voltage level Re-Place Check the voltage level of U200.9 = 2.8V?, or Re-solder U200 of U602.4 = 2.8V?, U200.10 = 1.8V? FB603 Re-solder Re-solder Check the Signal of Check the solder...

  • Page 121: Headphone Trouble

    4. TROUBLE SHOOTING 4.14 Headphone Trouble TEST POINT U404 U405 U403 C401 U100 Figure 4-82. Figure 4-83. Figure 4-84. CIRCUIT 2V5_VMIC 2V8_VMEM C401 C402 CN401 R404 AUX_MIC_P C403 0.1u R405 AUX_MIC_N R406 R408 R431 JACK_DETECT (GPIO_9) R409 KEY_COL2 (HOOK_DETECT) R410 C406 C407 C408...
  • Page 122 4. TROUBLE SHOOTING CHECKING FLOW START Does the audio profile of the phone Re-solder CN400 or Change Check the voltage Level change to the another Ear-Mic set and Try again CN400.7 = Low? earphone mode? Replace U100 or Change Board Earphone Go to Key Go to MIC...

  • Page 123: Receiver Trouble

    4. TROUBLE SHOOTING 4.15 Receiver Trouble TEST POINT R109 R111 R304(Sub) CN303(Sub) R305(Sub) U100 Figure 4-88. Figure 4-87. CN302(Sub) CN601 Figure 4-89. Figure 4-90. CIRCUIT R109 AOUT1P RCV_P RECEIVER CONNECTOR AOUT1N C144 AOUT2P1 SPK_P_SM R111 AOUT2P2 RCV_N AOUT2N1 C145 C146 AOUT2N2 CN303 AOUT3L...
  • Page 124 4. TROUBLE SHOOTING CHECKING FLOW SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max. START Does waveform at Replace U100 or Change the board U100.J15 and U100.K15 fluctuate? Does waveform at...

  • Page 125: Microphone Trouble

    4. TROUBLE SHOOTING 4.16 Microphone Trouble TEST POINT Connect to CN700 CN101(Key) U100 Components Connect to CN101(Key) MIC1(Key) CN700 Figure 4-93. CIRCUIT 2V5_VMIC MAIN MICROPHONE AIN3L AIN3R C416 C413 AIN2P AUX_MIC_P AIN2N AUX_MIC_N R422 R423 AIN1P MIC_IN+ MIC_IN+ MIC_P AIN1N MIC_IN- NC_R12 C420...
  • Page 126 4. TROUBLE SHOOTING CHECKING FLOW SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Put the sound source near The MIC. And Connect the Mobile. START Voltage VMIC of U100 Replace U100 or Change the board = DC 2.5V? Check the Solder condition of R416 and Re-solder or replace the Component...

  • Page 127: Download And Calibration

    5. DOWNLOAD AND CALIBRATION 5. DOWNLOAD AND CALIBRATION 5.1 Download A. Download Setup Figure 5-1 describes Download setup UART (If you have battery, no TA is needed) Figure 5-1. Download Setup - 128 -...
  • Page 128 5. DOWNLOAD AND CALIBRATION 5.1.1 Download Step [1] Figure 5-2. Download Program : Start or Stop download : Selected configuration DLL file : File name donwloading File(F) → Exit(X) : End program Setting(S) → Configuration : configuration download condition DLL, SW files and etc.
  • Page 129 5. DOWNLOAD AND CALIBRATION 5.1.2 Download Step [2] C:/GSMMULTI/Model/DLL/KG920_xxxxxx.dll Figure 5-3. : Select a appropriate DLL file Select KG920_xxxxxx.DLL : Select configuration file You must select cmd.m0 file : Select download speed You must 460800. System supports maximum 460800bps. : Select port select ports operated : Select DBB You must Hermes.
  • Page 130 5. DOWNLOAD AND CALIBRATION 5.1.3 Download Step [3] Figure 5-4. : Select files downloaded KG920 has 3 mot files, 1 CodeData and 2 AlchemyData. Files must be mot files. - 131 -...
  • Page 131 5. DOWNLOAD AND CALIBRATION 5.1.4 Download Step [4] Figure 5-5. : Start or Stop download next step. Once download has started, then push Stop button. Otherwise, program will download repeatedly. Turn on power of multi download and connector phones. If download is started, then push start button else program will download repeatly - 132 -...
  • Page 132 5. DOWNLOAD AND CALIBRATION 5.1.5 Download Step [5] Figure 5-6. : This region shows download status If download is succeded, PASS else FAIL. - 133 -...

  • Page 133: Calibration

    5. DOWNLOAD AND CALIBRATION 5.2 Calibration A. Equipment List Table 5-1. Calibration Equipment List. Equipment for Calibration Type / Model Brand Wireless Communication Test Set HP-8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply HP-66311B Agilent GPIO interface card HP-GPIB Agilent Calibration &...
  • Page 134 5. DOWNLOAD AND CALIBRATION JTAG2 JTAG1 Status ADI-REMOTE TI-REMOTE POWER VBAT UART Status POWER Figure 5-8 The top view of Test JIG C. Test Jig Operation Table 5-2. Jig Power Power Source Description Power Supply Usually 4.0V Travel Adaptor Use TA, name is TA-20G(24pin) Table 5-3.
  • Page 135 5. DOWNLOAD AND CALIBRATION Table 5-4. LED Description LED Number Name Description LED 1 Power Power is provided for Test Jig LED 2 Indicate charging state of the phone battery LED 3 UART Indicate data transfer state through the UART port LED 4 Indicate data transfer state through the MON port 1.
  • Page 136 5. DOWNLOAD AND CALIBRATION 5.2.1 Calibration Step[1] KG920 KG920 KG920 Figure 5-9. : Selection Model : Apply model configuraion : Start calibration - 137 -...
  • Page 137 5. DOWNLOAD AND CALIBRATION 5.2.2 Calibration Step[2] KG920 Figure 5-10. : Selection RF cable loss : Selection COM port(Use Uart port for calibration) : Start calibration : Exit program - 138 -...
  • Page 138 5. DOWNLOAD AND CALIBRATION 5.2.3 Calibration Step[3] KG920 KG920 Figure 5-11. Shows calibration status, if calibration successes, shows PASS else FAIL. - 139 -...

  • Page 139: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM Figure 6-1. - 140 -...

  • Page 140: Circuit Diagram

    KEY_COL2 KEYPADCOL2 USC4 USC4 Approved UART BOOT KEY_COL3 KEYPADCOL3 USC5 USC5 USB BOOT INT CLOCK KEY_COL4 KEYPADCOL4 USC6 USC6 USB BOOT EXT CLOCK DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 141 -...
  • Page 141 C237 C238 C239 (1%) Section Date Sign & Name Sheet/Sheets MODEL KG920(MAIN) 2006/ Designer SANG KYU SONG 03/11 Checked DRAWING MEMORY/MIDI NAME Approved DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 142 -...
  • Page 142 VIBRATOR HIGH HIGH Section Date Sign & Name Sheet/Sheets MODEL 2006/ KG920(MAIN) Designer SANG KYU SONG 03/11 Checked DRAWING BLUETOOTH/IO CONNECTOR NAME Approved DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LG Electronics Inc. LGIC(42)-A-5505-10:01 - 143 -...
  • Page 143 C431 C432 C433 Section Date Sign & Name Sheet/Sheets MODEL KG920(MAIN) 2006/ Designer SANG KYU SONG 03/11 Checked DRAWING AUDIO PART NAME Approved DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 144 -...
  • Page 144 C551 C552 C553 2.2u Section Date Sign & Name Sheet/Sheets MODEL KG920(MAIN) 2006/ Designer H. LEE 03/11 Checked DRAWING RF PART NAME Approved DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LG Electronics Inc. LGIC(42)-A-5505-10:01 - 145 -...
  • Page 145 C636 C635 C637 C638 4.7u 0.01u Section Date Sign & Name Sheet/Sheets MODEL KG920(MAIN) 2006/ Designer SANG JO RYU 03/11 Checked DRAWING MV8620, AUDIO CODEC NAME Approved DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. - 146 -...
  • Page 146 C709 100K 100K Section Date Sign & Name Sheet/Sheets MODEL KG920(MAIN) 2006/ Designer SNAG JO RYU 03/11 Checked DRAWING CONNECTOR, LDO NAME Approved DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 147 -...
  • Page 147 3V3_M3M C122 C123 C124 C125 4.7u 4.7u Section Date Sign & Name Sheet/Sheets MODEL KG920(SUB) 2006/ Designer SANG JO RYU 03/11 Checked DRAWING M3M SIP NAME Approved DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. - 148 -...

  • Page 148: Pcb Layout

    8. PCB LAYOUT - 149 -...
  • Page 149 8. PCB LAYOUT - 150 -...
  • Page 150 8. PCB LAYOUT - 151 -...
  • Page 151 8. PCB LAYOUT - 152 -...
  • Page 152 8. PCB LAYOUT - 153 -...
  • Page 153 8. PCB LAYOUT - 154 -...
  • Page 154 8. PCB LAYOUT - 155 -...
  • Page 155 8. PCB LAYOUT - 156 -...

  • Page 156: Engineering Mode

    9. ENGINEERING MODE 9. ENGINEERING MODE 9.1 About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. 9.2 Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.

  • Page 157: Bb Test [Menu 1]

    9. ENGINEERING MODE MF mode UART on Call timer All calls UART off Reset Bluetooth on Bluetooth off Factory reset S/W version MM S/W Download 9.5 BB Test [MENU 1] 9.5.1 LCD This menu is to test LCD status and displayes WHITE, RED, GREEN, BLUE, BLACK 9.5.2 CAMERA This menu is to test the Camera function.
  • Page 158 9. ENGINEERING MODE 9.5.4 Buzzer This menu is to test the melody sound. 1) Melody on : Melody sound is played through the speaker. 2) Melody off : Melody sound is off. 9.5.5 Vibrator This menu is to test the vibration mode. 1) Vibrator on : Vibration mode is on.

  • Page 159: Rf Test [Menu 2]

    9. ENGINEERING MODE 9.5.9 DAI (Digital Audio Interface) This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing. 1) DAI AUDIO : DAI audio mode 2) DAI UPLINK : Speech encoder test 3) DAI DOWNLINK : Speech decoder test 4) DAI OFF : DAI mode off 9.5.10 Bluetooth This menu is to test Bluetooth.

  • Page 160: Trace Option [Menu 4]

    9. ENGINEERING MODE 9.7.3 Buzzer This menu is to test the volume of Melody. It rings in the following sequence. Volume 1, Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5. 9.7.4 Vibrator Vibrator is on for about 1.5 seconds. 9.7.5 LCD Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.

  • Page 161: Fact. Reset [Menu 6]

    9. ENGINEERING MODE 9.10 Fact. Reset [MENU 6] This Factory Reset menu is to format data block in the flash memory and this procedure set up the default value in data block. Attention 1 Fact. Reset (i.e.Factory Reset) should be only used during the Manufacturing process. 2 Servicemen should NOT progress this menu, otherwise some of valuable data such as Setting value, RF Calibration data, etc.

  • Page 162: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW 60 62 - 163 -...
  • Page 163 - 164 -...

  • Page 164: Replacement Parts

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Note: This Chapter is used for reference, Part order <Mechanic component> is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark GSM,BAR/FILP TGSM0042001 Titanium AAAY00 ADDITION AAAY0148501 Titanium...
  • Page 165 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MTAB01 TAPE,PROTECTION MTAB0076401 4.0:1 ,-2.7 dBd, ,GSM900/DCS1800/PCS1900 INTERNAL SNGF00 ANTENNA,GSM,FIXED SNGF0013001 Type Pb-Free ACGT00 COVER ASSY,UPPER ACGT0000101 Silver MCCG00 CAP,MULTIMEDIA CARD MCCG0001101 Silver MCJX00 COVER,UPPER MCJX0000101 Silver MDAY00...
  • Page 166 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark AFBA01 FRAME ASSY,SHIELD AFBA0002501 Gray MFEA00 FRAME,SHIELD MFEA0006101 Silver MGAZ00 GASKET MGAZ0010701 Black MPBH00 PAD,MIKE MPBH0013801 MPBT00 PAD,CAMERA MPBT0014301 MPBZ00 MPBZ0082201 Black AHFA00 HINGE ASSY,FOLDER AHFA0001601 Soft Gray GMEY00...

  • Page 167: Main Component

    12. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0030401 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0026301 PCB ASSY,FLEXIBLE,SMT SACC00...
  • Page 168 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R102 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R122 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R123 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R124 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R125 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP S101 CONN,SOCKET ENSY0012901...
  • Page 169 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R109 RES,CHIP ERHY0000231 390 ohm,1/16W,J,1005,R/TP R110 RES,CHIP ERHY0000231 390 ohm,1/16W,J,1005,R/TP R111 RES,CHIP ERHY0000231 390 ohm,1/16W,J,1005,R/TP R112 RES,CHIP ERHY0000231 390 ohm,1/16W,J,1005,R/TP R113 RES,CHIP ERHY0000231 390 ohm,1/16W,J,1005,R/TP R114 RES,CHIP ERHY0000231...
  • Page 170 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C139 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP C140 CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP C150 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C151 CAP,CHIP,MAKER ECZH0000830...
  • Page 171 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R107 RES,CHIP,MAKER ERHZ0000316 750 Kohm,1/16W ,F ,1005 ,R/TP R108 RES,CHIP,MAKER ERHZ0000721 22 ohm,1/10W ,J ,1608 ,R/TP R109 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP R112 RES,CHIP,MAKER ERHZ0000416 1300 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 172 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C125 CAP,TANTAL,CHIP ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP C127 CAP,TANTAL,CHIP ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP C131 CAP,CERAMIC,CHIP ECCH0002001 100000 pF,6.3V ,K ,B ,HD ,1005 ,R/TP C132 CAP,CERAMIC,CHIP ECCH0002001...
  • Page 173 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark U102 EUSY0230301 U103 EUSY0075602 SOT-23 ,5 PIN,R/TP ,LDO, Pb-free,3.2V,150mA U200 EUSY0236501 QFN-16 ,16 PIN,R/TP ,QUAD BUS BUFFER U201 EUSY0236101 27 MHz,50 PPM,15 pF,SMD ,3.2*2.5*1.05 ,2.7V ~ 3.6V, - X100 OSCILLATOR EXSY0020902...
  • Page 174 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C230 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C231 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C232 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C233 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 175 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C421 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C423 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C425 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C426 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C434 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 176 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C537 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C538 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C539 CAP,CHIP,MAKER ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C540 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 177 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L502 INDUCTOR,CHIP ELCH0005010 1.8 nH,S ,1005 ,R/TP , L503 INDUCTOR,CHIP ELCH0005014 5.6 nH,S ,1005 ,R/TP , L504 INDUCTOR,CHIP ELCH0005015 6.8 nH,S ,1005 ,R/TP , L505 INDUCTOR,CHIP ELCH0005005 27 nH,J ,1005 ,R/TP ,...
  • Page 178 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R334 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R336 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R337 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP R338 RES,CHIP,MAKER ERHZ0000757 15 ohm,1/10W ,J ,1608 ,R/TP R339 RES,CHIP ERHY0000244 1.5K ohm,1/16W,J,1005,R/TP R340...
  • Page 179 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R700 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R701 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R702 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R703 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R704 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R705 RES,CHIP ERHY0000280...
  • Page 180 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C104 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP C105 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP C106 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP C107 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 181 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C143 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C144 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C145 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C146 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C147 CAP,CERAMIC,CHIP ECCH0000120...
  • Page 182 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C237 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C238 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C239 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C309 CAP,CERAMIC,CHIP ECCH0000120...
  • Page 183 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C615 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP C616 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C617 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C618 CAP,CHIP,MAKER ECZH0001121...
  • Page 184 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FL300 FILTER,EMI/POWER SFEY0007101 SMD ,1CH,1608Feedthru ESD/EMI filter for power Pb-free L401 INDUCTOR,CHIP ELCH0001303 33 uH,K,2012,R/TP L402 INDUCTOR,CHIP ELCH0001303 33 uH,K,2012,R/TP L601 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , L602 INDUCTOR,SMD,POWER ELCP0008001...
  • Page 185 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R220 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R221 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R222 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R325 RES,CHIP ERHY0000269 30K ohm,1/16W,J,1005,R/TP R328 RES,CHIP ERHY0000269 30K ohm,1/16W,J,1005,R/TP R335 RES,CHIP ERHY0000280...
  • Page 186 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R706 RES,CHIP ERHY0000247 2.2K ohm,1/16W,J,1005,R/TP R707 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP R708 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R710 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R711 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R712 RES,CHIP ERHY0000201...
  • Page 187 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark U603 EUSY0045309 MLF ,6 PIN,R/TP ,2.8V/500mA LDO U700 EUSY0186201 32-Pin QFN(5x5) ,32 PIN,R/TP ,Stereo CODEC VA301 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 VA401 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 VA404...
  • Page 188 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MAIN ,240*320 ,37.5*53.5*3.15 ,262k ,TFT ,TM SVLY00 SVLY0026301 ,uPD161964, uPD161802 , SAJE00 PCB ASSY,SUB,SMT SAJE0010401 PCB ASSY,SUB,SMT SAJC00 SAJC0009601 BOTTOM C100 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C101 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 189 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C203 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C204 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C205 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C206 CAP,TANTAL,CHIP,MAKER ECTZ0005201...
  • Page 190 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark SOT-323 ,.29 W,1.8 V,.86 A,R/TP ,P-Chanel MOSFET, Pb Q100 TR,FET,P-CHANNEL EQFP0004501 free SOT-323 ,.29 W,1.8 V,.86 A,R/TP ,P-Chanel MOSFET, Pb Q101 TR,FET,P-CHANNEL EQFP0004501 free VSM ,100 mW,R/TP ,EPITAXIAL PLANAR NPN Q301 TR,BJT,NPN EQBN0012402...
  • Page 191 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R216 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R217 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R218 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R220 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R221 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R222 RES,CHIP ERHY0000280...
  • Page 192 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA303 VARISTOR SEVY0003801 18 V, ,SMD , VA306 VARISTOR SEVY0003801 18 V, ,SMD , VA307 VARISTOR SEVY0003801 18 V, ,SMD , VA308 VARISTOR SEVY0003801 18 V, ,SMD , 27 MHz,50 PPM,15 pF,SMD ,3.2*2.5*1.05 ,2.7V ~ 3.6V, - X100 OSCILLATOR...

  • Page 193: Accessory

    CASE MCEZ0001201 SD Card Case MHBY00 HANDSTRAP MHBY0002907 Leo Handstrap Export MLAA00 LABEL,APPROVAL MLAA0035501 KG920_LABEL,APPROVAL (RUS) White 3.7 V,850 mAh,2 CELL,PRISMATIC ,KG920 BATT, H/P, Pb- SBPL00 BATTERY PACK,LI-ION SBPL0081701 Titanium Free SGCD00 CHARGER,DESKTOP SGCD0026201 BC-800N ,Battery Charger SGDY00 DATA CABLE...
  • Page 194 Note...
  • Page 195 Note...

Table of Contents