Sony HCD-DZ7260 Service Manual page 31

Q Q
3 7 6 3 1 5 1 5 0
• Circuit Boards Location
IO-SCART board (DZ260)
IO-COMPONENT board (DZ270/HDZ278)
MS-203 board
P-SW board
FL board
JACK board
T E
L 1 3 9 4 2 2 9 6 5 1 3
w w w
HCD-DZ260/DZ270/HDZ278
• Waveforms
– MAIN Board –
SPEAKER board
MAIN board
POWER board
x a o
y
. i
http://www.xiaoyu163.com
IC1101 (DVDRFIP) IC1101
27MHz
650mVp-p
200 mV/DIV, 100 ns/DIV 500 mV/DIV, 20 ns/DIV
IC1101 (R/Cr/Pr) IC501 (Xout)
5MHz
0.72Vp-p
H
500 mV/DIV, 20 μs/DIV 1 V/DIV, 100 ns/DIV
IC1101 (B/Cb/Pb) IC702 (XOUT (O))
0.72Vp-p
12.288MHz
Q Q
H
3 7 6
500 mV/DIV, 20 μs/DIV 1 V/DIV, 20 ns/DIV
IC1101 (Y/G) IC3010
1Vp-p
H
49.1MHz
1 V/DIV, 20 μs/DIV
1 V/DIV, 10 ns/DIV
IC1101 (C) IC3010
1Vp-p
H
49.1MHz
1 V/DIV, 20 μs/DIV
1 V/DIV, 10 ns/DIV
IC1101 (Y) IC3051
1Vp-p
u 1 6 3
H
49.1MHz
1 V/DIV, 20 μs/DIV 1 V/DIV, 10 ns/DIV
31 31
2 4
8 9 9
– IO-SCART Board (DZ260) –
(XTALO) IC400 (Cin)
H
1.6Vp-p
1 V/DIV, 20 μs/DIV
IC400 (Yin)
3.4Vp-p
H
1 V/DIV, 20 μs/DIV
IC400 (CVin)
4Vp-p
H
3 1 5 1 5 0 8 9
1 V/DIV, 20 μs/DIV
(XFSOOUT) IC400 (Cbin)
4.3Vp-p
H
500 mV/DIV, 20 μs/DIV
(XFSOIN) IC400 (Crin)
4.3Vp-p
H
500 mV/DIV, 20 μs/DIV
(3Y) IC400 (CVBSout)
m
c o
4.3Vp-p
H
.
500 mV/DIV, 20 μs/DIV
HCD-DZ260/DZ270/HDZ278
2
8 9 9
– IO-COMPONENT Board
(DZ270/HDZ278) –
IC404 (Cr OUT)
1Vp-p
1Vp-p
H
500 mV/DIV, 20 μs/DIV
IC404 (Cb OUT)
1Vp-p
1Vp-p
H
500 mV/DIV, 20 μs/DIV
IC404 (CY OUT)
1Vp-p
1Vp-p
2 4 9 8 2 9 9
H
500 mV/DIV, 20 μs/DIV
0.72Vp-p
0.72Vp-p
1.3Vp-p