Sony NW-A1000 Service Manual page 23

• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: internal component.
f
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN board is multi-layer printed board.
However, the patterns of intermediate-layer have not been
included in diagram.
* Replacement of IC3101, 5001, 6005, 7001, 8001 and
9001 used in this set requires a special tool.
• Lead Layouts
surface
Lead layout of conventional IC CSP (chip size package)
NW-A1000
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
•
: internal component.
f
• C : panel designation.
Note: Note:
The components identi- Les composants identifiés par
fied by mark 0 or dotted une marque 0 sont critiques
line with mark 0 are criti- pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part pièce por tant le numéro
number specified.
spécifié.
• A : B+ Line.
• Power voltage is dc 4.2 V and fed with regulated dc power
supply from TP9001 and TP9002 on the MAIN board.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
* Replacement of IC3101, 5001, 6005, 7001, 8001 and
9001 used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
• Waveforms
X6001
1 7
2.3 Vp-p
44.3 ns
1 V/DIV, 20 ns/DIV
IC4101 8 (OSCOUT)
2
1.1 Vp-p
30.5 µ s
500 mV/DIV, 10 µ s/DIV
X3101
3
3.6 Vp-p
44.3 ns
2 V/DIV, 20 ns/DIV
IC3002 2 (BCK)
4
3.4 Vp-p
326 ns
2 V/DIV, 100 ns/DIV
IC3002 qh (SCKI)
5
4.3 Vp-p
89 ns
2 V/DIV, 50 ns/DIV
IC3002 w; (LRCK)
6
3.5 Vp-p
22.8 µ s
2 V/DIV, 10 µ s/DIV
23 23
X5001
2.8 Vp-p
89 ns
1 V/DIV, 50 ns/DIV
NW-A1000