Philips A02E Service Manual page 61

EN 92 9.
9. Circuit Descriptions, Abbreviation List, and IC Data Sheets
Index of this chapter:
1. Introduction
2. Block diagrams
3. Power supply
4. Video
5. Synchronisation
6. Audio
7. Control
8. Protections
9. Software upgrading
10. Abbreviation list
•
Only new circuits (circuits that are not published recently)
are described.
•
For the "known" LSP circuits, see the EM5E manual. This
manual is available under number 3122 785 12560 (=
English).
•
Figures can deviate slightly from the actual situation, due
to different set executions.
•
For a good understanding of the following circuit
descriptions, please use the diagrams in chapter 6 and 7.
Where necessary, you will find a separate drawing for
clarification.
9.1
Introduction
The A02 is intended as the Mainstream TV platform for the
years 2003 and 2004 and successor to the A10. Covering three
ranges (Digital Ready, Digital Prepared, and Digital Integrated)
with screen sizes of 28 inch WS to 36 inch WS RF (16:9) and
29 inch to 38 inch RF (4:3). The platform supports 50 Hz, 100
Hz, and progressive scan.
It is based on the SALSA system (System Application for Lower
Segment Analogue television), which is a highly integrated
solution for TV. The system comprises two ICs: the ADOC
(Analogue Digital One Chip) and the MPIF (Multi Platform
InterFace). The MPIF IC performs analogue processing for IF,
source selection, and analogue to digital conversion. The
ADOC IC incorporates video and audio processing as well as
the complete TV control functionality. The ADOC aims at the
low and mid range market segment.
The split-up between an analogue (MPIF) and a digital part
(ADOC) has the following advantages:
•
High frequent parts (IF) can be included in the concept.
•
Less A/D and D/A converters needed for source switching.
•
Better performance for AD converters (realised in analogue
design environment, more accurate, less tolerance).
•
Critical items like reference voltages can be realised in the
analogue environment.
•
Integrated SCART buffers.
The new A02 chassis has the following features:
•
An LSP (Large Signal Panel) that is based on the existing
EM5 chassis.
•
A new SSB (Small Signal Board) with very high integration.
•
Upgradeable main software (via ComPair). The software is
a large and re-engineered version of the 'MG' software
used by Philips CE for several years.
9.1.1
Large Signal Panel
The chassis has a full sized LSP, which is identical to the one
in the EM5 chassis.
The main functionalities of the LSP are:
•
Supply,
•
Deflection,
•
Sound amplification.
A02E Circuit Descriptions, Abbreviation List, and IC Data Sheets
The LSP (single sided) is built up very conventional, with hardly
any surface mounted components on the copper side. It has a
large "hot" part, including both deflection coils.
9.1.2
Small Signal Board
The SSB is a high tech module (four layer, 2 sides reflow
technology, full SMC) with very high component density.
Despite this, it is designed in such a way, that repair on
component level is possible. To achieve this, attention was
paid to:
•
Accessibility of the test points. The SSB has good
accessible service positions.
•
Clearance around surface mounted ICs (for replacing).
•
Detailed diagnostics and fault finding is possible via
ComPair.
•
Software upgrading is possible via ComPair.
The main functionalities of the SSB are:
•
Tuner input,
•
I/O interface provisions,
•
TXT and Control,
•
Video and Audio decoding,
•
Feature Box,
•
Sync and Geometry control.
Further features of the SSB are:
•
The PIP functionality (when present) is integrated on the
SSB.
•
The 3D Comb filter functionality (for USA) is integrated on
the SSB.
On the photographs you can see where the key components
are located on the SSB: