Sony SPP-ID970 Service Manual page 35

2-2. SCHEMATIC DIAGRAM — HANDSET SECTION —
For printed wiring boards
• X : parts extracted from the component side.
• : Carbon pattern.
• : Through hole.
z
• b : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
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For schematic diagrams
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• C : panel designation.
• U : B+ Line.
• Power voltage is dc 3.6 V and fed with regulated dc power
supply from battery terminal. (HANDSET)
SPP-ID970/ID971
• Voltage is dc with respect to ground under no-signal
condition.
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Signal path.
N
: TX (To Tel Line)
O
: RX (From Tel Line)
P
: bell
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