Sony HCD-GNZ5D Servise Manual page 31

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• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Indication of transistor.
C
Q
These are omitted.
B E
Q
B C E
These are omitted.
Q
B C E
These are omitted.
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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
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HCD-GNZ5D
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1 / W or less unless otherwise
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specified.
• 2 : nonflammable resistor.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO
f : TUNER
L : VIDEO (COMPONENT)
r : VIDEO (COMPOSITE)
E
: TAPE PLAY (DECK A)
d
: TAPE PLAY (DECK B)
G
: TAPE REC (DECK B)
J
: DVD (AUDIO)
c : DVD (RF)
I : DVD (DIGITAL)
• Abbreviation
E3 : 240 V AC area in E model
E12 : 220 – 240 V AC area in E model
E13 : 220 – 230 V AC area in E model
E15 : Iran model
PH : Philippine model
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• WAVEFORMS
– DMB11 BOARD –
1
IC102 6 (DVDRFIP)
200 mV/DIV, 100 nsec/DIV
2
IC102 ea (FED)
100 mV/DIV, 1 msec/DIV
3
IC102 es (TEO)
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500 mV/DIV, 1 msec/DIV
– PANEL BOARD –
1
IC101 q; (X CIN)
32.768 kHz
0.5 V/DIV, 20 µ sec/DIV
2
IC101 qd (X OUT)
16 MHz
u 1 6 3 0.5 V/DIV, 0.5 µ sec/DIV
.
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4
IC102 <z.v (YUV1)
700 mVp-p
1.3 Vp-p
H
500 mV/DIV, 20 µ sec/DIV
5
IC102 <z.n (YUV2)
0.3 Vp-p
1.2 Vp-p
H
500 mV/DIV, 20 µ sec/DIV
6
IC102 <z., (YUV3)
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0.5 Vp-p
H 1.5 Vp-p
500 mV/DIV, 20 µ sec/DIV
1.1 Vp-p
0.6 Vp-p
m
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HCD-GNZ5D
2
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IC102 <xx. (YUV1)
1.8 Vp-p
37 nsec
500 mV/DIV, 20 µ sec/DIV
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