Table of Contents
Advertisement
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
This appliance is classified
as a CLASS 1 LASER
product. The CLASS 1
LASER PRODUCT
MARKING is located on
the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
MODEL IDENTIFICATION
- BACK PANEL -
PART No.
TABLE OF CONTENTS
······························································· 4
·········································································· 5
································································ 7
···································································· 12
7-1. Circuit Boards Location ··················································· 21
7-2. Block Diagrams ································································ 22
7-3. Printed Wiring Board - BD Section - ····························· 24
7-4. Schematic Diagram - BD Section - ································ 25
7-5. Printed Wiring Board - MAIN Section - ························ 26
7-6. Schematic Diagram - MAIN (1/3) Section - ·················· 27
7-7. Schematic Diagram - MAIN (2/3) Section - ·················· 28
7-8. Schematic Diagram - MAIN (3/3) Section - ·················· 29
7-9. Printed Wiring Board - POWER AMP Section - ··········· 30
7-10. Schematic Diagram - POWER AMP Section - ·············· 31
7-11. Printed Wiring Boards - PANEL Section - ····················· 32
7-12. Schematic Diagram - PANEL Section - ························· 33
7-13. Printed Wiring Boards - LEAF SW Section - ················ 34
7-14. Schematic Diagram - LEAF SW Section - ···················· 35
7-15. Printed Wiring Boards - DRIVER Section - ·················· 36
7-16. Schematic Diagram - DRIVER Section - ······················ 37
7-17. Printed Wiring Board - TRANS Section - ······················ 38
7-18. Schematic Diagram - TRANS Section - ························ 39
7-19. IC Pin Function Description ············································· 40
7-20. IC Block Diagrams ··························································· 42
MODEL
E2, E3, EA, MY, SP, AR models
MX, AUS models
• Abbreviation
AR
: Argentine
AUS : Australian
E2
: 120 V AC Area in E model
E3
: 240 V AC Area in E model
····························· 16
······························· 16
······················································ 46
······································· 52
PART No.
4-225-040-3s
4-225-040-4s
EA
: Saudi Arabia
MY
: Malaysia
MX
: Mexican
SP
: Singapore
3
Hide quick links:
Advertisement
Table of Contents
