Sony HCD-BX3 Service Manual
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SERVICE MANUAL
Ver 1.1 2001.11
• HCD-BX3/DX3 are the tuner, deck,
CD and amplifier section in MHC-
BX3/DX3.
AUDIO POWER SPECIFICATIONS:
(HCD-BX3 US model only)
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
with 6 ohm loads both channels driven, from 120-10,000 Hz; rates
75 watts per channel minimum RMS power, with no more than 10%
total harmonic distortion from 250 milliwatts to rated output.
Amplifier section
US, Canadian model:
HCD-BX3:
Continuous RMS power output (reference)
60 + 60 watts
(6 ohms at 1 kHz, 10% THD)
Total harmonic distortion less than 0.07%
(6 ohms at 1 kHz, 35 W)
AEP, UK model:
HCD-BX3:
DIN power output (rated) 45 + 45 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference)
60 + 60 watts
(6 ohms at 1 kHz, 10% THD)
Music power output (reference)
150 + 150 watts
(6 ohms at 1 kHz, 10% THD)
Other model:
HCD-DX3:
The following measured at AC 120, 220, 240 V 50/60 Hz
Sony Corporation
9-929-055-12
2001K1600-1
Home Audio Company
© 2001.11
Published by Sony Engineering Corporation
HCD-BX3/DX3
Photo: HCD-BX3
Model Name Using Similar Mechanism
CD
CD Mechanism Type
Section
Base Unit Name
Optical Pick-up Name
Tape deck
Model Name Using Similar Mechanism
Section
Tape Transport Mechanism Type
SPECIFICATIONS
DIN power output (rated) 75 + 75 watts
Continuous RMS power output (reference)
Inputs
MD/VIDEO IN:
(phono jacks)
MIC:
(mini jack)
Outputs
PHONES:
(stereo mini jack)
SPEAKER:
CD player section
System
Laser
Laser output
COMPACT DISC DECK RECEIVER
US Model
Canadian Model
AEP Model
UK Model
HCD-BX3
E Model
Australian Model
HCD-DX3
NEW
CDM58-K2BD38
BU-K2BD38
KSM-213DAP
NEW
TCM-230MWR11
(6 ohms at 1 kHz, DIN)
100 + 100 watts
(6 ohms at 1 kHz, 10% THD)
voltage 450/250 mV,
impedance 47 kilohms
sensitivity 1 mV,
impedance 10 kilohms
accepts headphones of
8 ohms or more
accepts impedance of 6 to 16 ohms
Compact disc and digital audio system
Semiconductor laser (λ=780 nm)
Emission duration: continuous
Max. 44.6 µ W*
*This output is the value measured at a
distance of 200 mm from the objective
lens surface on the Optical Pick-up Block
with 7 mm aperture.
— Continued on next page —

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Summary of Contents for Sony HCD-BX3

  • Page 1 Canadian Model Ver 1.1 2001.11 AEP Model UK Model HCD-BX3 E Model Australian Model HCD-DX3 • HCD-BX3/DX3 are the tuner, deck, CD and amplifier section in MHC- BX3/DX3. Photo: HCD-BX3 Model Name Using Similar Mechanism CD Mechanism Type CDM58-K2BD38 Section...
  • Page 2: Leakage Test

    Tape player section Recording system 4-track 2-channel stereo Design and specifications are subject to change without notice. Frequency response 40 – 13,000 Hz (±3 dB), using Sony TYPE I cassette Tuner section SAFETY CHECK-OUT FM stereo, FM/AM superheterodyne tuner (US model only)
  • Page 3: Table Of Contents

    TABLE OF CONTENTS NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT 1. SERVICE NOTE ······························································· 4 2. GENERAL ·········································································· 5 The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the 3.
  • Page 4: Service Note

    SECTION 1 SERVICE NOTE Note for installing the panel board 2 Panel board Screw hole Hot melt Attach the panel board with fourteen screws (+BVTP 2.6 × 8 ) 1 Cut the fourteen melted-connection points with a cutting plier. after the board is removed once. Do not tighten the screws excessively.
  • Page 5: General

    SECTION 2 GENERAL 1 2 3 4 5 Photo: HCD-BX3 – . button MD/VIDEO button and indicator x button TAPE A/B button and indicator gG button CD button and indicator S button TUNER/BAND button and indicator > + button CROOVE button and indicator...
  • Page 6 This section is extracted from instruction manual.
  • Page 7: Disassemby

    SECTION 3 DISASSEMBY Note : Follow the disassembly procedure in the numerical order given. 3-1. UPPER CASE (TOP) 9 Two screws (+BVTP 3 × 10) Upper case (Top) 5 Two screws (Case) 7 Two screws (+BVTP 3 × 10) Case (L) 6 Screw (Case) Case (R) 3 Two screws...
  • Page 8 3-3. FRONT PANEL SECTION CD mechanism deck (CDM58) 4 Screw (+BVTP 3 × 10) 1 Flat type wire (CN304) 2 Connector (CN302) 3 Connector (CN303) 5 Screw (+BVTP 3 × 10) Front panel section 6 Three screws (+BVTT 3 × 6) 3-4.
  • Page 9 3-5. PANEL BOARD 7 Six claws 4 Ring (Vol) 8 Panel board 3 Bracket (Volume) 2 Hexagon nut 1 Knob (Volume) 6 Cut the fourteen melted-connection points with a cutting plier. Note: When attching the panel board, refer to "Service Note" on page 4. 3-6.
  • Page 10 3-7. MAIN BOARD AND AMP BOARD 4 Three screws (+BVTP 3 × 10) 7 Heat sink 6 Two screws (+BVTP 3 × 10) 5 AMP board 3 Two screws (+BVTP 3 × 10) 2 Main board 1 Two screws (+BVTP 3 × 8) 3-8.
  • Page 11 3-9. BASE UNIT 4 Two insulators Base unit 1 Flat type wire (CN101) 5 Two insulators 2 Four screws (+PTPWH 2.6) 3-10. DRIVER BOARD, MOTOR BOARD AND ADDRESS SENSOR BOARD q; Screw (+PTPWH 2.6 × 8) 5 Three screws (+BVTP 2.6 × 8) 7 Motor board 4 Flat type wire (CN721) qa Tray...
  • Page 12: Test Mode

    SECTION 4 TEST MODE [MC Cold Reset] [Change-over of MW Tuner Step between 9 kHz and • The cold reset clears all data including preset data stored in the 10 kHz] RAM to initial conditions. Execute this mode when returning •...
  • Page 13 [MC Test Mode] • This mode is used to check operations of the respective sections of Amplifier, Tuner, CD and Tape. Procedure: Press the ?/1 button to turn on the set. Press the three buttons of x , ENTER and DISC 3 simultaneously.
  • Page 14 [Aging Mode] This mode can be used for operation check of CD section and tape deck section. • If an error occurred: The aging operation stops and display status. • If no error occurs: The aging operation continues repeatedly. 1. Operating method of Aging Mode Turn on the main power and select “CD”...
  • Page 15 2) Operation during aging mode In the aging mode, the program is executed in the following sequence. (1) The disc tray opens and closes. (2) The mechanism accesses DISC 2 and makes an attempt to read TOC. However, since there are no discs, a message “CD2 NO DISC”...
  • Page 16: Mechanical Adjustments

    SECTION 5 SECTION 6 MECHANICAL ADJUSTMENTS ELECTRICAL ADJUSTMENTS Precaution DECK SECTION 0 dB=0.775 V 1. Clean the following parts with a denatured alcohol-moistened swab: 1. Demagnetize the record/playback head with a head record/playback heads pinch rollers demagnetizer. erase head rubber belts 2.
  • Page 17 2. Turn the adjustment screw and check output peaks. If the peaks DECK B Tape Speed Adjustment do not match for L-CH and R-CH, turn the adjustment screw Note: Start the Tape Speed adjustment as below after setting to the test so that outputs match within 1dB of peak.
  • Page 18 DECK B REC Bias Adjustment 4. Mode: Record Procedure: INTRODUCTION MD/VIDEO (AUDIO) IN When set to the test mode performed in Tape Speed Adjustment, 315 Hz, 50 mV (–23.8 dB) AF OSC when the tape is rewound after recording, the “REC memory mode” blank tape 600 Ω...
  • Page 19 FM Tuned Level Adjustment CD SECTION FM RF SSG Note : 1. CD Block is basically designed to operate without adjustment. 75 Ω coaxial Therefore, check each item in order given. 2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated. 3. Use an oscilloscope with more than 10MΩ impedance. 4.
  • Page 20 Note : Clear RF signal waveform means that the shape “ ◊ ” can be clearly Adjustment Location: distinguished at the center of the waveform. [BD BOARD] (Conductor Side) RF signal waveform VOLT/DIV : 200mV TIME/DIV : 500ns level : 1.45 ± 0.3Vp-p E-F Balance (1 Track jump) Check oscilloscope BD board...
  • Page 21: Diagrams

    HCD-BX3/DX3 SECTION 7 DIAGRAMS 7-1. CIRCUIT BOARD LOCATION THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) MOTOR Board Note on Schematic Diagram: Note on Printed Wiring Boards: DRIVER Board •...
  • Page 22: Block Diagrams

    HCD-BX3/DX3 7-2. BLOCK DIAGRAMS AR,AUS,E,EA,KR,MX,MY,SP,TH,TW MODEL AM/FM IF MPX TM601 LPF601 FE601 Q601 IC601 TUNER/CD SECTION CF601 CF602 RF IF BUFFER L-CH • RCH is omitted ANT IN IF OUT FM IF L OUT Q611 • Signal Path FM 75Ω...
  • Page 23 HCD-BX3/DX3 MAIN SECTION EXCEPT US,CND MODEL INPUT SELECT TONE/VOL CONT IC101 IC102 IC501 TM801 L-CH TUNER IN2A VOL OUT2 SECTION POWER Q504,505 Q861 Q821,822 SPEAKER RY801 Q824,825 R CH LOUT MUTE MUTE MUTE MUTE PROTECT IN2C RELAY CONT Q103 CONT...
  • Page 24: Bd Section

    HCD-BX3/DX3 • See page page 21 for Circuit Boards Location. 7-3. PRINTED WIRING BOARD BD SECTION • Semiconductor Location Ref. No. Location IC101 IC102 IC103 Q101 (Page 26)
  • Page 25: Bd Section

    HCD-BX3/DX3 7-4. SCHEMATIC DIAGRAM BD SECTION • See page page 21 for Wavefoms. • See page page 42 for IC Block Diagrams. (Page 28) The components identified by Les composants identifiés par mark 0 or dotted line with mark une marque 0 sont critiques 0 are critical for safety.
  • Page 26: Main Section

    HCD-BX3/DX3 • See page page 21 for Circuit Boards Location. 7-5. PRINTED WIRING BOARD MAIN SECTION • Semiconductor Location Ref. No. Location (Page 36) (Page 24) D501 D502 D503 D504 D505 D506 D508 D509 D510 D511 D601 D641 D651 (Page 32)
  • Page 27: Main Section (1/3)

    HCD-BX3/DX3 7-6. SCHEMATIC DIAGRAM MAIN SECTION (1/3) • See page page 44 for IC Block Diagrams. (Page 28)
  • Page 28: Main Section (2/3)

    HCD-BX3/DX3 • See page page 44 for IC Block Diagrams. 7-7. SCHEMATIC DIAGRAM MAIN SECTION (2/3) (Page 27) (Page 31) (Page 31) (Page 25) (Page 37) (Page 29) (Page 29) (Page 29) (Page 33)
  • Page 29: Schematic Diagram Main Section

    HCD-BX3/DX3 7-8. SCHEMATIC DIAGRAM MAIN SECTION (3/3) • See page page 21 for Wavefoms. • See page page 40 for IC Pin Function Description. • See page page 44 for IC Block Diagrams. (Page 28) (Page 28) (Page 28) (Page 28) 2.2K...
  • Page 30: Amp Section

    HCD-BX3/DX3 • See page page 21 for Circuit Boards Location. 7-9. PRINTED WIRING BOARD AMP SECTION • Semiconductor Location Ref. No. Location D501 D502 D541 D542 D543 D551 IC501 Q501 Q503 Q504 Q551 Q581 Q582 Q583 (Page 38) (Page 26)
  • Page 31: Schematic Diagram Amp Section

    HCD-BX3/DX3 7-10. SCHEMATIC DIAGRAM AMP SECTION (Page 39) C544 1000 The components identified by Les composants identifiés par mark 0 or dotted line with mark une marque 0 sont critiques 0 are critical for safety. pour la sécurité. Replace only with part number Ne les remplacer que par une specified.
  • Page 32: Panel Section

    HCD-BX3/DX3 • See page page 21 for Circuit Boards Location. 7-11. PRINTED WIRING BOARD PANEL SECTION (Page 26) • Semiconductor Location Ref. No. Location Ref. No. Location D601 B-10 Q606 D602 Q607 Q608 D614 D615 Q609 D616 Q610 D617 Q611...
  • Page 33: Schematic Diagram Panel Section

    HCD-BX3/DX3 7-12. SCHEMATIC DIAGRAM PANEL SECTION • See page page 21 for Wavefoms. • See page page 41 for IC Pin Function Description. • See page page 43 for IC Block Diagrams. 0.47 C617 10000P C697 100P (Page 28) The components identified by Les composants identifiés par...
  • Page 34: Leaf Sw Section

    HCD-BX3/DX3 • See page page 21 for Circuit Boards Location. 7-13. PRINTED WIRING BOARD LEAF SW SECTION • Semiconductor Location Ref. No. Location D1001 D1002 IC1001 IC1002 Q1001 (Page 26) (Page 26) (Page 26)
  • Page 35: Leaf Sw Section

    HCD-BX3/DX3 7-14. SCHEMATIC DIAGRAM LEAF SW SECTION (Page 29)
  • Page 36: Driver Section

    HCD-BX3/DX3 • See page page 21 for Circuit Boards Location. 7-15. PRINTED WIRING BOARD DRIVER SECTION • Semiconductor Location Ref. No. Location D701 IC701 IC711 (Page 26)
  • Page 37: Driver Section

    HCD-BX3/DX3 7-16. SCHEMATIC DIAGRAM LEAF SW SECTION • See page page 43 for IC Block Diagrams. (Page 28)
  • Page 38: Trans Section

    HCD-BX3/DX3 • See page page 21 for Circuit Boards Location. 7-17. PRINTED WIRING BOARD TRANS SECTION • Semiconductor Location Ref. No. Location D971 D972 D973 D974 D975 D977 D978 D979 IC971 Q971 Q972 (Page 30)
  • Page 39: Schematic Diagram Trans Section

    HCD-BX3/DX3 7-18. SCHEMATIC DIAGRAM TRANS SECTION (Page 31) C975 The components identified by Les composants identifiés par mark 0 or dotted line with mark une marque 0 sont critiques 0 are critical for safety. pour la sécurité. Replace only with part number Ne les remplacer que par une specified.
  • Page 40: Ic Pin Function Description

    7-19. IC PIN FUNCTION DESCRIPTION • MAIN BOARD IC401 M30622MAA-A25FP (MASTER CONTROL) Pin No. Pin Name Description Pin No. Pin Name Description SURROUND 1 Not used. Not used. SURROUND 2 Not used. Not used. SURROUND 3 Not used. Not used. 498-DATA Data signal output for IC101 (M61504FP) Not used.
  • Page 41 • PANEL BOARD IC601 TMP88CP77F-1A22 (DISPLAY CONTROL) Pin No. Pin Name Description VOLUME A VOLUME A signal input. VOLUME B VOLUME B signal input. HEADPHONE Head phone detect signal input. H=ON, L=OFF Not used. TUNER TUNER LED driver output.(high active) CD LED driver output.(high active) TAPE A/B TAPE A/B LED driver output.(high active)
  • Page 42: Ic Block Diagrams

    7-20. IC BLOCK DIAGRAMS IC101 CXD2587Q (BD BOARD) ERROR DIGITAL ASYMMETRY DIGITAL CORRECTOR CORRECTION LRCK OPERATIONAL AMPLIFIER PCMD INTERFACE DEMODULATOR ANALOG SWITCH CONVERTER EMPH XVDD CLOCK XTSL GENERATOR XTAI TIMING TES1 LOGIC XTAO TEST XVSS SERVO DSP PWM GENERATOR AVDD1 FRDR FOCUS FOCUS PWM...
  • Page 43 IC103 CXA2568M (BD BOARD) IC602 BA3830F (PANEL BOARD) APC PD AMP REFFERENCE RESET 18 RESET LC/PD CURRENT LD_ON HOLD REFFERENCE 17 f01 CURRENT AGCVTH VREF APC LD AMP HOLD_SW LINE 16 f02 AGCCONT (50%/30% OFF) LINE RF_BOT 15 f03 RFTC RF SUMMING AMP RF_EQ_AMP RF_1...
  • Page 44 IC601 BA1450 (MAIN BOARD) AM IF VREG DECODER DRIVER COMP IC302 µPC1330H (MAIN BOARD) IC681 M5218AFP (MAIN BOARD) INVERTER V– COMPARATER CONT SW P2 SW R1 SW P1 SW R2 IC651 LC72130 (MAIN BOARD) SWALLOW COUNTER 1/16.1/17 4bits POWER REFERENCE RESET DIVIDER SWALLOW COUNTER...
  • Page 45: Exploded Views

    SECTION 8 EXPLODED VIEWS NOTE: • -XX, -X mean standardized parts, so they may • Abbreviation : Mexican model have some differences from the original one. CND : Canadian model : Argentina model • Items marked “*” are not stocked since they : Australian model are seldom required for routine service.
  • Page 46: Panel Section

    8-2. PANEL SECTION * For service only (Be sure to refer to "Servicie note" on page 4.) FL601 S601 TAPE mechanism deck not supplied supplied with S601 *1: E, EA, AR, AUS, KR, MX, MY, SP, TH, TW models Ref. No. Part No.
  • Page 47: Main Board Section

    8-3. MAIN BOARD SECTION T971 US, CND not supplied EA,MY,SP,TW CIS,UK CIS,UK,AED,AEP,G not supplied E,MX,TH Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 1-773-042-11 WIRE (FLAT TYPE) (17 CORE) 3-703-571-11 BUSHING (S) (4516), CORD (E,MX,TH) A-4428-038-A MAIN BOARD,COMPLETE (AED,AEP,CIS,G,UK) * 106 3-703-244-00 BUSHING (2104), CORD (EXCEPT E,MX,TH) A-4428-046-A MAIN BOARD,COMPLETE (CND,US)
  • Page 48: Tape Mechanism Section

    Ver 1.1 2001.11 8-4. TAPE MECHANISM DECK SECTION Note: Two different types of tape mechanism are used depending on models. They maintain compatibility as an entire mechanism even though there are some different parts are used. Ref. No. Part No. Description Remarks Ref.
  • Page 49: Cd Mechanism Section

    Ver 1.1 2001.11 8-5. CD MECHANISM DECK SECTION BU-K2BD38 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 4-933-134-11 SCREW (+PTPWH M2.6X8) 4-221-681-01 LEVER (EX) 4-221-679-01 CAM(RELAY) 4-221-682-01 LEVER (LIFTER) 4-221-675-01 TABLE 4-221-688-01 PULLEY (B), CHUCKING 4-221-686-01 LEVER (CHANGE) 1-471-035-11 MAGNET ASSY 4-221-676-01 TRAY X-4952-019-1 PULLEY (A) ASSY, CHUCKING...
  • Page 50: Electrical Parts List

    SECTION 9 ELECTRICAL PARTS LIST ADDRESS SENSOR NOTE: • Due to standardization, replacements in the • COILS : Mexican model parts list may be different from the parts uH: µH : Argentina model specified in the diagrams or the components •...
  • Page 51 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks < DIODE > R515 1-249-433-11 CARBON 1/4W R516 1-249-429-11 CARBON 1/4W D501 8-719-911-19 DIODE 1SS133T-72 R517 1-249-421-11 CARBON 2.2K 1/4W F D502 8-719-911-19 DIODE 1SS133T-72 R518 1-249-429-11 CARBON 1/4W D541 8-719-028-23 DIODE D3SBA20-4101...
  • Page 52 DRIVER Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C121 1-163-038-91 CERAMIC CHIP 0.1uF R111 1-216-121-91 RES-CHIP 1/10W C122 1-104-665-11 ELECT 100uF 20.00% 10V R113 1-216-121-91 RES-CHIP 1/10W C123 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V R114 1-216-073-00 METAL CHIP 1/10W C124...
  • Page 53 HEAD (A) HEAD (B) LEAF SW MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 1-676-220-11 HEAD (A) BOARD A-4428-038-A MAIN BOARD, COMPLETE (AED,AEP,G,UK,CIS) ************** ********************* A-4428-046-A MAIN BOARD, COMPLETE (US,CND) < CONNECTOR > ********************* A-4428-060-A MAIN BOARD, COMPLETE (MY,SP,TW) * CN1 1-564-719-11 PIN, CONNECTOR (SMALL TYPE) 3P *********************...
  • Page 54 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C142 1-163-038-91 CERAMIC CHIP 0.1uF C317 1-126-933-11 ELECT 100uF 20.00% 16V C143 1-126-964-11 ELECT 10uF 20.00% 50V C318 1-126-964-11 ELECT 10uF 20.00% 50V C144 1-126-934-11 ELECT 220uF 20.00% 10V C319 1-126-961-11 ELECT...
  • Page 55 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C410 1-163-233-11 CERAMIC CHIP 18PF 5.00% 50V C637 1-163-021-91 CERAMIC CHIP 0.01uF 10.00% 50V C411 1-163-231-11 CERAMIC CHIP 15PF 5.00% 50V C638 1-163-135-00 CERAMIC CHIP 560PF C414 1-163-038-91 CERAMIC CHIP 0.1uF (AED,AEP,CIS,G,UK)
  • Page 56 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C841 1-126-959-11 ELECT 0.47uF 20.00% 50V D601 8-719-056-83 DIODE UDZ-TE-17-6.8B (EXCEPT US,CND) D641 8-719-914-42 DIODE DA204K-T-146 C851 1-163-038-91 CERAMIC CHIP 0.1uF D651 8-719-988-61 DIODE 1SS355TE-17 (AED,AEP,CIS,G,UK) D681 8-719-988-61 DIODE 1SS355TE-17 (AED,AEP,CIS,G,UK) C852 1-163-038-91 CERAMIC CHIP...
  • Page 57 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks IC601 8-759-652-00 IC BA1450 JR907 1-216-295-91 SHORT IC651 8-759-288-54 IC LC72130 (AED,AEP,CIS,CND,G,UK,US) IC681 8-759-099-06 IC M5218AFP-TE1 (AED,AEP,CIS,G,UK) JR908 1-216-295-91 SHORT IC682 8-759-541-48 IC BU1924 (AED,AEP,CIS,G,UK) (AED,AEP,CIS,CND,G,UK,US,AR,AUS,E,EA,KR,MX,TH) IC911 8-759-039-69 IC uPC7805AHF JR909 1-216-295-91 SHORT...
  • Page 58 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks Q503 8-729-900-80 TRANSISTOR BA1A4M-TP R125 1-216-065-91 RES-CHIP 4.7K 1/10W (EXCEPT US,CND) R132 1-216-049-91 RES-CHIP 1/10W Q504 8-729-900-63 TRANSISTOR BN1F4M-TP (US,CND,AR,AUS,E,EA,KR,MX,MY,SP,TH,TW) Q505 8-729-900-80 TRANSISTOR BA1A4M-TP R132 1-216-057-00 METAL CHIP 2.2K 1/10W Q601...
  • Page 59 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R309 1-216-081-00 METAL CHIP 1/10W R387 1-216-033-00 METAL CHIP 1/10W R311 1-216-121-91 RES-CHIP 1/10W R388 1-216-081-00 METAL CHIP 1/10W R312 1-216-102-00 RES-CHIP 160K 1/10W R389 1-216-075-00 METAL CHIP 1/10W R314 1-216-295-91 SHORT...
  • Page 60 MAIN Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R497 1-216-073-00 METAL CHIP 1/10W R619 1-216-025-91 RES-CHIP 1/10W (EA) R620 1-216-065-91 RES-CHIP 4.7K 1/10W R497 1-216-081-00 METAL CHIP 1/10W R621 1-216-075-00 METAL CHIP 1/10W (AR,E,MX) R622 1-216-057-00 METAL CHIP 2.2K 1/10W...
  • Page 61 MAIN MOTOR PANEL Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R844 1-216-097-91 RES-CHIP 100K 1/10W < VIBRATOR > (EXCEPT US,CND) R845 1-216-121-91 RES-CHIP 1/10W X401 1-567-098-41 VIBRATOR, CRYSTAL(32.768 KHz) (EXCEPT US,CND) X402 1-781-107-21 VIBRATOR, SERAMIC(16 MHz ) R851 1-260-304-51 CARBON 1/2W...
  • Page 62 PANEL Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C652 1-126-966-11 ELECT 33uF 20.00% 50V D617 8-719-071-41 DIODE SELS5923C-TP15 (MD(VIDEO)) C653 1-126-966-11 ELECT 33uF 20.00% 50V D618 8-719-071-41 DIODE SELS5923C-TP15 (TAPE) C655 1-162-282-31 CERAMIC 100PF D619 8-719-071-41 DIODE SELS5923C-TP15 (CD) C656 1-162-282-31 CERAMIC...
  • Page 63 PANEL Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks R611 1-249-429-11 CARBON 1/4W R682 1-249-413-11 CARBON 1/4W F R612 1-249-401-11 CARBON 1/4W F R683 1-249-414-11 CARBON 1/4W F R613 1-247-893-11 CARBON 390K 1/4W R684 1-249-415-11 CARBON 1/4W F R614 1-247-893-11 CARBON...
  • Page 64 PANEL SENSOR SUB-TRANS TRANS Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks S620 1-762-875-21 SWITCH, KEYBOARD (ENTER) < IC > S621 1-762-875-21 SWITCH, KEYBOARD (EQ EDIT) S623 1-762-875-21 SWITCH, KEYBOARD (– .) IC971 8-759-158-62 IC TA78057S S624 1-762-875-21 SWITCH, KEYBOARD (x) S625...
  • Page 65 TRANS Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks < FUSE > MISCELLANEOUS ************** 0 F971 1-533-451-11 FUSE, GLASS TUBE (DIA. 5)(3.15A 125V)(CND) M961 1-698-792-11 FAN, DC (AR,AUS,E,EA,KR,MX,MY,SP,TH,TW) 0 F971 1-533-452-11 FUSE, GLASS TUBE (DIA. 5)(4A 125V)(US) 1-773-042-11 WIRE (FLAT TYPE) (17 CORE) 0 F971 1-533-466-11 FUSE, GLASS TUBE (DIA.
  • Page 66 HCD-BX3/DX3 REVISION HISTORY Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ver. Date Description of Revision 2001.11...

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