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Lead Free Soldered Boards
The circuit boards listed below [Table 1] used in these models may
have been processed using Lead Free Solder. The boards are
identified by the LF logo located close to the board designation e.g.
F1, H1 etc [ see examples ]. The servicing of these boards requires
special precautions to be taken as outlined below.
Table 1
B
o
a
d r
F
H
3
It is strongly recommended to use Lead Free Solder material in order to guarantee optimal quality of new solder joints. Lead Free Solder is
available under the following part numbers :
Due to the higher melting point of Lead Free Solder the soldering iron tip temperature needs to be set to 370 degrees centigrade. This requires
soldering equipment capable of accurate temperature control coupled with a good heat recovery characteristics.
For more information on the use of Lead Free Solder, please refer to http://www.sony-training.com
F
u
n
t c
o i
n
o r
t n
A
V
n I
p
u
, t
H
e
a
d
p
h
o
n
e
a
n
d
C
o
n
r t
l o
S
w
c t i
h
e
s
P
r a
n t
u
m
b
r e
7
6 -
4
0
0 -
0
5
1 -
9
7
6 -
4
0
0 -
0
5
2 -
0
7
6 -
4
0
0 -
0
5
2 -
1
7
6 -
4
0
0 -
0
5
2 -
2
7
6 -
4
0
0 -
0
5
2 -
3
7
6 -
4
0
0 -
0
5
2 -
4
7
6 -
4
0
0 -
0
5
2 -
5
7
6 -
4
0
0 -
0
5
2 -
6
CAUTION
example 1
example 2
D
a i
m
t e
r e
R
e
m
a
k r
0
3 .
m
m
0
2 .
5
K
g
0
4 .
m
m
0
5 .
0
K
g
0
5 .
m
m
0
5 .
0
K
g
0
6 .
m
m
0
2 .
5
K
g
0
8 .
m
m
1
0 .
0
K
g
1
0 .
m
m
1
0 .
0
K
g
1
2 .
m
m
1
0 .
0
K
g
1
6 .
m
m
1
0 .
0
K
g
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