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Q Q
3 7 6 3 1 5 1 5 0
• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
•
f
: internal component.
• C : panel designation.
Note:
Note:
The components identi-
Les composants identifiés par
fied by mark 0 or dotted
une marque 0 sont critiques
line with mark 0 are criti-
pour la sécurité.
cal for safety.
Ne les remplacer que par une
Replace only with part
piéce portant le numéro
number specified.
spécifié.
• A : B+ Line.
• B : B– Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
(
) : AM/MW/LW/SW
<
> : CD PLAY
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
T E
L
1 3 9 4 2 2 9 6 5 1 3
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J
: CD PLAY
F
: FM
f
: AM/MW/LW/SW
L : AUX
g : BUS
w w w
CDX-GT315C
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: Through hole.
a
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
C
Q
These are omitted
B
E
B
E
C
These are omitted
E
C
B
These are omitted
x
a o
y
.
i
http://www.xiaoyu163.com
8
• Waveforms
— MAIN Board —
1
IC501 i; (XOUT)
32.768 kHz
0.2 V/DIV, 20 µ sec/DIV
2
IC501 is (OSC IN)
18.432 MHz
0.5 V/DIV, 0.1 µ sec/DIV
3
IC50 9 (XTI)
Q
Q
3
7
6
3
8.664 MHz
0.5 V/DIV, 0.1 µ sec/DIV
u 1 6 3
.
21
21
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4
9
9
8
• Semiconductor Location
(MAIN Board)
Ref. No.
Location
D2
F-3
D101
I-4
D103
I-3
D104
I-3
D105
I-3
D106
I-3
0.8 Vp-p
D108
I-3
D109
I-4
D110
I-4
D111
I-4
D112
I-4
D113
I-4
D153
I-2
D200
H-10
D201
H-10
D202
H-10
D203
I-10
D204
I-9
0.9 Vp-p
D205
I-9
D206
I-9
D207
G-10
D301
C-8
D302
D-8
D303
C-9
D304
D-9
D305
C-6
D306
C-6
D307
C-6
D308
C-6
D309
C-7
D310
C-7
1.1 Vp-p
D311
C-8
D312
D-7
1
5
1
5
0
8
9
2
4
D353
G-8
D491
E-5
D493
E-6
D501
I-5
D502
H-7
D602
D-10
D603
D-10
D604
E-10
m
c o
CDX-GT315C
2
9
9
Ref. No.
Location
D605
D-10
D606
D-10
D607
D-10
D609
F-9
D702
C-8
D703
C-9
D704
C-9
D901
B-10
D998
C-9
D999
B-8
IC50
H-2
IC200
G-11
IC201
I-10
IC202
I-7
IC203
H-9
IC300
B-6
IC401
D-3
IC501
G-6
IC601
E-10
IC602
G-8
IC681
D-6
Q1
E-2
Q3
F-3
Q50
H-2
Q420
B-4
Q432
B-3
Q440
B-4
Q452
B-3
Q460
C-4
Q470
C-4
Q491
E-6
9
8
2
9
9
Q492
E-6
Q600
E-10
Q601
E-10
Q605
D-10
Q664
I-6
Q701
C-9
Q702
C-8
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