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5-6. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Indication of transistor.
C
Q
These are omitted.
B
E
Q
B
C E
These are omitted.
Q
B
C
E
These are omitted.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
W or less unless otherwise
4
specified.
• 2 : nonflammable resistor.
• C : panel designation.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
• Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : FM
(
) : CD PLAY
[
] : TAPE PLAY (DECK-A)
{
} : TAPE PLAY (DECK-B)
〈〈
〉〉 : REC
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: TUNER (FM/AM)
J
: CD PLAY
E
: TAPE PLAY (DECK-A)
d
: TAPE PLAY (DECK-B)
G
: REC
j
: MD (VIDEO) IN
N
: MIC INPUT
• Abbreviation
E2
: 120 V AC area in E model
E3
: 240 V AC area in E model
E51
: 220 V AC area in E model
MX
: Mexican model
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
5-7. WAVEFORMS
– BD Board –
(CD PLAY mode)
1
1.3Vp-p
IC721
4
(RF)
2
Approx.
180
mVp-p
IC721
qd
(FE)
3
Approx.
150mVp-p
qg
(TE)
IC721
4
4Vp-p
16.9344MHz
IC721
(XOUT)
rk
29
29
HCD-RG550/RG660
– MAIN Board –
– PANEL Board –
(REC mode)
1
qa
1.7Vp-p
11.3µs
IC601
Q223 (Base)
2
qs
15.8Vp-p
11.3µs
IC601
Q223 (Collector)
1.2Vp-p
32.768kHz
(XT1)
qs
1Vp-p
8.64MHz
(CF1)
qg
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