Samsung D61B Training Manual
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Samsung D61B Training Manual

Samsung D61B Training Manual

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P L A S M A D I S P L A Y T V
PLASMA DISPLAY TV
Chassis :
D61B
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
C O N T E N T S
Precautions
Reference Information
Specifications
Introduction PDP
Alignment and Adjustments
Troubleshooting
Circuit Description
Handling Description
Glossary
Schematic Diagrams

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Summary of Contents for Samsung D61B

  • Page 1 PLASMA DISPLAY TV Chassis : D61B P L A S M A D I S P L A Y T V C O N T E N T S Precautions Reference Information Specifications Introduction PDP Alignment and Adjustments Troubleshooting Circuit Description...
  • Page 2 ELECTRONICS © Samsung Electronics Co., Ltd. Mar. 2004 This Service Manual is a property of Samsung Electronics Co.,Ltd. Printed in Korea Any unauthorized use of Manual can be punished under applicable AA82-01375A International and/or domestic law.

  • Page 3: Safety Precautions

    The current measured should not exceed 3.5 milliamp. Reverse the power- plug prongs in the AC outlet and repeat the test. Samsung Electronics...
  • Page 4 Always determine the cause of damage or overheat- ing, and correct any potential hazards. 14. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC and high Samsung Electronics...

  • Page 5: Servicing Precautions

    Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed. 7. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last. Samsung Electronics...

  • Page 6: Precautions For Electrostatically Sensitive Devices (Esds)

    These servicing instructions are for use by qualified service personnel only. To reduce the risk of electric shock do not perform any servicing other than that contained in the operating instructions unless you are qualified to do so. Samsung Electronics...

  • Page 7: Reference Information

    Millimeter Hour Millisecond Inches Per Second Millivolt Kilowatt-hour Nanofarad Ω Kilogram Kilohertz Picofarad kΩ Kilohm Pound Kilometer Revolutions Per Minute km/h Kilometer Per Hour Revolutions Per Second Kilovolt Second (Time) Kilovolt-ampere Volt Kilowatt Volt-ampere Liter Watt Megahertz Watt-hour Samsung Electronics...
  • Page 8 Fail Safe Voltage Controlled Oscillator Ground VCXO Voltage Controlled Crystal Oscillator Green-Y Very High Frequency High Video Intermediate Frequency High-Frequency Variable Resistor HI-FI High Fidelity Video Tape Recorder Inductance-Capacitance VTVM Vacuum Tube Voltmeter Integrated Circuit Transistor Intermediate Frequency Samsung Electronics...

  • Page 9: Specifications

    External Speaker (10W+10W) AUDIO Output Audio Output (L/R RCA) VIDEO S-VIDEO COMPONENT 1 - 480i / 480p / 720p / 1080i VIDEO Input COMPONENT 2/RGB2(PC) IN (BNC, 5P, 480i~1080i, VGA~XGA) RGB1(PC1) - D-SUB 15P Monitor Output (RCA) VIDEO Output Samsung Electronics...
  • Page 10 MEMO Samsung Electronics...
  • Page 11 Introduction PDP 4. Introduction PDP 4-1 Cell Structure of PDP Front panel Bus electrode Dielectric MgO layer ITO electrode Phosphors Barrier Address Back panel Electrode Samsung Electronics...
  • Page 12 Introduction PDP 4-2 Electrode arrangement of SD PDP Samsung Electronics...
  • Page 13 Introduction PDP 4-3 Discharge in AC PDP Samsung Electronics...
  • Page 14 Introduction PDP 4-4 Discharge Mechanism - Process Samsung Electronics...
  • Page 15 Introduction PDP 4-5 Discharge Mechanism - Process Samsung Electronics...
  • Page 16 Introduction PDP 4-6 Paschen Curve Samsung Electronics...
  • Page 17 Introduction PDP 4-7 Wall Charge Samsung Electronics...
  • Page 18 Introduction PDP 4-8 Process of sustain discharge Samsung Electronics...
  • Page 19 L ow Volt ag e Low Vo lt age L ow V ol tage L ow V ol tage C ontrast C ontrast Low Failure ERC Performance L ow Failure ERC Performance Short Time Short Time 4-10 1 Sub-field Precess - Reset Samsung Electronics...
  • Page 20 Introduction PDP 4-11 1Sub-field Process - Address 1 4-12 1Sub-field Process - Address 2 4-10 Samsung Electronics...
  • Page 21 Introduction PDP 4-13 1Sub-field Process - Address 3 4-14 1Sub-field Process - Address 4 Samsung Electronics 4-11...
  • Page 22 Introduction PDP 4-15 1Sub-field Process - Address 5 4-16 1Sub-field Process - Address 6 4-12 Samsung Electronics...
  • Page 23 Introduction PDP 4-17 1Sub-field Process - Address 7 4-18 1Sub-field Process - Address 8 Samsung Electronics 4-13...
  • Page 24 Introduction PDP 4-19 1Sub-field Process - Address 9 4-20 1Sub-field Process - Sustain 4-14 Samsung Electronics...
  • Page 25 Introduction PDP 4-21 Frame Structure - ADS sub-field address ..128T sustain 1TV field (time) Reset Address Sustain Period Period Period Samsung Electronics 4-15...
  • Page 26 Introduction PDP 4-22 Picture Structure by 8 sub-field Samsung Electronics 4-16...
  • Page 27 Drive of sustain discharge : decided by Panel s Vs value b. The first stage drive : Reset discharge / Made Wall Charge selectivity by Address discharge and panel s Vf Efficiency improve : It is many power consumption and need efficiency improve in Sustain discharge Samsung Electronics 4-17...
  • Page 28 Introduction PDP 4-23 PDP Drive Set Port of Panel Electrode Port of Panel Electrode Scan Buffer Board Scan Buffer Board 4-18 Samsung Electronics...
  • Page 29 Introduction PDP 4-24 PCB Samsung Electronics 4-19...
  • Page 30 MEMO 4-20 Samsung Electronics...

  • Page 31: Alignment And Adjustments

    7. AD9888 8. CXA2151 Release : 2003-05-02 M_NNWS42M6_100 5-1-2(B) B SERVICE MODE utton Operations in Menu Displays all menus UP/DOWN Key Cursor move to select items LEFT/RIGHT Key Enable to increase and decrease the data of the selected items Samsung Electronics...
  • Page 32 D CE G AIN 75/ 96 V S H ARP GA I N SKI N ON SHAR P NESS CTI GAI N C L K DL Y D E N OIS E G AI N 08/ 10 H P O SI Samsung Electronics...
  • Page 33 64/ 82/ 68 R DRI VE SUB HUE V- PATH G DRI VE R- Y/ R AUTO COLOR OF F B DR I VE R- Y/ B R CUTOFF G- Y/ R G CUTOFF G- Y/ B B CUTOFF Samsung Electronics...
  • Page 34 1 2 3 G C u to f f 1 3 0 1 2 7 1 2 8 1 2 8 B C ut o f f 1 3 7 1 2 4 1 5 2 1 3 6 Samsung Electronics...

  • Page 35: White Balance Adjustment

    (See the block diagram given below) during W/B adjustment. Micom can memorize the four modes separately. However, under the current adjustment guidelines, DTV and PC are memorized with the same value during DVI adjustment and CVBS is memorized with a separate value. Samsung Electronics...
  • Page 36 2 7 8 2 8 0 2 8 5 2 8 5 L / L 2 8 5 2 8 7 2 9 5 2 9 5 Y ( f L ) 1 .3 0 .6 0 .8 0 .8 Samsung Electronics...

  • Page 37: Voltage Adjustment

    F an power s ource . Valida te the SMPS voltage Notes -. When the SMPS-PCB is replaced. the VA,VSCAN,VS,VE and VSET voltages must be checked and adjusted to the proper to levels indicated on the panel sticker. Samsung Electronics...
  • Page 38 Alignment and Adjustments MEMO Samsung Electronics...

  • Page 39: Circuit Description

    CN103 PIN NAME PIN NAME PIN NAME +D12V MUTE COMP1_Y1 +D12V VIDEO_OUT AUDIO_RESET C_SUB COMP1_PB1 FAN_ON_OFF CVBS_Y_SUB COMP1_PR1 SCL1_5V SDA1_5V COMP2_Y2_G CVBS_PAL Y_MAIN COMP2_PB2_B SCL1 COMP1_R1_C_MAIN COMP2_PB2_R SDA1 CN104 PIN NAME CXA_Y CXA_CB CXA_CR CXA_HS CXA_VS PC_SL PC_SR Samsung Electronics...
  • Page 40 Tx Out3- / Rx In3- Tx Out3+ / Rx In3+ Tx Out1- / Rx In1- Tx Out1+ / Rx In1+ RESET_MN Tx Out2- / Rx In2- Tx Out2+ / Rx In2+ IIC SCL2 IIC SDA2 Tx CLKOut- / Rx CLKIn- Samsung Electronics...
  • Page 41 Pin no. Power THE M_D D3.3V A33V STD_5V D3.3V PS_ON Fan_D. AMP12V AMP12V D12V D3.3V D3.3V PS_ON CN804 CN805 / CN812 Buffer 1 X Drive Y Drive Pin no. Power Pin no. Power Pin no. Power Vscan Vset Samsung Electronics...
  • Page 42 Circuit Operation Description 3. Logic <-> X <-> Y Logic <-> X : LX2001 <-> CN4005 Pin no. Signal Pin no. Signal Logic <-> Y : Y2001 <-> CN5001 Pin no. Signal Pin no. Signal Yscan START Ysc_c Samsung Electronics...
  • Page 43 Circuit Operation Description 4. Logic <-> ADDRESS BUFFER(LOWER) Samsung Electronics...
  • Page 44 Circuit Operation Description 5. Logic sub R/l <-> ADDRESS BUFFER(UPPER) Samsung Electronics...
  • Page 45 Circuit Operation Description 6. Logic <-> Logic sub R/ Logic sub L Samsung Electronics...
  • Page 46 Circuit Operation Description 7. Y <-> Addr. Buf(H)/Addr. Buf(E) Y <-> Addr. Buf(H) Y <-> Addr. Buf(E) CN5014 CN5013 Pin no. Name Pin no. Name Vc c Vc c Vc c Vc c AGND AGND AGND AGND Samsung Electronics...
  • Page 47 150V( 140~160) : STR- A6351 Vset 0. 2A 140V( 130~150) : STR- G6353 0. 3A Vs ON 170V( 160~180) : D/ D 3 3. 0A IC : SP F9001 FET : 2SK2698 Fig. 1. Main Power Block Diagram Samsung Electronics...
  • Page 48 150V( 140~160) : STR- A6351 Vset 0. 2A 140V( 130~150) : STR- G6353 0. 3A Vs ON 170V( 160~180) : D/ D 3 3. 0A IC : SP F9001 FET : 2SK2698 Fig. 1. Main Power Block Diagram Samsung Electronics...
  • Page 49 This component converts the inputincoming AC power into DC power. [Power Circuit] - Aux. Power Circuit D8131 doesperforms the half-wave rectification on the AC input and C8131 produces DC voltage with less ripple. -Main pPower cCircuit The Rrectified AC input is converted into DC output voltage. 6-10 Samsung Electronics...
  • Page 50 1.26V when it is an alyzed by the IC8151 after being divided by R8153, RX8152 and R8154, R8155. The coil between Pins 5 and 6 of the transformer T8131 generates the input power for the control IC of the PFC circuit. Samsung Electronics 6-11...
  • Page 51 This feature protects the IC in case of overload to the secondary side. - Overheating Protection For overheating protection, the latch circuit is activated when the temperature of the chip exceeds 140 ºC The actual temperature detection is done by the control circuit element. Fig. 4. Auxiliary Power Circuit 6-12 Samsung Electronics...
  • Page 52 -Overheating Protection The IC has no overheating protection. The posistor (TH8221) is positioned on the cooling fin on the main FET to stop the circuit when overheating has been caused by overloading or other reasons. Samsung Electronics 6-13...
  • Page 53 The current runs through the primary coil R8301 of T8301 when the Internal MOSFET is ON. The current climbs at the gradient specified by the value LR8301 converts the currents to voltage and Pin 1 of the IC detects it. 6-14 Samsung Electronics...
  • Page 54 This feature protects the IC in case of an overload to the secondary side. -Overheating Protection For overheating protection, the latch circuit is activated when the temperature of the chip exceeds 140°…. The actual temperature detection is done by the control circuit element. Fig. 9. QRC Circuit (Primary) Samsung Electronics 6-15...
  • Page 55 The increased output current increases the current of the primary side. Over Current protection is activated when this voltage exceeds the set point. - Overheating Protection The latch circuit is activated and stops the oscillation when the IC frame temperature exceeds 150°C 6-16 Samsung Electronics...
  • Page 56 The Vscan circuit is explained as an example. When voltage is applied, the voltage from the coil at Pins 11 ~ 16 of T8331 applies to the Vcc terminal (Pin 4) of the IC. When this voltage eaches the starting voltage, the oscillation begins. Samsung Electronics 6-17...
  • Page 57 The increased output current increases the current of the primary side. Over Current protection is activated when this voltage exceeds the set point. -Overheating Protection The latch circuit is activated and stops the oscillation when the IC frame temperature exceeds 140℃. Fig. 13. PRC Circuit 6-18 Samsung Electronics...
  • Page 58 The built-in over-voltage protection circuit is activated when the input voltage overruns. -Over Current Protection The built-in over-current protection circuit is activated around 2.1A. -Overheating Protection A built-in overheating protection circuit is employed. Fig. 15. Dropper Circuit Samsung Electronics 6-19...
  • Page 59 The constant voltage regulation resistor divides the output voltage and is detected at Pin 4 of the IC. [Protection Features] -Over Current Protection The built-in over-current protection circuit is activated around 3.1A. -Overheating Protection A built-in overheating protection circuit is employed. Fig. 16. Chopper Circuit Fig. 17. FET Vds Waveform of the Chopper Circuit 6-20 Samsung Electronics...
  • Page 60 -Overheating Protection For overheating protection, the latch circuit is activated when the temperature of the chip IC8301 (STR-F6267) exceeds 140℃. The actual temperature detection is done by the control circuit element. IC8001 (SI-8050S) employs a built-in overheat protection. Samsung Electronics 6-21...
  • Page 61 Circuit Operation Description Fig. 18. Chopper Circuit 6-22 Samsung Electronics...
  • Page 62 (3) Validate that the video input signal (Pins 43, 48 and 54), HSYNC (Pin 30) and VSYNC (Pin 31) is normal. (4) Validate that data output is normal. R, G, B digital data output (RA501 ~ RA505), ASI_SUB_H (Pin 66): 45KHz (in case of 720P), ASI_SUB_V (Pin 64): 60Hz, ASI_SUB_CLK (Pin 67) Samsung Electronics 6-23...
  • Page 63 (2) Validate that the POWER DOWN pin (Pin 32) is HIGH. (3) Verify that the output from the DNIe is delivered to DS90C385 normally. (Digital R, G, B, HSYNC, VSYNC, and CLK) (4) Validate that LVDS data output is normal. 6-24 Samsung Electronics...

  • Page 64: Troubleshooting

    N ormal Abno r mal SMPS A bnor mal LOGIC LOGIC Board Output N orm al Abnormal X - Board Change X - Board Output N orm al Abnormal Y - Board Change Y - Board Output Change PANEL Samsung Electronics...
  • Page 65 T rouble Shooting Vertical(1 /7 ) Re place Addre s s buffe r board No Scre en Vertical(3 /4 ) Replace PANEL No Scre en , Replace Lower Buffer Board No 3 , Replace Addres s buffer boa rd Samsung Electronics...
  • Page 66 Repl a c e the b oard Q5 01 7 ~ Q50 2 4 Y- MAIN Normal State < Y- MAIN B OARD> F USE FUSE F ET F 5 00 1 ~ 3 F 5 00 9 ~ 2 4 Samsung Electronics...
  • Page 67 F40 0 2 for Vdd Q4 00 9 ~ Q40 1 6 X- MAIN Che ck Logic- main Nor mal S t at e F USE F USE F ET Q4 0 0 9 ~ 1 6 Samsung Electronics...
  • Page 68 Ve rt ic a l s ync on LOGIC- MAIN isn’t normal. [ Logic Main ] LED(LD200 0) blinks ? (action of Vs y nc) Re place the board T rouble Shooting Logic M ain Repla ce PDP Normal S t a te <LOGIC- MAIN BOARD> Blink ? Samsung Electronics...
  • Page 69 Q5 00 9 ~ Q50 1 0 Repl a ce Y board S HORT Q5 01 2 ~ Q50 1 5 Q5 01 7 ~ Q50 2 4 Y- MAIN Check X- main Normal St ate Trouble Shooting < Y- MAIN BOARD> Samsung Electronics...
  • Page 70 Re pla ce the b oard F40 0 2 for Vdd Repla ce the bo ard Q4 00 9 ~ Q40 1 6 X- MAIN Check Logic- main Nor mal S t ate T rouble Shooting < X- MAIN B OARD> Samsung Electronics...
  • Page 71 Action of Vs ync on LOGIC- MAIN is n’t normal. [ Logic Main ] LED (LD2 000 ) blinks (action of Vsync) regula r Logic Main abnorma l Norma l State pattern T rouble Replac e PDP Replac e b oard Shooting <LOGIC - MAIN BOARD> Samsung Electronics...
  • Page 72 The r e ’s a de fec t on FPC s t a t u s Done ( D e f e ct is fr om buff e r ) Trou ble Shooting < FPC > Samsung Electronics...
  • Page 73 Re pl a c e Log i c Mai n Rep l a ce / A ddr e s s Bu ffer PD P (E or F or G)/ FFC DONE < LOGIC - MAIN > < E,F ,G ADDRES S BUFF ER B OARD > 7-10 Samsung Electronics...

  • Page 74: Logic Board

    Troubleshooting 7-2 Logic Board 7-2-1 Terms and Description of the Logic Board Samsung Electronics 7-11...
  • Page 75 Check the Fuse Check the Detailed Waveforms Replace the 256K and (Switch to the Internal Pattern.) examine the PDP unit Check the Power Unit Inductor Check the Internal Pattern Check the Detailed Waveforms (Refer to the Inspection Guide) 7-12 Samsung Electronics...
  • Page 76 O F F Connect Probe 1 as illustrated and set it to trigger. 1 2 3 4 Using Probe 2, analyze the waveforms at each point. 2 , 4 Outside 42 SD O F F 1 2 3 4 Samsung Electronics 7-13...
  • Page 77 $Verify each waveform of the Logic Main Board and compare them to waveforms shown below. Each and every waveform should be verified. %After finishing, turn off the power. ^When the inspection is finished, set SW2001 to the External Pattern. 7-14 Samsung Electronics...

  • Page 78: Basic Description

    Aim the remote control towards this spot on the - VOL + PDP. - Volume adjustment. - Adjust an option value respectively. VOL + : Enter to the selected menu.) … † Control the cursor in the menu. Press to turn the PDP on and off. Samsung Electronics...
  • Page 79 Connect the supplied power cord. Connect for input of an Analog RGB or Y/Pb/Pr video signal from in PC, DVD, or HD devices. ¨ PC Mode from this page onward means PC1/PC2 mode using RGB1(PC1) and RGB2(PC2) . Samsung Electronics...
  • Page 80 - SIZE SELECTION (SIZE) - LOCATION SELECTION (LOCATE) - INPUT SOURCE SELECTION (SOURCE) - INTERCHANGE THE MAIN AND THE SUB PICTURE (SWAP) - SOUND SELECTION (S.SEL) ¨ The performance of the remote control may be affected by bright light. Samsung Electronics...

  • Page 81: Assembling The Stand-Base

    Two or more people should carry the PDP. ¨ Never lay the PDP on the floor because of possible damage to the screen. Always store the PDP upright. Samsung Electronics...

  • Page 82: Installing The Display On The Wall Attachment Panel

    The wall mount bracket is delivered PDP attached to bracket in the direction of the separately. Please tighten the captive arrow. screw in the direction of the arrow after assembling the bracket. The angle can be adjusted from 0¡ to 20¡ by –2¡. Samsung Electronics...
  • Page 83 Put the 4 pegs on the PDP in the grooves of the wall mount bracket and pull down on the PDP ( ) to secure it to the wall mount bracket (@). Tighten the screws as shown (#) so that the PDP cannot be separated from wall mount bracket. PDP panel Wall Wall attachment panel bracket Samsung Electronics...

  • Page 84: Connecting Speakers

    When moving your PDP, do NOT hold the speaker connected to your PDP. It may damage the bracket clamping the speaker and your PDP together and result in a drop of your PDP and a risk of personal damage and injury. Samsung Electronics...
  • Page 85 MEMO Samsung Electronics...
  • Page 86 Anode where discharge of DC panel has little contribution to light output power. Back ground luminance : Referring to the panel luminance in off mode or black screen, in other words, luminance in the vicinity of the screen. Samsung Electronics...
  • Page 87 (x, y). Here x=X/(X+Y+Z), y=Y/(X+Y+Z). Method for colors, known as (u, v), where image colors are expressed in more even color dimension. Colors of matter are expressed as color coordinates pair (u, v). Here, u=4X/(X+15Y+3Z), y=6Y/(X+15Y+3Z). Samsung Electronics...
  • Page 88 • CG - ratio of white luminance to black luminance in successive arrangement of white and black lines at equal distance. • CL - ratio of white luminance to black luminance in white line against black screen of black line against white screen. • CR - the ratio of white luminance to black luminance. Samsung Electronics...
  • Page 89 Discharge electrode : Another term for sustained electrode. Discharge efficiency : Another term for gloss efficiency Discharge gap : The gap among sustained electrodes in discharge space of three-electrode plasma panel. Discharge slit : (Refer to discharge gap) Samsung Electronics...
  • Page 90 Effcacy : Refer to luminous efficacy. Energy recovery circuit : Circuit degauss caught after reusing the power that drove AC plasma panel. Erase : Process where cells are erased from AC plasma panel. Erase pulse : Cell erasing waveform Samsung Electronics...
  • Page 91 The range of luminance acquired when displayed from black to white. High strain point glass : Glass of which strain point (temperature with viscosity of 1014.5 poise) is relatively high Image retention : Continuous existence of image after the stimulation is removed. Samsung Electronics...
  • Page 92 Plasma display panel made up of matrix with rows and columns. Matrix type : Refer to matrix PDP Maximum firing voltage : Voltage value required for triggering discharge in all cells. Maximum sustain voltage : Maximum drive voltage required not to turn off the cells. Samsung Electronics...
  • Page 93 Traditional two-electrode plasma panel structure where discharge occurs between the two sustained elec- trodes across from each other. Opposed discharge PDP : (Refer to opposed discharge.) Peak luminance : Maximum luminance generated in one pixel in panel. Peak luminance enhancement : Circuit and drive technology that accommodates increasing peak luminance. Samsung Electronics...
  • Page 94 Rear substrate : Efficiency measurement that is directly expressed with the number of output particles against the number of input particles. In case of plasma panel, the number of photons in visible area, generated from photons in ultraviolet area Samsung Electronics...
  • Page 95 Plasma display in the form where stimulating discharge occurs for discharge process precedes below panel. Self-scan type PDP : Plasma display in the form where stimulating discharge occurs for discharge process precedes below panel. Self-shift type PDP : Process of combining substrates. High temperature process that melts solder glass combining substrates. 9-10 Samsung Electronics...
  • Page 96 Data electrodes in opposite substrates provide unique writing and erasing signals to each cell Time modulation driving method (Other terms: time division multiplex method) : Modulation method in proportion to certain time applied to stimulation with regular output. Output strength is changed according to input time. Samsung Electronics 9-11...
  • Page 97 Curve expressed with wall transfer that is caused by any changes in electric charges including wall charges and wall charge pulse related parameters. White back : White coating for minimize absorbing valid gloss, located black contrast improvement layer and fluores- cent material. Write electrode : (Refer to data electrode.) 9-12 Samsung Electronics...
  • Page 98 Glossary Write electrode : (Refer to data electrode)[symbol : Pw] Write electrode : (Refer to data electrode)[symbol : Vw] Samsung Electronics 9-13...
  • Page 99 MEMO 9-14 Samsung Electronics...
  • Page 100 Schematic Diagrams 10. Schematic Diagrams 10-1 ANALOG 1 This Document can not be used without Samsung’s authorization. TP01 Analog - Digital Board Connector TP01 S-Video TP03 TP02 TP02 TP03 Video IN Video/S-Video Sound CXA2151Q IC103 COMPONENT1 Samsung Electronics 10-1...
  • Page 101 Schematic Diagrams 10-2 ANALOG 2 This Document can not be used without Samsung’s authorization. 3D COMB FILTER To DC FAN R246 R247 TILT SENSOR FAN PART 50" 10-2 Samsung Electronics...
  • Page 102 Schematic Diagrams 10-3 ANALOG 3 This Document can not be used without Samsung’s authorization. TP04 From SMPS Board TP04 TP05 TP05 TP06 TP07 TP06 TP07 External Speaker BD701 MONITOR OUT VIDEO +12V_AMP MONITOR OUT SOUND Samsung Electronics 10-3...
  • Page 103 Schematic Diagrams 10-4 ANALOG 4 This Document can not be used without Samsung’s authorization. 74HCT573 74HCT573 10-4 Samsung Electronics...
  • Page 104 Schematic Diagrams 10-5 CONTROL This Document can not be used without Samsung’s authorization. AA32-00013B Samsung Electronics 10-5...
  • Page 105 Schematic Diagrams 10-6 SMPS 1 This Document can not be used without Samsung’s authorization. 10-6 Samsung Electronics...
  • Page 106 Schematic Diagrams 10-7 SMPS 2 Samsung Electronics 10-7...
  • Page 107 Schematic Diagrams 10-8 SMPS 3 10-8 Samsung Electronics...
  • Page 108 Schematic Diagrams 10-9 SMPS 4 Samsung Electronics 10-9...
  • Page 109 Schematic Diagrams 10-10 DIGITAL 1 Analog - Digital board TP08 Connector 42 SD 42 HD 50,63 HD TP09 TP10 TP08 TP09 TP10 PC(D-SUB&DVI) SOUND 10-10 Samsung Electronics...
  • Page 110 Schematic Diagrams 10-11 DIGITAL 2 This Document can not be used without Samsung’s authorization. TP18 TP11 TP19 TP12 TP13 TP14 TP15 TP16 TP14 TP19 TP11 TP15 TP18 TP16 TP12 TP17 TP13 TP17 10-11 Samsung Electronics...
  • Page 111 Schematic Diagrams 10-12 DIGITAL 3 This Document can not be used without Samsung’s authorization. TP20 BNC Connector PC D-SUB TP21 TP22 TP23 TP24 TP23 TP22 TP24 ANALOG EDID EPROM TP21 TP20 From SMPS board 10-12 Samsung Electronics...
  • Page 112 Schematic Diagrams 10-13 DIGITAL 4 This Document can not be used without Samsung’s authorization. TP25 USER EPROM (256K) TP26 TP26 TP25 Flash Memory B12 : 1204-002105 From Remote Control board RS232C OUT RS232C IN Samsung Electronics 10-13...
  • Page 113 Schematic Diagrams 10-14 DIGITAL 5 This Document can not be used without Samsung’s authorization. TP27 TP28 TP27 TP28 10-14 5-15...
  • Page 114 Schematic Diagrams 10-15 DIGITAL 6 This Document can not be used without Samsung’s authorization. LVDS Connector 5-15 10-15...
  • Page 115 Schematic Diagrams 10-16 DIGITAL 7 This Document can not be used without Samsung’s authorization. 10-16 Samsung Electronics...
  • Page 116 Schematic Diagrams 10-17 DIGITAL 8 This Document can not be used without Samsung’s authorization. DVI Connector DIGITAL EDID EPROM Samsung Electronics 10-17...

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