1. INTRODUCTION ..................................................................... 3
1.1 Purpose ........................................................................................................3
2. PERFORMANCE ...................................................................... 5
2.1 Product Name ............................................................................................5
2.4 HW Features ...............................................................................................6
2.5 HW SPEC. ................................................................................................. 10
3.1 CIC FAQ ...................................................................................................... 25
4.1 RF Component ....................................................................................... 41
4.2 SIGNAL PATH ........................................................................................... 44
4.13 Touch trouble .....................................................................................139
LGE Internal Use Only
Table Of Contents
5. DOWNLOAD ....................................................................... 172
6. BLOCK DIAGRAM ............................................................... 189
8. BGA PIN MAP .................................................................... 224
9. PCB LAYOUT ....................................................................... 236
10. CALIBRATION ................................................................... 238
12.1 EXPLODED VIEW ................................................................................265
12.3 Accessory .............................................................................................313
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