Table of Contents
Advertisement
Figure 1. Simulation Model Components
82443BX
IBIS
4.0
Details of the Electrical Interconnect Models
This section provides detailed information on the electrical interconnect models used for the
simulation. Table 2 lists the assumed characteristics for the Low-Power Module, the SE board, and
the DIMM interface, for fast, slow, and worst-case signal quality models.
Table 2.
Fast, Slow, and Worst-Case Signal Quality Corner Interconnect Models
Component
Low-Power Module
SE Board
DIMM
Application Note
Low-Power Module Memory Bus Simulation Methodology
TL-1
TL-2
400-pin
Connector
Parameter
Impedance (Z
)
0
Dielectric (E
)
r
Trace Propagation Delay (t
Impedance (Z
)
0
Dielectric (E
)
r
Trace Propagation Delay (t
Impedance (Z
)
0
Dielectric (E
)
r
Trace Propagation Delay (t
TL-3
DIMM
Connector
Fast
Typical
47
55
4.1
4.4
)
138
162
pd
47
55
4.1
4.4
)
138
162
pd
60
70
4.2
4.4
)
133
158
pd
TL-4
TL-5
TL-6
.
.
SDRAM
.
IBIS
A6429-01
Slow
Units
Ω
63
4.8
186
ps/in
Ω
63
4.8
186
ps/in
Ω
80
4.8
183
ps/in
7
Advertisement
Table of Contents
