Sony CXFD-S03CP Service Manual page 63

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• CIRCUIT BOARDS LOCATION
HEADPHONE board
KEY-1 board
PANEL board
TC board
T E
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• Waveforms
– BD90 Board – (CD PLAY)
1
IC101 ia (RFi)
1.3 Vp-p
500 mV/DIV, 500 ns/DIV
2
IC101 wf (XO)
3.3 Vp-p
16.934 MHz
1 V/DIV, 20 ns/DIV
w w w
CFD-S03CP/S03CPL
POWER board
BD90 board
BATTERY-1 board
KEY-2 board
BATTERY-2 board
– MAIN Board – – TC Board – (REC)
1 1
IC1 w; (X OUT) Q300 C
2.2 Vp-p
75 kHz
1 V/div, 10 µ sec/div
1 V/div, 5 µ sec/div
2 2
HRP301 (YEL)
IC801 os (X1)
3.4 Vp-p
5.53 MHz
10 V/div, 10 µ sec/div
1 V/div, 100 nsec/div
x a o
y
. i
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• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
specified.
• f : internal component.
• C : panel designation.
Note:
The components identi-
MAIN board
fied by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specified.
• A : B+ Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
– BD90 Board –
no mark : CD PLAY
– MAIN (1/3) Board –
no mark : FM
( ) : AM
– MAIN (2/3), (3/3) and Other Boards –
no mark : FM
( ) : PB
Q Q
< > : REC
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[ ] : CD PLAY
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : FM
3.5 Vp-p
f : AM
E : PB
18.2 µ sec
a
: REC
J
: CD PLAY
• Abbreviation
CND : Canadian model.
CET : East European & Russian model.
E41 : AC 230V area in E model.
E92 : AC 120V area in E model.
AUS : Australian model.
KR : Korea model
35 Vp-p MX : Mexican model.
SP : Singapore model.
IT : Italian model.
18.2 µ sec
AR : Argentina model.
TH : Thai model.
TW : Taiwan model.
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For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• W : indicates side identified with part number.
1 / W or less unless otherwise • : internal component.
f
4
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Note:
Pattern face side:
Les composants identifiés par
(Conductor Side)
une marque 0 sont critiques
Parts face side:
pour la sécurité.
(Component Side) the parts face are indicated.
Ne les remplacer que par une
piéce portant le numéro
C
spécifié.
Q
B E
Q
B C E
Q
B C E
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• Abbreviation
CND : Canadian model.
CET : East European & Russian model.
E41 : AC 230V area in E model.
E92 : AC 120V area in E model.
AUS : Australian model.
KR : Korea model
MX : Mexican model.
SP : Singapore model.
IT : Italian model.
AR : Argentina model.
TH : Thai model.
TW : Taiwan model.
m
c o
.
CFD-S03CP/S03CPL
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Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
These are omitted.
These are omitted.
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