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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TE
L 13942296513
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TABLE OF CONTENTS
1.
2.
3.
3-3. Main Board ...................................................................... 8
3-5. BD83S Board .................................................................. 9
3-7. Panel Board ..................................................................... 10
3-8. CD Lid ............................................................................. 10
3-10. TC Board ......................................................................... 11
3-12. Power Board .................................................................... 12
4.
5.
Tape Section .................................................................... 13
Tuner Section ................................................................... 14
CD Section ...................................................................... 16
6.
3
6 7
1 3
1 5
7.
8.
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CFD-S03CP/S03CPL
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