FUNAI D8B-M1000ZB Service Manual page 9

3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when removing
it.
CBA
Masking
Tape
Tweezers
With Soldering Iron:
(1) Using desoldering braid, remove the solder from all
Hot-air
Flat Pack-IC
Desoldering
Machine
Flat Pack-IC
Fig. S-1-2
(2) Lift each lead of the flat pack-IC upward one by
(3) Bottom of the flat pack-IC is fixed with glue to the
(4) Release the flat pack-IC from the CBA using twee-
With Iron Wire:
(1) Using desoldering braid, remove the solder from all
(2) Affix the wire to a workbench or solid mounting
(3) While heating the pins using a fine tip soldering
1-4-2
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
Flat Pack-IC
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Fine Tip
Soldering Iron
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
zers. (Fig. S-1-6)
pins of the flat pack-IC. When you use solder flux
which is applied to all pins of the flat pack-IC, you
can remove it easily. (Fig. S-1-3)
point, as shown in Fig. S-1-5.
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA con-
tact pads as shown in Fig. S-1-5.
Desoldering Braid
Soldering Iron
Fig. S-1-3
Sharp
Pin
Fig. S-1-4
DVD_NOTE