LG MG150 Service Manual
  1. Manuals
  2. Brands
  3. LG Manuals
  4. Cell Phone
  5. MG150
  6. Service manual
LG MG150 Service Manual

LG MG150 Service Manual

Hide thumbs
Table of Contents

Advertisement

Quick Links

Download this manual
Service Manual
MG150
Date: August, 2005 / Issue 1.0

Advertisement

Table of Contents
loading

Related Manuals for LG MG150

Summary of Contents for LG MG150

  • Page 1 Service Manual MG150 Date: August, 2005 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the MG150.

  • Page 4: Table Of Contents

    Table of Contents 1. Introduction ........5 4.8. Receiver Trouble........53 4.9. Microphone Trouble ......57 1.1 Purpose........... 5 4.10. Vibrator Trouble ......... 59 1.2 Regulatory Information......5 4.11. Keypad Backlight Trouble ....60 4.12 FOLDER Open/Close Trouble .... 62 2.
  • Page 5 12. EXPLODED VIEW & REPLACEMENT PART LIST..111 12.1 EXPLODED VIEW ......111 12.2 Replacement Parts ......113 <Mechanic component>....113 <Main component> ......116 12.3 Accessory ......... 126 - 4 -...

  • Page 6: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the MG150 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
  • Page 7 1. Introduction E. Notice of Radiated Emissions The MG150 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
  • Page 8 1. Introduction Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milliwatt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electoluminescence Electroluminesc Electrostatic Discharge FPCB Flexible Printed Circuit Board GMSK...
  • Page 9 1. Introduction Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating Travel Adapter Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator DCXO Digitally Control Crystal Oscillator Wireless Application Protocol...

  • Page 10: General Performance

    2. General Performance 2. General Performance 2.1 Product Name MG150: Support GPRS (Class 10) 2.2 Supporting Standard Item Feature Comment GSM850/PCS1900/DCS1800 with seamless handover Supporting Standard Phase 2+(include AMR) SIM Toolkit : Class 1,2,3,A~E GSM850 TX : 824 - 849 MHz...

  • Page 11: H/W Features

    2. General Performance 2.4 H/W Features Item Feature Comment Form Factor Dual LCD Folder 1) Capacity Standard : Size: 34.15 53.55 5.7 mm Battery Li-ion, 830mAh, Weight: 30g 2) Packing Type : Hard Pack Standard : 88 × 46 × 24.3 Size Weight 96.5 gram...
  • Page 12 2. General Performance Status Indicator Keypad Alpha/numeric Key : 10 Function Key : 14 Side Key : 2 Total # of Keys : 26 Fixed Type System connector 24 Pin Ear Phone Jack 3 Pole (2.5mm) PC synchronization Memory Flash : 128Mbit SRAM : 64Mbit Speech coding FR, EFR, HR,AMR...

  • Page 13: S/W Features

    2. General Performance 2.5 S/W Features Item Feature Comment RSSI 0 ~ 5 Levels Battery Charging 0 ~ 4 Levels Key Volume 0 ~ 5 Level Audio Volume 1 ~ 5 Level Time / Date Display NITZ Multi- Language English / Spanish / France Phone Book / Web Access/ Quick Access Mode Sound / Message / IM /...
  • Page 14 2. General Performance Game Java Game Calendar Memo World Clock Unit Convert Length/Surface/Volume/Weight Fax & Data Wall Paper Default 4ea WAP Browser WAP 2. 0 Openwave 6.2 Download Melody / Over WAP Wallpaper SIM Lock Operator Dependent SIM Toolkit Class 1, 2, 3, A - E Openwave MMS Client EONS CPHS...

  • Page 15: H/W Circuit Description

    3. H/W Circuit Description 3. H/W Circuit Description 3.1 General Description The RF part consists of a transmitter, a receiver, a synthesizer, a voltage supply and a DCXO part. And the main RF Chipset Aero I+ is a single-chip triple-band transceiver for the extended global system for mobile communication [GSM850MHz] /Digital communication system [PCS1900MHz] voice and data transfer applications.
  • Page 16 3. H/W Circuit Description 3.2.1. RF Front End Antenna switch and dual saw filters are integrated in FEM (F400). The Received RF signals (GSM 869MHz ~ 894MHz, PCS 1930MHz ~ 1990MHz), DCS(1710MHz ~ 1880 MHz) are fed into the antenna and Mobile switch. An antenna matching circuit is between the antenna and the mobile switch.
  • Page 17 3. H/W Circuit Description 3.2.3. Synthesizer The RF main chipset includes a fully integrated VCO with an on-chip LC tank. A fractional-N synthesizer can phase lock the local oscillator used in both transmit and receive path to a precision frequency reference input. The fractional-N operation offers low phase noise and fast setting times, allowing for multiple slot applications such as GPRS.

  • Page 18: Transmitter Part

    3. H/W Circuit Description 3.3 Transmitter Part The transmit (TX) section consists of an I/Q baseband upconverter, an offset phase-locked loop (OPLL), and two 50 output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (1850-1910 MHz) bands.
  • Page 19 3. H/W Circuit Description Fig 4. Block diagram of IF Modulator 3.3.2. PLL The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the GSM 850 and E-GSM 900 bands.

  • Page 20: Power Amplifier

    3. H/W Circuit Description 3.3.3 Power Amplifier The Power Amplifier Module [SKY77325, U406] is a dual-band GSM/PCS power amplifier module that incorporates an indirect closed loop method of power control. The indirect closed loop is fully self- contained and it does not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.
  • Page 21 3. H/W Circuit Description 3.3.4 26MHz Clock RFIGN VDD3 RFIGP VDD2 RFIDN RFIDP RFIPN U401 RFIPP SI4206 GND1 GND7 XTAL1 GND6 XTAL2 GND5 XAFC GND4 NX3225DA X401 26MHz Figure 8. Schematic of DCXO circuit 3.3.5 Power Supplies and Control Signals An external LDO [U405] is used to provide DC power to Buffer [U402] &...

  • Page 22: Digital Baseband (Dbb) Processor

    3. H/W Circuit Description 3.4 Digital Baseband (DBB) Processor Figure 9. Top level block diagram of the Calypso-AMR C035(PD751992GHH) 3.4.1. General Description CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro- Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates.

  • Page 23: Block Description

    3. H/W Circuit Description 3.4.2. Block Description CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus standard as interface with their associated application peripherals. CALYPSO is composed from the following blocks: • ARM7TDMIE : ARM7TDMI CPU core •...
  • Page 24 3. H/W Circuit Description 3.4.3 RF Interface (TPU, TSP Block) Calypso uses this interface to control IOTA_CS(ABB Processor) and AERO(RF Processor) with GSM Time Base Table 3-2. RF Interface Spec. TSP (Time Serial Port) Resource Interconnection Description TSPDO ABB & RF main Chip Control Data TSPEN0 ABB Control Data Enable Signal...

  • Page 25: Sim Interface

    3. H/W Circuit Description 3.3.4. SIM Interface SIM interface scheme is shown in (Figure 10). SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with ABB and the Charge Pump in ABB enables 3V SIM operation. SIM Interface SIM_CLK SIM card reference clock SIM_RST SIM card async/sync reset SIM_IO...
  • Page 26 3. H/W Circuit Description UART MODEM (UART1) Resource Name Description TX_MODEM Transmit Data RX_MODEM Receive Data CTS_MODEM Clear To Send RTS_MODEM Request To Send GPIO 3 Data Set Ready Figure 3-3. UART Interface spec. - 25 -...

  • Page 27: Analog Baseband (Abb) Processor

    3. H/W Circuit Description 3.4.7. GPIO Map In total 16 allowable resources, MG150 is using 13 resources except 3 resources dedicated to SIM and Memory. MG150 GPIO (General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.
  • Page 28 3. H/W Circuit Description • Battery charging control • Switch ON/OFF • 3V SIM card Interface • 4 internal & 4external ADC channels Figure 11. Top level block diagram of the IOTA(TWL3014) - 27 -...
  • Page 29 3. H/W Circuit Description 3.5.2. Audio Signal Processing & Interface The voice codec circuitry processes analog audio components in the voice uplink (VUL) path and applies this signal to the voice signal interface for eventual baseband modulation. In the voice downlink (VDL) path, the codec circuitry changes voice component data received from the voice serial interface (VSP) into analog audio.
  • Page 30 3. H/W Circuit Description 3.5.3. Audio uplink processing The VUL path includes two input stages. The first stage is a microphone amplifier, compatible with electret microphones containing a FET buffer with open drain output. The microphone amplifier has again of typically 25.6 dB ( 1 dB) and provides an external voltage of 2.0 V or 2.5 V to bias the microphone (MICBIAS).
  • Page 31 3. H/W Circuit Description 3.5.4. Audio downlink processing The VDL path receives speech samples at the rate of 8 kHz from the DSP via the VSP and converts them to analog signals to drive the external speech transducer. The digital speech coming from the DSP is first fed to a speech digital filter that has two functions.
  • Page 32 3.5.6. Voltage Regulation (VREG) There are 7 LDO (Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure16) shows the power supply related blocks of DBB/ABB and their interfaces in MG150. - 31 -...
  • Page 33 3. H/W Circuit Description Figure 16. Power Supply Scheme - 32 -...
  • Page 34 3. H/W Circuit Description Output Voltage Usage VRDBB 1.5V Digital Core of DBB VRIO 2.8V Peripheral devices VRMEM 2.8V External memory VRRAM 2.8V LCD & peripheral devices VRABB 2.8V Analog Block of ABB VRSIM 2.85V SIM card driver VRRTC 1.5V RTC &...
  • Page 35 3. H/W Circuit Description 3.5.8. Charging Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of MG150 is as follow. Figure 17. Battery Block Indication 4.2V~3.94V 3.93V~3.78V 3.78~3.70V 3.69V~3.65V 3.64V~3.35V...
  • Page 36 → IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. → CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG. 3.5.10. Memories MG150 using 128Mbit Flash + 64Mbit SRAM with 16 bit parallel data bus thru ADD01 ~ ADD22. 3.5.11. Display & FPCB Interface LCD module include: →...
  • Page 37 3. H/W Circuit Description Pin # NAME Description V_IO 2.8V Power VBACKUP Backup Battery VBAT Battery Power _LCD_RESET Main LCD Reset D(0) LCD Data D(1) LCD Data D(2) LCD Data D(3) LCD Data D(4) LCD Data D(5) LCD Data D(6) LCD Data D(7) LCD Data...
  • Page 38 3. H/W Circuit Description KBC0 KBC1 KBC2 KBC3 KBC4 KBR0 LEFT RIGHT DOWN KBR1 KBR2 VOL_UP KBR3 VOL_DOWN KBR4 SEND Table 3-8. Keypad Map DBB supports 25 Key Map and Switch-ON Key is connected directly to ABB as (Figure18 ). R334 PWON VA320...

  • Page 39: Key Backlight

    3. H/W Circuit Description 3.5.13. Keypad back-light Illumination There are 10 Deep Blue LEDs in Main Board for Keypad Backlight. Keypad Back-light is driven by ‘LEDB’ line from IOTA . KEY BACKLIGHT VBAT -> EDLH0007401 Navi Key Pre charging LEDC LEDB R330 R332...
  • Page 40 Close to MIC Figure 21. Microphone system When a call is established, MICBIAS signal goes up to ‘2.5V’ in the MG150. IOTA(ABB) provides both 2.0V and 2.5V for MICBIAS to circuit designer. VA201, VA202 are employed to enhance ESD immunity.
  • Page 41 3. H/W Circuit Description Head set Jack Interface R220 HOOK_DETECT EAR-MIC V_IO C234 R221 R222 1K R223 5.6K HSMICBIAS R224 C235 C236 4.7u (1608) VA305 C237 C238 C239 CN201 L203 100nH C241 0.1u R225 HSMICP L202 100nH R250 R251 C242 L204 100nH R226 22 C243...
  • Page 42 3. H/W Circuit Description Receiver / Speaker phone Circuits V_IO U202 NLAST4599DFT2G C200 0.1u RCV_P_C COM 5 RCV_P 4 NC VOICEMAIL_EN RCV_P_SW Figure 23. Receiver and Speaker phone mode system switch A single analog switch is employed to support both voice and speaker phone mode with RCV_P. In the speaker phone mode the SPK_EN port sets ‘H’...
  • Page 43 3. H/W Circuit Description MIDI U201 YMU762 F1:408Hz F1:48Hz MCLK CLK1 HPOUT_R LCD_RESET _RST HPOUT_L C201 C202 A(1) R200 R201 33K C203 1000p RCV_P_C MIDI_CS 0.01u C204 MELODY_INT _IRQ D(0:7) R202 R203 150K D(0) F2:20KHz D(1) D(2) VIBRATOR D(3) D(4) D(5) SPOUT1 SPKP...
  • Page 44 3. H/W Circuit Description Receiver and Speaker circuit V_IO C300 C301 VA303 VA302 0.1u 0.1u C302 L300 100nH VBACKUP SPK_RCVN SPK_RCVP L301 100nH LCD_BL_IN LCD_BL_IN LCD_BL_OUT MOTOR CN301 Figure 25. Receiver and Speaker Circuit SPK_RCVP, SPK_RCVN signals from Analog switch are connected to speaker through SPK+ and SPK-.
  • Page 45 3. H/W Circuit Description V_IO LCD CONNECTOR C300 C301 VA303 VA302 0.1u 0.1u C302 L300 100nH C442 VBACKUP SPK_RCVN 270p SPK_RCVP L301 100nH LCD_RESET FILTER6-1 FILTER6-2 D(0) FILTER5-1 FILTER5-2 FILTER6-1 FILTER6-2 D(15) D(1) FILTER4-1 FILTER4-2 FILTER5-1 FILTER5-2 D(14) D(2) FILTER3-1 FILTER3-2 FILTER4-1 FILTER4-2...

  • Page 46: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 Main Components Placement - 45 -...

  • Page 47: Fpcb Components Placement

    4. TROUBLE SHOOTING 4.2 FPCB Components Placement 4.3 Baseband Components - 46 -...

  • Page 48: Main Components (Description)

    4. TROUBLE SHOOTING 4.4 Main Components (Description) MAIN U302 Hall effect switch CN201 Ear-Mic jack CN301 LCD connector U403 UHS DUAL 2-INPUT AND GATE U301 LCD Back Light LED charge pump U401 RF Tranceiver SW401 RF Mobile switch U406 Power Amplifier Module F400 TRIPLE FEM U100...

  • Page 49: Power On Trouble

    4. TROUBLE SHOOTING 4.5 Power On Trouble 4.5.1 Power On Sequence Connecting Battery • Power-On Key Detection • PWON signal goes to ABB and then ABB reset DBB by ON_OFF signal • ON_OFF turn low(1.5V) to HIGH(2.8V) and it resets Calypso 4.5.2 Check Points •...

  • Page 50: Charging Trouble

    4. TROUBLE SHOOTING 4.6 Charging Trouble • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 5.2V • Charging temperature adc range • Charging time : under 3hours -. ~ -5# : not charging operation. •...
  • Page 51 4. TROUBLE SHOOTING Charging Procedure Trouble Shooting Setup • Connecting TA & Charger Detection • Connect Battery & TA to the handset. • Control the charging Current by ABB • Charging Current flows into the Battery Check Points Trouble Shooting Procedure •...

  • Page 52: Lcd Display Trouble

    4. TROUBLE SHOOTING 4.7 LCD Display Trouble FPCB CONNECTOR Check soldering around connector - FPCB CONNECTOR - LCD CONNECTOR LCD Control Signals From Main Board • LEDA, LEDC , MAIN_CS,LCD_RESET, _WR, LCD_ID • A(1), D(0)~L_D(15), IFMODE Check Points • The Assembly status of the LCD Module. •...
  • Page 53 4. TROUBLE SHOOTING START Refer to Power is supplied to Power On Trouble the board? Connection between Reconnect LCD Module and board is OK? Module Resolder the MAIN CN301, FPCB CN1,CN2 MAIN CN301, FPCB is soldered well? CN1,CN2 Paths of LCD control Resolder signals are OK? R301~319...

  • Page 54: Receiver Trouble

    4. TROUBLE SHOOTING 4.8 Receiver Trouble Block Diagram Control SPKP/ Calypso YMU762 (U101) SPKN (U201) SPK_EN Analog SW RCV_SPKP/ (U202) RCV_SPKN RCV_P/ RECEIVER IOTA Analog SW & RC filter (U100) (U203) SPEAKER RCV_N Melody Generation • U201(YMU762,MIDI) is controlled by DBB. •...
  • Page 55 4. TROUBLE SHOOTING Folder FPCB Speaker/ Receiver Check the states these points ! Receiver Trouble Shooting Setup • Initialize GSM MS test equipment. • Connect PIF-UNION and power on. • Make a test call to 112. • Set audio part at test equipment as PRBS or continuous wave, not echo. •...
  • Page 56 4. TROUBLE SHOOTING 4.8.1. Receiver Trouble START Set audio part at test equipment as PRBS or continuous wave, not echo. Set the audio volume max. ABB is out of order. Does sine wave appear Change the board. at L301,L302? Resolder the R236. SPK_EN signal is low? Otherwise change it.

  • Page 57: Speaker Trouble

    4. TROUBLE SHOOTING 4.8.2. Speaker Trouble START Enter into Engineering Mode and → → go to menu "Baseband Alert Ring" Resolder the R236 Does sine wave appear SPK_EN signal is high? otherwise Change it. at L301, L302? Reconnect FPCB to Connection CN301 between FPCB and...

  • Page 58: Microphone Trouble

    4. TROUBLE SHOOTING 4.9 Microphone Trouble Circuit Diagram R212 1K MICBIAS C219 C220 4.7u (1608) R213 2.4K C223 MIC201 MICP C225 0.1u L200 100nH C226 C227 C228 MICN C229 0.1u L201 100nH OBG-415L42-C33R-GB1 C230 R219 Close to ABB Close to MIC - 57 -...
  • Page 59 4. TROUBLE SHOOTING Microphone Signal Flow Check Points • MIC is enable by MICBIAS • Microphone bias • MICBIAS, MICP, MICN signals to ABB • Audio signal level of the microphone • Soldering of components Trouble Shooting Setup • Initialize GSM MS test equipment. •...

  • Page 60: Vibrator Trouble

    4. TROUBLE SHOOTING 4.10 Vibrator Trouble Block Diagram VIBRATOR VBAT VBAT R339 R304 R305 R306 VIBRATOR D301 R307 1SS302 MOTOR Q301 EMZ2 Vibrator Operation • Vibrator is controlled by MIDI chip • When vibrator signal is high, vibrator is enabled Check Points •...

  • Page 61: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.11 Keypad Backlight Trouble Block Diagram KEY BACKLIGHT VBAT -> EDLH0007401 Navi Key Pre charging LEDC LEDB R330 R332 Close to ABB Backlight Operation • The keypad LED backlight is controlled with LEDB signal. • LEDB signal from ABB. •...
  • Page 62 4. TROUBLE SHOOTING START Enter into Engineering Mode and select Keypad On The Voltage ABB is out of order. Check the soldering Of LEDB signal Change the Board. of R349 and R350 is about 0V? Power off and Measure the Resistor Value of all LEDs.

  • Page 63: Folder Open/Close Trouble

    4. TROUBLE SHOOTING 4.12 FOLDER Open/Close Trouble Block Diagram HALL EFFECT S/W V_IO R317 FOLDER C315 OUTPUT 0.1u GND2 C316 0.1u PGND GND1 U302 A3212EEH Folder Operation • There is a magnet to detect the Flip status, opened or closed. •...
  • Page 64 4. TROUBLE SHOOTING Caution! If use PIF jig, the START remote switch is turned off. Folder open status. Not magnetized Resolder the The all paths connected R317 to U302 are OK? ABB is out of order. Pin1 of U302 is 2.8V? Change the Board.

  • Page 65: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.13 SIM Detect Trouble Block Diagram V_IO V_SIM VRSIM DBBSIO SIM_IO DBBSCK SIM_CLK DBBSRST SIM_RST SIMCLK SIM_PWRCTRL S IMIO SIM_CD SIMRST 100k 150p 0.1u ➅ ➃ CN302 ➂ ➀ Connection between SIM and DBB Check Points • SIM_CLK, SIM_IO, SIM_RST •...
  • Page 66 4. TROUBLE SHOOTING START Insert the SIM Card Resolder the The soldering of SIM connector CN302. is OK? The all paths connected Resolder the to CN302 are OK? R336 SIM card is broken. The SIM Card is OK? Change the SIM Card. The ABB(IOTA) is broken.

  • Page 67: Earphone Trouble

    4. TROUBLE SHOOTING 4.14 Earphone Trouble Block Diagram EAR_JACK SPEC Receiver R220 HOOK_DETECT EAR-MIC V_IO C234 R221 R222 1K R223 5.6K HSMICBIAS R224 C235 C236 4.7u (1608) VA305 C237 C238 C239 CN201 L203 100nH C241 0.1u R225 HSMICP L202 100nH C242 R250 R251...
  • Page 68 4. TROUBLE SHOOTING - 67 -...
  • Page 69 4. TROUBLE SHOOTING cf) PRBS : Pseudo Random Bit Sequence START Insert the earphone into the headset. Does the Audio profile change 1. Earphone detection problem to the earphone mode? Set the audio part of test equipment to PRBS or continuous wave mode Can you Resolder the...
  • Page 70 4. TROUBLE SHOOTING 1. Earphone detection problem The Voltage The soldering Resolder the at HOOK_DETECT point Of R226 R226 is 0V? is OK? Pin3 and Pin4 of CN201 Change the CN201. are open? The ABB is out of order. Change the board. - 69 -...
  • Page 71 4. TROUBLE SHOOTING 2. Sending Path problem Set audio part of the test equipment to the echo mode. The voltage at R224 Resolder the is 0.99V ~ 1.03V? R221,R224 A few tens or hundreds Resolder soldering of C233 of mV of signals at C233 the C233 is OK? are measured ?

  • Page 72: Rf Part Troubleshooting

    4. TROUBLE SHOOTING RF Part Troubleshooting RF Components Figure 27. RF Components Table . RF Components Reference Description Reference Description SW401 Mobile S/W U405 LDO(Voltage Regulator) F400 X401 DCXO(26MHz) U402 Triple Buffer U406 U401 Tranceiver - 71 -...
  • Page 73 4. TROUBLE SHOOTING Trouble Shooting of Receiver Part Checking Flow Checking Points Setup Test Equipment ➃ GSM850 : 190ch Rx Level : -60dBm PCS1900 : 660ch, Rx Level : -60dBm ➃ ➀ Check Point ➂ ➀ ➁ ➄ ➁ Check Point DCXO Figure 28.
  • Page 74 4. TROUBLE SHOOTING Checking LDO Circuit Checking Flow Checking Points Check Pin 1 3.4 ~ 4.2 V ? Check Battery U405 Pin 3 High ? Check DBB[U101] Replace Regulator Pin 5 2.85V ? [U405] Regulator Circuit is OK. See next page to check DCXO Circuit.
  • Page 75 4. TROUBLE SHOOTING Checking DCXO Circuit Checking Points Checking Flow Check LDO Output X401 Check 2.85 V ? Regulator Circuit ≡ C429 0.9V ? Check ABB[U100] Replace DCXO ≡ Pin 3 26MHz ? [X401] PIN4 PIN3 DCXO Circuit is OK. Crystal Output Crystal Input VCTCXO Circuit Diagram...
  • Page 76 4. TROUBLE SHOOTING Checking RF Chipset Control Signal Checking Points Checking Flow Check Control Signal DATA S_EN U403 CLK is Normal ? Check DBB[U101] DATA / S_EN Check DBB[U101] Is Normal ? Control Signal is OK. Control Signal Circuit Diagram Waveform XTAL1 XTAL2...
  • Page 77 4. TROUBLE SHOOTING Checking Mobile SW & FEM Circuit Checking Points SW401 GSM850 RX DCS RX F400 PCS RX GSM850 TX DCS/PCS Mobile S/W & FEM Circuits Diagram SW401 KMS-507 OUT1 L401 2.2nH C490 C404 L402 1.2p 4.7nH C411 C416 100p DCS_PCS_TX GSM850_TX...
  • Page 78 4. TROUBLE SHOOTING Checking Flow Check Pin 1,2 of SW401 with Replace SW401 RF Cable : Open ? For This RF level test case, Rx Stand alone mode Is needed GSM850 ? VC1 : Low Redownload VC2 : Low The Phone S/W VC3 : Low Check RF Level of FEM Output...
  • Page 79 4. TROUBLE SHOOTING Checking Rx IQ Circuit Checking Points Checking Flow Check I/Q Signals Replace RF Signals are Normal ? Transceiver[U401] RX Part is OK. Check Base Band Circuit RXQP or Redownload the software RXIP RXQN and Calibrate again. RXIN Rx IQ Circuit Waveform RXQP...

  • Page 80: Trouble Shooting Transmitter Part

    4. TROUBLE SHOOTING Trouble Shooting Transmitter Part Checking Flow Checking Points Setup Test Equipment ➅ GSM850 : 190ch, 5 Level PCS1900 : 660ch, 0 Level ➅ ➀ Check Point ➀ ➁ Check Point ➂ DCXO ➁ ➃ ➂ Check Point RF Chipset Contrrol Signal ➃...
  • Page 81 4. TROUBLE SHOOTING Checking LDO Circuit - See RX Part “Check LDO Circuit” Checking DCXO circuits - See RX Part “Check DCXO Circuit” Checking RF Chipset Control Signals - See RX Part “Check RF chipset control signal” - 80 -...
  • Page 82 4. TROUBLE SHOOTING Checking Tx IQ signals Checking Points Checking Flow Signals are Normal ? Check ABB[U100] Base Band signal is OK. See next page to check Transceiver Output Signal. TXIP TXQP TXTN TXQN Tx IQ Circuit Diagram Waveform RXQP RXQN RXIP RXIN...
  • Page 83 4. TROUBLE SHOOTING Checking PAM Circuits Checking Points Checking Flow Check Output Signal GSM850 Out U406 Replace RF PCS1900 Out Signals are Normal ? Transceiver[U406] DCS 1800 Transceiver is OK. See next page to check PAM Control Circuit. Tx PAM Circuit Diagram U406 SKY77325 RSVD...
  • Page 84 4. TROUBLE SHOOTING Tx PAM Circuit Diagram - 83 -...
  • Page 85 4. TROUBLE SHOOTING Checking Mobile S/W & FEM circuits - See RX Part “Check Mobile S/W & FEM circuit” Checking Flow Check Pin 1,2 of SW401 with Replace SW401 RF Cable : Open ? GSM850 ? PCS ? VC1 : Low VC1 : Low VC2 : Low VC2 : Low...

  • Page 86: Download

    5. DOWNLOAD 5. DOWNLOAD 5.1 Download Setup 5.1.1 In case of using the Data kit Figure 11. Top level block diagram of the IOTA(TWL3014) Preparation • Target Handset • Data kit • Battery • IBM compatible PC supporting RS-232 with Windows 98 or newer If you use data kit, you should have a battery with the voltage above 3.7V.

  • Page 87: Download Procedure

    5. DOWNLOAD 5.2 Download Procedure 1. Execute Fluid_GUI.exe and select “Erase/Program flash” menu. - 86 -...
  • Page 88 5. DOWNLOAD 2. Click the “Add” button. Then, choose m0 file which is going to download. - 87 -...
  • Page 89 5. DOWNLOAD 3. You must choose three programming options in programming options box. One is to decide whether you erase entire flash. If m0 file which is going to download have the change of pcm structure for current target’s m0 file, you must erase entire flash memory. The second programming option is to decide whether you erase bootloader.
  • Page 90 5. DOWNLOAD 4. Press “Global Settings” menu. Choose a correct serial port and set the configuration as below. - 89 -...
  • Page 91 5. DOWNLOAD 5. After checking programming options, Click “Erase/Program” button. If you click “Erase/Program” button, you will be able to see that “(reset target)” is displayed in the “Output” window. And then if you push shortly the “Power key” of the mobile, downloading will be started. - 90 -...
  • Page 92 5. DOWNLOAD 6. Wait for downloading to be finished. - 91 -...
  • Page 93 5. DOWNLOAD 7. If downloading is finished, we can switch on the mobile. When you switch on the mobile first time after downloading, you must not remove the battery until switch-on procedure is completed. If you remove the battery before switch-on procedure is completed, we will not be able to save user data in the flash memory of the mobile.

  • Page 94: Service And Calibration

    6. SERVICE AND CALIBRATION 6. SERVICE AND CALIBRATION 6.1 Service S/W 6.1.1 Overview This service S/W is used for Calibration and Standalone test. 6.1.2 Hardware and Software Environment • More than 486 computer • 16Mbyte RAM • Remained more than 10Mbyte in Hard Disk Memory •...
  • Page 95 6. SERVICE AND CALIBRATION A. Target System Frame This is for initializing the target phone. When you use this program to test L1100 phone, you have to initialize target at first. To initialize target phone, select target (L1100 is default) and COM port used at your computer and then click the Initialize button.
  • Page 96 6. SERVICE AND CALIBRATION C. TX APC Test Frame At this part, you can control transmit path of target phone. Serving Freq. Setting (TCH) You can set TCH of phone. The number means ARFCN of Traffic channel. Beacon Freq. Setting (BCH) You can set BCH of phone.

  • Page 97: Calibration

    6. SERVICE AND CALIBRATION E. User Command and Results Frame Whenever you click button or make some event in service software, every ordered event is displayed in this frame. You can also see calibration results here. F. Ramp shape button This button is for burst shape table.

  • Page 98: Equipment Setup

    6. SERVICE AND CALIBRATION 6.2.3 Equipment Setup GSM Test Set(8960) GPIB Cable Mobile Switch Cable Power Supply GPIB Cable Battery Simulator Figure 6-1 Calibration Equipment List 6.2.4 Calibration steps A. RX Calibration In order for the RSSI measurements to be within the GSM specifications, some calibration is necessary.
  • Page 99 6. SERVICE AND CALIBRATION f) Click the PM Start button. g) Repeat above procedure until the displayed number in Power Measurement window is 12. h) Click the Calculate button, then the service software calculate the channel compensation parameters. i) Saving updated calibration data into phone by clicking Calib Saving button. NOTE If the calibration does not done for all channels, 9 channels for GSM850 and 6 channels for PCS1900, the service software reports, “Please execute after measuring the PM”.

  • Page 100: Test Jig Operation

    6. SERVICE AND CALIBRATION Procedure a) Initialize phone by clicking Initialize button. b) Set the BCH and TCH of the phone 190 for GSM850 and 661 for PCS1900. Of cause you have to match test equipment’s BCH and TCH ARFCN with this value. For each power level, adjust the DAC value to get target power and click Test button.

  • Page 101: Block Diagram

    7. BLOCK DIAGRAM 7. BLOCK DIAGRAM The Block Diagram of the Baseband Part LCD MODULE LCD MODULE Memory (AM50DL128CH) Connec tor MIDI Speaker / Receiver YMU788 (Calypso) (Calypso) Analog Vibrator Backup Battery (IOTA) (IOTA) Ear_Mic Ear_Mic jack Charging Block I/ O Connector : SIGNAL Battery Data Cable, ...
  • Page 102 7. BLOCK DIAGRAM The Block Diagram of the RF Part U401/Si4206 100KHz 100KHz GSM850 Baseband (TI ) FL503 U102 SW401 IOT A Mobile ÷ 2:GSM X401 0˚ ˚ / ÷ 2:GSM Switch 0˚ ˚ / DCXO 90˚ ˚ 90˚ ˚ ÷...
  • Page 103 - 102 -...

  • Page 104: Circuit Diagram

    Sheet/ KBC(0:4) Sheets MODEL MG150 KBR(0:4) 05/05/10 Designer JTAG _F_WE Checked TDO_0 DRAWING NAME TDO_1 TDO_ARM Approved RPWON RPWON VBAT VBAT JTAGEN _BSCAN DRAWING Rev_1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 103 -...
  • Page 105 100nH DRAWING R226 C243 C244 C240 AUDIO (1608) C245 C250 0.1u NAME 0.1u R228 Approved ADIN1 C216 Close to ABB Close to Ear-jack DRAWING Rev_1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 104 -...
  • Page 106 Sheets MODEL MG150 05/05/10 VA308 Designer KBR(0) Checked DRAWING VA309 etc. KBC(0) NAME KBC(1) Approved KBC(2) KBC(3) KBC(4) DRAWING VA313 VA314 VA315 VA316 VA317 Rev_1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 105 -...
  • Page 107 RF_EN 05/10 4.7u C439 0.01u Designer J.W. JEONG MIC5255-2.85BM5 2005 C440 C441 4.7u Checked B.Y. YANG DRAWING RF (Hitachi) NAME Approved H. KANG DRAWING Iss. Notice No. Date Name Rev_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 106 -...

  • Page 108: Pcb Layout

    9. PCB LAYOUT - 107 -...
  • Page 109 9. PCB LAYOUT - 108 -...

  • Page 110: Engineering Mode

    10. ENGINEERING MODE 10. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*# “Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’...

  • Page 111: Standalone Test

    11. STANDALONE TEST 11. STANDALONE TEST 11.1 Setting Method 11.1.1 COM Port In the “Dialog Menu”, select the values as explained below. • Port : select a correct COM port • Baudrate : 115200 • Leave the rest as default values 11.1.2 Tx Test 1.

  • Page 112: Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW - 111 -...
  • Page 113 - 112 -...

  • Page 114: Replacement Parts

    MGAD00 GASKET,SHIELD FORM MGAD0082801 C1500 Gold MGAD01 GASKET,SHIELD FORM MGAD0082901 C1500. Gasket for ground between fpcb and lower. Gold MMAA00 MAGNET,SWITCH MMAA0000601 LG-G510,511,512 common use, DIA : 3.0mm+1.5t Silver MPBG00 PAD,LCD MPBG0032901 C1500 Black MTAA00 TAPE,DECO MTAA0081101 C1500 MTAD00 TAPE,WINDOW...
  • Page 115 Level Description Part Number Specification Color Remark MTAA00 TAPE,DECO MTAA0080501 C1500 AWAB WINDOW ASSY,LCD AWAB0015103 MG150 TCLWV. White BFAA00 FILM,INMOLD BFAA0032301 MG510 TCLWV INMOLD FILM MWAC00 WINDOW,LCD MWAC0055601 MG150 SUBWINDOW,LCD GMZZ00 SCREW MACHINE GMZZ0015101 1.4 mm,3.0 mm,MSWR3(FN) ,N ,+ ,- ,...
  • Page 116 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MLAZ00 LABEL MLAZ0041302 MG150 FCC ID LABEL - 115 -...

  • Page 117: Main Component

    SACD0024501 CONNECTOR, ENBY0027409 40 PIN,0.4 mm,ETC ,AU ,H:1.5MM BOARD TO BOARD SPCY PCB,FLEXIBLE SPCY0049301 POLYI ,0.4 mm,MULTI-4 ,C1500 FPCB SAFY00 PCB ASSY,MAIN SAFY0136401 MG150 TCLWV White Silver SAFB00 PCB ASSY,MAIN,INSERT SAFB0043302 Silver ADCA00 DOME ASSY,METAL ADCA0033001 C1500. White ADCA01 DOME ASSY,METAL...
  • Page 118 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C112 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C113 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C114 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C115 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C117 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP C118 CAP,CERAMIC,CHIP ECCH0006201...
  • Page 119 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C226 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C227 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C228 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C229 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C230 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C233 CAP,CERAMIC,CHIP ECCH0007801...
  • Page 120 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C410 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C411 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C412 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C413 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C414 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C415 CAP,CERAMIC,CHIP ECCH0000110...
  • Page 121 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark CN302 CONN,SOCKET ENSY0015601 6 PIN,ETC , ,2.54 mm,H=3.1 CN303 CONNECTOR,I/O ENRY0002202 24 PIN,0.5 mm,ETC ,AU ,OFFSET TYPE D200 DIODE,SWITCHING EDSY0012101 US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t) F301 FILTER,EMI/POWER SFEY0006401...
  • Page 122 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R112 RES,CHIP ERHY0000272 43K ohm,1/16W,J,1005,R/TP R113 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R114 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R115 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R116 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R118 RES,CHIP ERHY0000261...
  • Page 123 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R224 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP R225 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R226 RES,CHIP ERHY0000208 22 ohm,1/16W,J,1005,R/TP R300 RES,CHIP ERHY0000287 220K ohm,1/16W,J,1005,R/TP R301 RES,CHIP ERHY0000260 9.1K ohm,1/16W,J,1005,R/TP R302 RES,CHIP ERHY0000201...
  • Page 124 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R410 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP R411 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP R412 RES,CHIP ERHY0000239 820 ohm,1/16W,J,1005,R/TP R413 RES,CHIP ERHY0000263 15K ohm,1/16W,J,1005,R/TP R414 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R415 THERMISTOR SETY0001201...
  • Page 125 X101 X-TAL EXXY0015601 .032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3 X401 X-TAL EXXY0018401 26 MHz,10 PPM,10 pF,10 ohm,SMD ,3.2*2.5*0.7 , SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0054201 MG150 TCLWV White Silver C244 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C315 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C316 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP...
  • Page 126 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark LD310 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED LD311 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED LD312 DIODE,LED,CHIP EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED Q301 TR,BJT,ARRAY EQBA0002701...

  • Page 127: Accessory

    Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark 3.7 V,830 mAh,1 CELL,PRISMATIC ,MG150 SBPL00 BATTERY PACK,LI-ION SBPL0077504 Silver BATTERY(423450), (MEXICO LABEL) SGEY00 EAR PHONE/EAR MIKE SET SGEY0003204...

Table of Contents