LG MG220 Service Manual
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Service Manual
MG220
Date: May, 2006 / Issue 1.0

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Summary of Contents for LG MG220

  • Page 1 Service Manual MG220 Date: May, 2006 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the MG220.
  • Page 3 - 2 -...
  • Page 4: Table Of Contents

    Table of Contents 1. Introduction ........5 5. DOWNLOAD ........89 5.1 Download Setup........89 1.1 Purpose........... 5 5.2 Download Procedure ......90 1.2 Regulatory Information......5 1.3 Abbreviations .......... 7 6. SERVICE AND CALIBRATION ..97 2. General Performance...... 9 6.1 Service S/W ...........97 2.1 Product Name .........
  • Page 6: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the MG220 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
  • Page 7 1. Introduction E. Notice of Radiated Emissions The MG220 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
  • Page 8: Abbreviations

    1. Introduction 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: VRAMP Automatic Power Control Base Band Bit Error Ratio CC-CV Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory...
  • Page 9 1. Introduction Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Front End Module Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating Travel Adapter...
  • Page 10: General Performance

    2. General Performance 2. General Performance 2.1 Product Name MG220 : Support GPRS (Class 10) 2.2 Supporting Standard Item Feature Comment < MG220c > GSM850/ EGSM/ DCS/ PCS Tri-Band EGSM/ DCS/ PCS Supporting Standard Phase 2+ < MG220d > SIM Toolkit : Class 1,2,3...
  • Page 11: H/W Features

    2. General Performance 2.4 H/W Features Item Feature Comment Form Factor Dual LCD Folder Capacity Cell Size: Standard Standard: Li-Ion, 830mAh(Min) 50(L) x 34(W) x 4.6(H)mm Battery Packing Type: Inner Pack Size Standard: 86 x 45 x 21.5 mm L x W x H Weight With Battery Main PCB : 8Layers, 1t...
  • Page 12 2. General Performance Item Feature Comment Antenna Internal Type Tri-band System connector 24 Pin Ear Phone Jack 3 Pole (φ2.5mm) PC synchronization CDROM Memory Flash : 128Mbit / SRAM : 64Mbit Speech coding FR, EFR, HR, AMR Data & Fax Built in Data &...
  • Page 13: S/W Features

    2. General Performance 2.5 S/W Features Item Feature Comment RSSI 0 ~ 5 Levels Battery Charging 0 ~ 4 Levels Key Volume 0 ~ 5 Level Keypad Volume 0~5 level Effect sound volume 0~5 level Ring Volume 0~5 level Time/Date Display Text Input Multi-language Schedule/Ring Tone/Phonebook...
  • Page 14 2. General Performance Item Feature Comment Mute Call Divert Call Barring Call Charge Call Duration SMS (EMS) EMS Send/Receive/Save Melody/Picture/Animation WAP Browser WAP 2.0 Java CLDC 1.1 / MIDP 2.0 Wall Paper Max. 10 preset Download Melody/ Over the WAP Wallpaper (MMS) Long Message Max.
  • Page 15: H/W Circuit Description

    3. H/W Circuit Description 3. H/W Circuit Description 3.1 RF Transceiver General Description The RF parts consist of a transceiver part, a power amplifier part, a front-end module part, a voltage supply part, and a VC-TCXO part. The AeroII transceiver is composed of single RF chipset, Si4210-GM[U501] which is a quad-band GSM/GPRS wireless communications.
  • Page 16 3. H/W Circuit Description FL500 U501/Si4210 Front End Module Baseband Baseband EGSM (TI) (TI) EGSM U101 U101 (Calypso +) (Calypso +) U100 U100 X500 (IOTA) (IOTA) VC-TCXO VCO + FREQUENCY VCO + FREQUENCY SYNTHESIZER SYNTHESIZER 26MHz Figure 1. RF Receiver Block 3.2.1.
  • Page 17 3. H/W Circuit Description 3.2.2. Synthesizer The Aero II transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is used only during transmit mode.
  • Page 18: Transmitter Part

    3. H/W Circuit Description 3.3 Transmitter Part The Transmitter part contains the transmitter parts of Si4210-GM[U501], Power Amp Module[U501] and Front End Module[FL500]. The transmit section of Si4210-GM[U501] consists of an I/Q base band up_converter, an offset phase-locked loop(OPLL) and two output buffers that can drive external power amplifiers(PA).
  • Page 19: Power Amplifier

    3. H/W Circuit Description 3.3.1. Power Amplifier The RF3166 [U500] is a quad-band EGSM/ GSM850/ DCS/ PCS power amplifier module that incorporat es an indirect closed loop method of power control. The indirect closed loop is fully self- contained and it do es not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.
  • Page 20: Power Supplies And Control Signals

    3. H/W Circuit Description 3.3.3. Power Supplies and Control Signals An external regulator(U502) is used to provide DC power to RF part. Every RF component except power amp module uses this external regulator. RF2.85V VBAT U502 R1114D281D-TR-F VOUT GND1 RF_EN GND2 C521 C523...
  • Page 21: Digital Baseband (Dbb) Processor

    3. H/W Circuit Description 3.4 Digital Baseband (DBB) Processor Figure 7. Top level block diagram of the Calypso 3.4.1. General Description CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro- - Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates.
  • Page 22: Block Description

    3. H/W Circuit Description 3.4.2. Block Description CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus sta ndard as interface with their associated application peripherals. CALYPSO is composed from the following blocks: • ARM7TDMIE : ARM7TDMI CPU core •...
  • Page 23 3. H/W Circuit Description 3.4.3. RF Interface (TPU, TSP Block) Calypso uses this interface to control IOTA_CS(ABB Processor) and AERO(RF Processor) with GSM Time Base TSP (Time Serial Port) Resource Interconnection Description TSPDO ABB & RF main Chip Control Data TSPDI/IO(4) GPIO4 TSPEN0...
  • Page 24: Sim Interface

    DBBSCK SIM_CLK DBBSRST SIM_RST SIMCLK SIM_PWRCTRL S IMIO SIM_CD SIMRST 100k 0.1u Figure 8. SIM Interface 3.4.5. UART Interface MG220 has two UART Drivers as follow : UART : Hardware Flow Control / Fax & Data Modem - 23 -...
  • Page 25 3. H/W Circuit Description UART MODEM (UART1) Resource Name Description TX_MODEM Transmit Data RX_MODEM Receive Data CTS_MODEM Clear To Send RTS_MODEM Request To Send GPIO 3 Data Set Ready Table 3-5. UART Interface spec. - 24 -...
  • Page 26: Analog Baseband (Abb) Processor

    3. H/W Circuit Description 3.4.6. GPIO Map In total 16 allowable resources, MG220 is using 13 resources except 3 resources dedicated to SIM and Memory. MG220 GPIO (General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.
  • Page 27 3. H/W Circuit Description • Six Low-dropout (LDO), linear voltage regulators targeted core, general I/O, memory I/O, SIM I/O • High voltage (20V) Li-Ion or Ni-MH battery charging control • Voltage detectors (with power-off delay) • Voice Codec Figure 9. Top level block diagram of the IOTA(TWL3025) - 26 -...
  • Page 28 3. H/W Circuit Description 3.5.2. Audio Signal Processing & Interface The audio codec consists of a voice codec dedicated to the GSM application and an audio stereo line. The voice codec circuitry processes analog audio components in the voice uplink (VUL) path and applies this signal to the voice signal interface for eventual baseband modulation.
  • Page 29 3. H/W Circuit Description 3.5.3. Audio uplink processing The VUL path includes two input stages. The first stage is a microphone amplifier, compatible with electric microphones containing an FET buffer with open drain output. The microphone amplifier has a gain of typically 25.6 dB and a bias generator provides an external voltage of 2.0 V to 2.5 V to bias the microphone (MICBIAS terminal).
  • Page 30 3. H/W Circuit Description 3.5.4. Audio downlink processing The VDL path receives speech samples at the rate of 8 kHz/16 kHz from the DSP via the VSP and converts them to analog signals to drive the external speech transducer. The digital speech coming from the DSP is first fed to a speech digital filter that has two functions.
  • Page 31 3.5.6. Voltage Regulation (VREG) There are 7 LDO (Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure14) shows the power supply related blocks of DBB/ABB and their interfaces in MG220. - 30 -...
  • Page 32 3. H/W Circuit Description Figure 14. Power Supply Scheme - 31 -...
  • Page 33 3. H/W Circuit Description Output Voltage Usage VRDBB 1.5V Digital Core of DBB VRIO 2.8V Peripheral devices VRMEM 2.8V External memory VRRAM 2.8V LCD & peripheral devices VRABB 2.8V Analog Block of ABB VRSIM 2.85V SIM card driver VRRTC 1.5V RTC &...
  • Page 34 3. H/W Circuit Description 3.5.8. Charging Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of MG220 is as follow. 3.92V~3.79V 3.79V~3.72V 4.2V~3.93V 3.72V~3.62V Figure 15. Battery Block Indication 1.
  • Page 35 → IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. → CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG. 3.5.10. Memories MG220 using 128Mbit Flash + 64Mbit SRAM with 16 bit parallel data bus thru ADD01 ~ ADD22. 3.5.11. Display & FPCB Interface LCD module include: →...
  • Page 36 3. H/W Circuit Description Connector Interface Spec. Pin # Description Ground L_D(0) LCD Data L_D(1) LCD Data L_D(2) LCD Data L_D(3) LCD Data L_D(4) LCD Data L_D(5) LCD Data L_D(6) LCD Data L_D(7) LCD Data LCD_RESET Reset LCD_ID LCD ID detect L_MAIN_CS MAIN LCD Chip select L_SUB_CS...
  • Page 37 3. H/W Circuit Description 3.5.12. Keypad Switching & Scanning Table 3-10. Keypad Map KBC0 KBC1 KBC2 KBC3 KBC4 KBR0 LEFT RIGHT DOWN KBR1 SUTTER CLEAR KBR2 VOL_UP KBR3 VOL_DOWN KBR4 STAR SHARP SEND DBB supports 25 Key Map and Switch-ON Key is connected directly to ABB as (Figure16 ). R400 PWON KEYPAD...
  • Page 38: Key Backlight

    3. H/W Circuit Description 3.5.13. Keypad back-light Illumination There are 14 Deep Blue LEDs in Main Board for Keypad Backlight . Keypad Back-light is driven by ‘LEDB’ line from IOTA . KEY BACKLIGHT VBAT R417 R418 R419 R420 R421 R422 R423 R424 R425...
  • Page 39 C232 Figure 19. Microphone system When a call is established, MICBIAS signal goes up to ‘2.5V’ in the MG220. IOTA(ABB) provides both 2.0V and 2.5V for MICBIAS to circuit designer. VA202, VA203 are employed to enhance ESD immunity. Main Mic Circuit is same Upper MIC...
  • Page 40: Ear Jack

    3. H/W Circuit Description Head set Jack Interface Ear jack V_IO R209 R208 HSMICBIAS R210 C214 R211 C216 5.6K 4.7u R212 HOOK_DETECT C217 J200 C218 R213 R214 ABB_HSO L200 100nH C219 0.1u R215 R216 HSMICP VA200 VA201 R217 C220 C221 C222 C223 R218...
  • Page 41 3. H/W Circuit Description MIDI SOUND circuit description 40 POLY MELODY CHIP U202 YMU762C-QZ MCLK CLK1 HPOUT_R LCD_RESET _RST HPOUT_L A(1) C200 R200 _MIDI_CS R201 C202 MIDI_SPK_I 0.022u D(0:7) C203 R202 MELODY_INT _IRQ R203 120K D(0) D(1) C204 D(2) VIBRATOR D(3) D(4) D(5)
  • Page 42 3. H/W Circuit Description Receiver and Speaker circuit COMMON MODE SPEAKER DISTRIBUTOR VBAT C201 U200 0.1u NLAS4684FCT1G SPKN SPKP RCV_SPK_SEL RCV_SPK_N COM1 COM2 RCV_SPK_P V_IO U201 C205 DG2011DX-T1-E3 100p MIDI_SPK_I R205 RCV_N C207 SPK_PHN_EN R207 C208 RCV_P 0.1u C213 100p Figure 22.
  • Page 43: Camera Circuit

    3. H/W Circuit Description 3.5.16. Camera Circuit Under camera action mode, MV3018SAQ wholly controls LCD by itself to execute camera functions, while, under bypass mode, MV3018SAQ lets all LCD driver-related signals bypass it, as if it does not exist at all in the system.
  • Page 44 3. H/W Circuit Description CAMERA BACK END CHIP 2V8_BE R702 RVDD1 RVDD2 TP704 LCD_ADS MVDD1 LREN MVDD2 TP705 _LCD_WR LWEN SVDD1 TP706 _M_LCD_CS LCS1 SVDD2 TP707 _S_LCD_CS LCS2 LVDD1 LCD_D(0) LVDD2 LCD_D(1) CVDD1 LCD_D(2) CVDD2 LCD_D(3) U701 C708 CVDD3 C700 C701 C705 C706...
  • Page 45 3. H/W Circuit Description LCD & CAMERA INTERFACE CONNECTOR 2V8_BE VBAT 2V8_CAM CN800 FL800 FL801 LCD_D(0) OUT1 OUT1 LCD_D(8) LCD_D(1) OUT2 OUT2 LCD_D(9) LCD_D(2) OUT3 OUT3 LCD_D(10) LCD_D(3) OUT4 OUT4 LCD_D(11) LCD_D(4) OUT5 OUT5 LCD_D(12) LCD_D(5) OUT6 OUT6 LCD_D(13) LCD_D(6) OUT7 OUT7 LCD_D(14)
  • Page 46: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 Main Components Placement - 45 -...
  • Page 47: Fpcb Components Placement

    4. TROUBLE SHOOTING 4.2 FPCB Components Placement RECEIVER & SPEAKER VIBRATOR LCD_40PIN FPCB LCD Module Backup Battery 60PIN FPCB 4.3 Baseband Components LCD Module RECEIVER & SPEAKER VIBRATOR - 46 -...
  • Page 48: Main Components (Description)

    4. TROUBLE SHOOTING 4.4 Main Components (Description) MAIN Microphone U400 Folder Switch MIC200 CN800 LCD connector J200 Ear-Mic jack U400 LCD Back Light LED charge pump CN600 IO connector SW500 RF Mobile switch U501 RF Trnaceiver FL500 Quad FEM U500 Power Amplifier Module U303 Memory(Flash 128Mbit/SRAM 64Mbit)
  • Page 49: Power On Trouble

    4. TROUBLE SHOOTING 4.5 Power On Trouble 4.5.1 Power On Sequence Connecting Battery • Power-On Key Detection • PWON signal goes to ABB and then ABB reset DBB by ON_OFF signal • ON_OFF turn low(1.5V) to HIGH(2.8V) and it resets Calypso 4.5.2 Check Points •...
  • Page 50: Charging Trouble

    4. TROUBLE SHOOTING 4.6 Charging Trouble • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 5.2V • Charging temperature ADC range • Charging time : 3h under - ~ -20°C : small charging operation. •...
  • Page 51 4. TROUBLE SHOOTING Charging Procedure Trouble Shooting Setup • Connecting TA & Charger Detection • Connect Battery & TA to the handset. • Control the charging Current by ABB • Charging Current flows into the Battery Check Points Trouble Shooting Procedure •...
  • Page 52: Lcd Display Trouble

    4. TROUBLE SHOOTING 4.7 LCD Display Trouble LCD CONNECTOR Check soldering FPCB 40Pin & LCD Connect around connector Check BackEND IC LCD Control Signals From Main Board • MLED , L_MAIN_CS, L_SUB_CS ,LCD_RESET, L_WR, LCD_ID • L_A(1), L_D(0)~L_D(15), IFMODE Check Points •...
  • Page 53 4. TROUBLE SHOOTING START Refer to Power is supplied to Power On Trouble the board? Connection between Reconnect LCD Module and board is OK? Module Re_solder the MAIN CN800, FPCB CN1,CN2 MAIN CN3, FPCB is soldered well? CN1,CN2 Paths of LCD control Re_solder signals are OK? FL800,FL801,FL802...
  • Page 54: Camera Trouble

    4. TROUBLE SHOOTING 4.8 Camera Trouble SETTING : Connect PIF, and remote switch ON at PIF CN800 FPCB connector U700 U702 - 53 -...
  • Page 55 4. TROUBLE SHOOTING START Does the LCD Go to the LCD trouble Itself has on trouble Set the camera button ON Check Check the voltage of Pin5 of U702 Re_solder U702 the voltage of Pin3 is 2.85V of U702 is 2.85V? Is the connection of FPCB Resodler FPCB CN1...
  • Page 56: Receiver Trouble

    4. TROUBLE SHOOTING 4.9 Receiver Trouble Block Diagram Block Diagram Control SPKP/ Calypso YMU762 (U101) SPKN (U202) SPK_PHN_EN Analog SW RCV_SPKP/ (U201) RCV_SPKN RCV_P/ RECEIVER IOTA Analog SW & RC filter (U100) (U200) SPEAKER RCV_N Melody Generation • U202(YMU762,MIDI) is controlled by DBB. •...
  • Page 57 4. TROUBLE SHOOTING Speaker Part U200 U202 FPCB 60 Pin connector Receiver Part Main 60 Pin connector Speaker Receiver Trouble Shooting Setup • Initialize GSM MS test equipment. • Connect PIF-UNION and power on. • Make a test call to 112. •...
  • Page 58 4. TROUBLE SHOOTING 4.9.1. Receiver Trouble START Set audio part at test equipment as PRBS or continuous wave, not echo. Set the audio volume max. ABB is out of order. Does sine wave appear Change the board. atR823,R824? Re_solder the U201. SPK_PHN_EN signal is low? Otherwise change it.
  • Page 59 4. TROUBLE SHOOTING 4.9.2. Speaker(MIDI) Trouble SPK_PHN_EN Operating Receiver Only MIDI or SPK mode START Enter into Engineering Mode and go to menu "Baseband Alert Ring" Paths of U202 Change the board signals are OK? Does sine wave appear Change the YMU762 at R200? ABB is out of order.
  • Page 60: Microphone Trouble

    4. TROUBLE SHOOTING 4.10 Microphone Trouble Circuit Diagram MICROPHONE R220 MICBIAS C225 C226 R221 4.7u 2.4K C227 0.1u R222 MICP C229 C228 C230 0.1u R223 MICN OSF213-42DC MIC200 VA202 VA203 R224 C231 C232 - 59 -...
  • Page 61 4. TROUBLE SHOOTING Microphone Signal Flow Check Points • MIC is enable by MICBIAS • Microphone bias • MICBIAS, MICP, MICN signals to ABB • Audio signal level of the microphone • Soldering of components Trouble Shooting Setup Trouble Shooting Procedure •...
  • Page 62 4. TROUBLE SHOOTING START Connect the handset to network equipment and setup call. Re_solder the The soldering of R221 The voltage of R221 R221 is 2.5V? is OK? ABB is out of order. Change the board. Soldering between Re_solder the MIC MIC and Board is OK? Check the signal level at pin...
  • Page 63: Vibrator Trouble

    4. TROUBLE SHOOTING 4.11 Vibrator Trouble Block Diagram VIBRATOR Q400 R403 R404 L400 VIBRATOR 1.5K MOTOR VOUT R406 100nH C402 SUY98005LT1G 100K Vibrator Operation Check Points • Vibrator is controlled by DBB GPIO • VCC lines (VBAT) of Q400 • When vibrator signal is high, vibrator is enabled •...
  • Page 64 4. TROUBLE SHOOTING START Enter into Engineering Mode and select Vibrator Signal of pin3 of Q400 Voltage of R403 Change the board is OK? is 2.8V Change the Q400 Re_solder Pin1 of Q400 is 0V ? Check the soldering of R404 R404 Change the Q400...
  • Page 65: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.12 Keypad Backlight Trouble Block Diagram KEY BACKLIGHT VBAT R417 R418 R419 R420 R421 R422 R423 R424 R425 R426 R427 R428 R429 R430 LD400 LD401 LD402 LD403 LD404 LD405 LD406 LD407 LD408 LD409 LD410 LD411 LD412 LD413 R431 KEY_BACKLIGHT R432...
  • Page 66 4. TROUBLE SHOOTING START Enter into Engineering Mode and select Keypad On The Voltage ABB is out of order. Check the soldering Of LEDB signal Change the Board. of R431and R432 is about 0V? Power off and Measure the Resistor Value of all LEDs. Is there anything that Replace the ALL LED.
  • Page 67: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.13 Folder ON/OFF Trouble Block Diagram FOLDER SWITCH V_IO V_IO R415 U400 R414 FOLDER_INT A3212EEH-T R416 OUTPUT FOLDER GND2 PGND GND1 C400 C401 VA406 0.1u 0.1u EVL5M02200 Slide Operation • There is a magnet to detect the Slide status, up or down. •...
  • Page 68 4. TROUBLE SHOOTING Caution! If use PIF jig, the START remote switch is turned off. Folder ON status. Not magnetized Re_solder the The all paths connected U400 to U400 are OK? Re_solder the R415. Pin1 of U400 is 2.8V? Recombine of Main LCD Operating? Magnetic The DBB(Calypso) is broken.
  • Page 69: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.14 SIM Detect Trouble SIM CONNECTOR V_SIM V_SIM J600 R621 GND1 SIM_RST SIM_IO SIM_CLK GND5 GND2 C606 C607 C608 GND4 GND3 0.1u 150p ➅ ➃ ➂ ➀ Connection between SIM and DBB • SIM_CLK, SIM_IO, SIM_RST Check Points •...
  • Page 70 4. TROUBLE SHOOTING START Insert the SIM Card Re_solder the The soldering of SIM connector J600 is OK? The all paths connected Re_solder the to J600 are OK? C606,C607,C608,R621 When SIM insert that, Change the ABB V_SIM Voltage is 2.85V? SIM card is broken.
  • Page 71: Earphone Trouble

    4. TROUBLE SHOOTING 4.15 Earphone Trouble Block Diagram EAR_JACK SPEC Receiver Ear jack V_IO R209 R208 HSMICBIAS R210 C214 R211 C216 5.6K 4.7u R212 HOOK_DETECT C217 J200 C218 R213 R214 ABB_HSO L200 100nH C219 0.1u R215 R216 HSMICP VA200 VA201 R217 C220 C221...
  • Page 72 4. TROUBLE SHOOTING cf) PRBS : Pseudo Random Bit Sequence START Insert the earphone into the headset. Does the Audio profile change 1. Earphone detection problem to the earphone mode? Set the audio part of test equipment to PRBS or continuous wave mode Can you Re_solder the...
  • Page 73 4. TROUBLE SHOOTING 1. Earphone detection problem The Voltage Soldering Re_solder the at JACK_DETECT point Of R218,R219 is OK? R218,R219 is 0V? Pin3 and Pin4 of J200 Change the J200 are open? The ABB is out of order. Change the board. 2.
  • Page 74 4. TROUBLE SHOOTING Headset Input Pin (This pin connects with Microphone of Ear-Mic) Headset Output Pin The components of HSO - 73 -...
  • Page 75: Rf Rx Pass Trouble Shooting

    4. TROUBLE SHOOTING 4.16 RF Rx pass Trouble Shooting START E5515C : Test Mode CH190, 7 level setting (TCH) CH190, -60 dBm setting (BCCH) Spectrum Analyzer setting Oscilloscope setting Check Regulator Circuit Check VCTCXO Circuit Check PLL Control Signal Check FEM &...
  • Page 76 4. TROUBLE SHOOTING 4.16.1 Checking Regulator Circuit (Rx pass continued) Check Pin 3 RF2.85V VBAT U502 Regulator circuit is OK R1114D281D-TR-F Pin3 high? See next page to check VOUT VCTCXO circuit GND1 RF_EN GND2 C521 C523 C524 1000p Pin6High? Replace U502 Check U101 Ch2 : Pin 3 2.8V Ch1 : Pin 6 2.8V...
  • Page 77 4. TROUBLE SHOOTING 4.16.2 Checking VCTCXO Circuit (Rx pass continued) Check Pin 3 of X500 VCTCXO circuit is OK 26MHz ? See next page to check PLL circuits Pin 4 2.8V ? Replace X500 Check U502 RF2.85V X500 26MHz R514 TCXO_OUT VCONT C518...
  • Page 78 4. TROUBLE SHOOTING 4.16.3 Checking PLL Circuit (Rx pass continued) Check S_CLK, S_EN, S_DATA Signal is Download SW normal? S_EN S_DATA PLL circuit is OK. See nest page to check FEM & Mobile SW S_CLK S_EN S_EN S_DATA S_DATA S_CLK S_CLK - 77 -...
  • Page 79 4. TROUBLE SHOOTING 4.16.4 Checking FEM & Mobile SW (1) (Rx pass continued) Check SW500 Pin 1,2 with no RF cable connected Short ? Replace SW500 Check SW500 Pin 1,2 with RF cable connected Open ? Replace SW500 Rx standalone mode is needed Check ANT_SW1, ANT_SW2 of FL500 (Table 2-1) ANT_SW1,ANT_SW2 = Low or...
  • Page 80 4. TROUBLE SHOOTING 4.16.5 Checking FEM & Mobile SW (2) (Rx pass continued) FL500 PIN15 ANT_SW1 : ANT_SW1 PIN14 ANT_SW2 : ANT_SW2 SW500 KMS-506 RF2.85V FL500 C822 DGM081 1000p GSM850_RX1 GSM850_RX2 CTRL1 GSM900_RX1 CTRL2 GSM900_RX2 GSM1800_RX1 GND1 GSM1800_RX2 GND2 GSM1900_RX1 GND3 GSM1900_RX2 GND4...
  • Page 81 4. TROUBLE SHOOTING 4.16.6 Checking Rx I/Q (Rx pass continued) Check I/Q Replace U501 I/Q is normal? Redownload the software & Calibration RXQP RXQP RXIP RXIP C818 C821 C817 R820 S_CLK R821 SCLK _S_EN _SEN R819 SDIO S_DATA RXQN RXQP RXIN RXIP XOUT...
  • Page 82: Rf Tx Pass Trouble Shooting

    4. TROUBLE SHOOTING 4.17 RF Tx pass Trouble Shooting START E5515C : Test Mode CH190, 7 level setting (TCH) CH190, -60 dBm setting (BCCH) Spectrum Analyzer setting Oscilloscope setting Check Regulator Circuit Check VCTCXO Circuit Check PLL Control Signal Check Tx I/Q Check PAM Control...
  • Page 83 4. TROUBLE SHOOTING 4.17.1 Checking Regulator Circuit (Tx pass continued) Check Pin 3 RF2.85V VBAT Regulator circuit is OK. U502 See next page to check R1114D281D-TR-F Pin3 high ? VOUT VCTCXO circuit GND1 RF_EN GND2 Pin 6 High ? Replace U502 C521 C523 C524...
  • Page 84 4. TROUBLE SHOOTING 4.17.2 Checking VCTCXO Circuit (Tx pass continued) Check Pin 3 of X500 VCTCXO circuit is OK 26MHz ? See next page to check FEM & Mobile SW Pin 4: 2.85V ? Replace X500 Check U502 RF2.85V X500 26MHz R514 TCXO_OUT...
  • Page 85 4. TROUBLE SHOOTING 4.17.3 Checking PLL Circuit (Tx pass continued) Check S_CLK, S_EN, S_DATA Signal is Download SW normal? S_EN PLL circuit is OK. S_DATA See nest page to check S_CLK FEM & Mobile SW - 84 -...
  • Page 86 4. TROUBLE SHOOTING 4.17.4 Checking Tx I/Q (Tx pass continued) Check I/Q Normal? Replace U100 Redownload the software and calibration R819 S_DATA RXQN RXQP RXIN RXIP R509 TXQN C507 560p R510 TXQP R511 TXIN C511 560p R512 TXIP R513 26MHZ R818 _PDNB C820...
  • Page 87 4. TROUBLE SHOOTING 4.17.5 Checking PAM Control Signal (Tx pass continued) Check VRAMP, PA_ON, PA_BAND Normal? Download the SW Control signal is OK. See next page to Check FEM & Mobile SW VBAT 4dB Atten RFOL R501 R500 R502 GSM_OUT GSM_IN R822 VRAMP...
  • Page 88 4. TROUBLE SHOOTING 4.17.6 Checking FEM & Mobile SW (1) (Tx pass continued) Tx standalone mode is needed Check RF Level FL500 Pin 10,12 (Table 2-1) 20dBm Replace U501 Check ANT_SW1, ANT_SW2 of FL500 ANT_SW1=Low & ANT_SW2=High or Replace ANT_SW1=High & ANT_SW2=High ? the board Check FL500 Pin 17 Replace...
  • Page 89 4. TROUBLE SHOOTING 4.17.7 Checking FEM & Mobile SW (2) (Tx pass continued) FL500 PIN15 ANT_SW1 : ANT_SW1 PIN14 ANT_SW2 : ANT_SW2 SW500 KMS-506 RF2.85V FL500 C822 DGM081 1000p GSM850_RX1 GSM850_RX2 CTRL1 GSM900_RX1 CTRL2 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GND1 GND2 GSM1900_RX1 GND3 GSM1900_RX2 GND4...
  • Page 90: Download

    5. DOWNLOAD 5. DOWNLOAD 5.1 Download Setup 5.1.1 In case of using the Data kit Figure 5-1 Describes Download Setup Preparation • Target Handset • Data kit • Battery • IBM compatible PC supporting RS-232 with Windows 98 or newer If you use data kit, you should have a battery with the voltage above 3.7V.
  • Page 91: Download Procedure

    5. DOWNLOAD 5.2 Download Procedure 5.2.1. Computer Program file -> MultiGSM.EXE Click - 90 -...
  • Page 92 5. DOWNLOAD 5.2.2. Click the “Setting” button. Then, choose Configuration which is going to download. - 91 -...
  • Page 93 5. DOWNLOAD 5.2.3. Configuration Setting C:\GSMULTI\Model\MG220.dll - 92 -...
  • Page 94 5. DOWNLOAD 5.2.4. Press “Start Button”. - 93 -...
  • Page 95 5. DOWNLOAD 5.2.5. After “Start Button”, Which Stand-by condition - 94 -...
  • Page 96 5. DOWNLOAD 5.2.6. SW downloading Condition. MG220 - 95 -...
  • Page 97 5. DOWNLOAD 5.2.7. SW downloading END Condition. - 96 -...
  • Page 98: Service And Calibration

    6. SERVICE AND CALIBRATION 6. SERVICE AND CALIBRATION 6.1 Service S/W 6.1.1. RF Calibration Program 1. Execute "Hot_KimchiD.exe" 2. Click on "APPLY" button. MG220 MG220 3. Click on "CALIBRATION START" - 97 -...
  • Page 99 6. SERVICE AND CALIBRATION 4. Click on "CALIBRATION START" button. - 98 -...
  • Page 100: Circuit Diagram

    VBAT VBAT 01/05 K.P. KIM Checked 2006 URXD DRAWING UTXD BB_MAIN HOLE NAME 01/05 Approved W.J. KIM 2006 OJ100 OJ101 OJ102 OJ103 DRAWING Iss. Notice No. Date Name REV G LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 99 -...
  • Page 101 Sheet/ Sheets MODEL MG220 01/05 M.S. KIM Designer 2006 01/05 Checked K.P. KIM 2006 DRAWING AUDIO 01/05 NAME W.J. KIM Approved 2006 DRAWING Iss. Notice No. Date Name LG Electronics Inc. REV G LGIC(42)-A-5505-10:01 LG Electronics Inc. - 100 -...
  • Page 102 Sheet/ Sheets MODEL MG220 01/05 C.Y. JUNG Designer 2006 01/06 K.P. KIM Checked 2006 DRAWING MEMORY NAME 01/05 W.J. KIM Approved 2006 DRAWING Iss. Notice No. Date Name LG Electronics Inc. REV G LGIC(42)-A-5505-10:01 LG Electronics Inc. - 101 -...
  • Page 103 MODEL 01/05 C.Y. JUNG Designer R431 2006 KEY_BACKLIGHT R432 01/05 K.P. KIM Checked 2006 VA407 DRAWING NAME 01/05 W.J. KIM Approved 2006 DRAWING REV G Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 102 -...
  • Page 104 ERIC MIN 12/15 GND1 DRAWING RF_AERO II RF_EN GND2 NAME TEMPSENSE 2005 Approved W J KIM 12/15 R518 C521 C523 C524 4.7K 1000p DRAWING REV G Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 103 -...
  • Page 105 MODEL MG220 01/05 0.1u 150p C.Y. JUNG Designer 2006 01/05 Checked K.P. KIM 2006 DRAWING Peripheral NAME 01/05 W.J. KIM Approved 2006 DRAWING Iss. Notice No. Date Name LG Electronics Inc. REV G LGIC(42)-A-5505-10:01 LG Electronics Inc. - 104 -...
  • Page 106 Sheet/ Sheets MODEL MG220 01/05 M.S. KIM Designer 2006 01/05 Checked K.P. KIM 2006 DRAWING CAMERA NAME 01/05 W.J. KIM Approved 2006 DRAWING REV G Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 105 -...
  • Page 107 Sign & Name Sheet/ Sheets MODEL MG220 01/05 C.Y. JUNG Designer 2006 01/05 K.P. KIM Checked 2006 DRAWING NAME 01/05 W.J. KIM Approved 2006 DRAWING REV G Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 106 -...
  • Page 108: Pcb Layout

    8. pcb layout - 107 -...
  • Page 109 8. pcb layout - 108 -...
  • Page 110: Engineering Mode

    [2-2-1] LCD AUTO [2-7-5] DEFAULT VALUE [2-2-2] LCD COLOR [2-7-6] DAI TEST [2-7-7] LOOPBACK TEST [2-3] FONT [2-3-1] FONT 810 [3] MG220 VERS [2-3-2] FONT 810i [4] ENG MODE [2-3-3] FONT 816 [4-1] CELL ENVIRON [2-3-4] FONT 816i [2-3-5] FONT 816b...
  • Page 111: Standalone Test

    10. STANDALONE TEST 10. STANDALONE TEST 10.1 Setting Method 10.1.1 COM Port In the “Dialog Menu”, select the values as explained below. • Port : select a correct COM port • Baudrate : 115200 • Leave the rest as default values 10.1.2 Tx Test 1.
  • Page 112: Exploded View & Replacement Part List

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 EXPLODED VIEW - 111 -...
  • Page 113 - 112 -...
  • Page 114: Replacement Parts

    MG220 CLRBK BACKUP BATTERY Black MPBZ01 MPBZ0117501 MG220 CLRBK PAD CON FPCB Black MPBZ02 MPBZ0117601 MG220 CLRBK PAD LCD BOTTOM Black MTAA00 TAPE,DECO MTAA0110301 MG220 CLRBK TAPE DECO UPPER Transparent MTAA02 TAPE,DECO MTAA0110501 MG220 CLRBK tape deco camera 9.6x12.4 Transparent - 113 -...
  • Page 115 Color Remark MTAB00 TAPE,PROTECTION MTAB0115001 MG220c IN UPPER Blue MTAE00 TAPE,WINDOW(SUB) MTAE0027001 MG220 CLRBK Transparent MTAZ01 TAPE MTAZ0113901 MG220 CLRBK tape window camera Transparent ACGK00 COVER ASSY,FRONT ACGK0066801 MG220 CLRDG Black MBHY00 BUMPER MBHY0018001 MG220 CLRDG Black MBJL00 BUTTON,SIDE MBJL0029201...
  • Page 116 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MCCF00 CAP,MOBILE SWITCH MCCF0032801 MG220 CLRBK Black MCCH00 CAP,SCREW MCCH0073601 MG220 CLRBK CAP SCREW REAR Black MLAK00 LABEL,MODEL MLAK0006901 ADCA00 DOME ASSY,METAL ADCA0049901 MG220 CLRBK Silver - 115 -...
  • Page 117: Main Component

    40 PIN,0.4 mm,ETC , ,H=0.9, Header BOARD TO BOARD SBCL00 BATTERY,CELL,LITHIUM SBCL0001305 3 V,1 mAh,COIN ,SMT Temp.260 degree. PB-Free B/B SPCY00 PCB,FLEXIBLE SPCY0066901 POLYI , mm,MULTI-5 ,MG220 LCD FPCB SJMY00 VIBRATOR,MOTOR SJMY0006506 3 V,0.08 A,10*3.45 ,17mm SUSY00 SPEAKER SUSY0021101 ASSY ,8 ohm,91 dB,17 mm,...
  • Page 118 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C108 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C109 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP C110 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C111 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 119 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C218 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP C219 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C221 CAP,CERAMIC,CHIP ECCH0000126 68 pF,50V,J,NP0,TC,1005,R/TP C222 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP...
  • Page 120 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C601 CAP,TANTAL,CHIP ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP C602 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C603 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C604 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP...
  • Page 121 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C820 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C821 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C822 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C823 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 122 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R105 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R106 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R107 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R108 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R109 RES,CHIP ERHY0000273 47K ohm,1/16W,J,1005,R/TP R110 RES,CHIP ERHY0000280...
  • Page 123 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R307 RES,CHIP ERHY0000230 330 ohm,1/16W,J,1005,R/TP R308 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R309 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R401 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R402 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R403 RES,CHIP ERHY0000244...
  • Page 124 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R601 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R602 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R603 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R604 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R605 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R606 RES,CHIP ERHY0000213...
  • Page 125 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R820 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R821 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R822 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R823 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R824 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R825 RES,CHIP ERHY0000201...
  • Page 126 11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C227 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C228 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C229 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C230 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C231 CAP,CERAMIC,CHIP ECCH0000117...
  • Page 127 5.5 V, ,SMD ,480pF, 1005 VA405 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 VA406 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 SPFY00 PCB,MAIN SPFY0117601 FR-4 ,1.0 mm,SBL-8 ,MG220 MAIN BOARD MG220cP40FL-55-V10a-724-02 MAR 12 2006+13@ WSYY00 SOFTWARE WSYY0370901 MG220c BTMBK S/W - 126 -...
  • Page 128: Accessory

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark 3.7 V,830 mAh,1 CELL,PRISMATIC ,FG101 SBPL00 BATTERY PACK,LI-ION SBPL0077901 RUSSV423450, Innerpack SSAD00...
  • Page 129 Note...
  • Page 130 Note...

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