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Service Manual MG180c DIGITAL COMMUNICATION WXYZ PQRS Date: March, 2006 / Issue 1.0...
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LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the MG180c.
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the MG180c or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
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1. Introduction E. Notice of Radiated Emissions The MG180c complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
1. Introduction 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Base Band Bit Error Ratio CC-CV Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory...
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1. Introduction Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Front End Module Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory STMR Side Tone Masking Rating Travel Adapter...
2. General Performance 2. General Performance 2.1 Product Name MG180c : Support GPRS (Class 10) 2.2 Supporting Standard Item Feature Comment E-GSM/DCS/PCS Triple Band Supporting Standard Phase 2+ SIM Toolkit : Class 1,2,3 EGSM TX : 880 - 915 MHz...
2. General Performance 2.4 H/W Features Item Feature Comment Form Factor Single Color BAR Main LCD : CSTN, 101 x 80 1) Capacity Standard : Li-Ion 830mAh Battery Packing Type: Inner Pack Size Standard : 101 x 44 x 15.9 mm L x W x H Weight 72.5 g...
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2. General Performance Item Feature Comment Antenna Internal Type Triple-band System connector 24 Pin Ear Phone Jack 3 Pole (φ2.5mm) PC synchronization CDROM Memory Flash : 64Mbit / SRAM :32Mbit Spansion Speech coding FR, EFR, HR, AMR Data & Fax Built in Data &...
3. H/W Circuit Description 3. H/W Circuit Description 3.1 RF Transceiver General Description The RF parts consist of a transceiver part, a power amplifier part, a front-end module part, a voltage supply part, and a VC-TCXO part. The AeroII transceiver is composed of single RF chipset, Si4210-GM[U501] which is a quad-band GSM/GPRS wireless communications.
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3. H/W Circuit Description 3.2.2. Synthesizer The Aero II transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is used only during transmit mode.
3. H/W Circuit Description 3.3 Transmitter Part The Transmitter part contains the transmitter parts of Si4210-GM[U501], Power Amp Module[U501] and Front End Module[FL500]. The transmit section of Si4210-GM[U502] consists of an I/Q base band up_converter, an offset phase-locked loop(OPLL) and two output buffers that can drive external power amplifiers(PA).
3. H/W Circuit Description 3.3.1. Power Amplifier The RF3166 [U500] is a quad-band EGSM 900/GSM 850/DCS/PCS power amplifier module that incorporat es an indirect closed loop method of power control. The indirect closed loop is fully self- contained and it do es not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.
3. H/W Circuit Description 3.3.3. Power Supplies and Control Signals An external regulator(U502) is used to provide DC power to RF part. Every RF component except power amp module uses this external regulator. VBAT RF2.85V U502 VOUT RF_EN R1114N281D-TR-F C533 C534 C535 C536...
3. H/W Circuit Description 3.4 Digital Baseband (DBB) Processor Figure 7. Top level block diagram of the Calypso- 3.4.1. General Description CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro- - Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates.
3. H/W Circuit Description 3.4.2. Block Description CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus sta ndard as interface with their associated application peripherals. CALYPSO is composed from the following blocks: • ARM7TDMIE : ARM7TDMI CPU core •...
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3. H/W Circuit Description 3.4.3. RF Interface (TPU, TSP Block) Calypso uses this interface to control IOTA_CS(ABB Processor) and AERO(RF Processor) with GSM Time Base TSP (Time Serial Port) Resource Interconnection Description TSPDO ABB & RF main Chip Control Data TSPDI/IO(4) GPIO4 TSPEN0...
3. H/W Circuit Description 3.4.6. GPIO Map In total 16 allowable resources, MG180c is using 13 resources except 3 resources dedicated to SIM and Memory. MG180c GPIO (General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.
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3. H/W Circuit Description • Six Low-dropout (LDO), linear voltage regulators targeted core, general I/O, memory I/O, SIM I/O • High voltage (20V) Li-Ion or Ni-MH battery charging control • Voltage detectors (with power-off delay) • Voice Codec VCMEM VRMEM VCDBB VSDBB VRIO...
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3. H/W Circuit Description 3.5.2. Audio Signal Processing & Interface The voice codec circuitry processes analog audio components in the voice uplink (VUL) path and applies this signal to the voice signal interface for eventual baseband modulation. In the voice downlink (VDL) path, the codec circuitry changes voice component data received from the voice serial interface (VSP) into analog audio.
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3. H/W Circuit Description 3.5.3. Audio uplink processing The VUL path includes two input stages. The first stage is a microphone amplifier, compatible with electret microphones containing a FET buffer with open drain output. The microphone amplifier has again of typically 25.6 dB ( 1 dB) and provides an external voltage of 2.0 V or 2.5 V to bias the microphone (MICBIAS).
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3. H/W Circuit Description 3.5.4. Audio downlink processing The VDL path receives speech samples at the rate of 8 kHz from the DSP via the VSP and converts them to analog signals to drive the external speech transducer. The digital speech coming from the DSP is first fed to a speech digital filter that has two functions.
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3.5.6. Voltage Regulation (VREG) There are 7 LDO (Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure14) shows the power supply related blocks of DBB/ABB and their interfaces in MG180c. - 30 -...
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3. H/W Circuit Description RSIM VRSIM 1.8/2.9 V Card 10 mA VBAT µ RRAM VCRAM VRRAM SRAM 1.8/2.8 V Core 50 mA µ 4.7 F Memories RMEM VCMEM VRMEM 1.8/2.8 V Core 60 mA µ 4.7 F Sel 2.8 V VLMEM Memories VSDBB...
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3. H/W Circuit Description Output Voltage Usage VRDBB 1.5V Digital Core of DBB VRIO 2.8V Peripheral devices VRMEM 2.8V External memory VRRAM 2.8V LCD & peripheral devices VRABB 2.8V Analog Block of ABB VRSIM 2.85V SIM card driver VRRTC 1.5V RTC &...
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3. H/W Circuit Description 3.5.8. Charging Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of MG180c is as follow. 3.87V~3.75V 3.74V~3.68V 4.2V~3.88V 3.67V~3.60V Figure 15. Battery Block Indication 1.
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→ IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. → CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG. 3.5.10. Memories MG180c using 64Mbit Flash + 32Mbit SRAM with 16 bit parallel data bus thru ADD01 ~ ADD22. 3.5.11. Display & FPCB Interface LCD module include: →...
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3. H/W Circuit Description Connector Interface Spec. 1.LCD Connector Pin # NAME Description Power Input(2.8V) RESET/ Reset NC(OTPG) No connection LCD Data LCD Data LCD Data LCD Data LCD Data LCD Data LCD Data LCD Data LCD_BL_IN LCD Back Light Input LED_C1 LCD Back Light Output LED_C2...
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3. H/W Circuit Description Connector Interface Spec. 2. Bottom System Connector Separate Pin # 24Pin UART1 POWER(VCHG) CHARGING (VCHG) POWER(VCHG) CHARGING (VCHG) POWER ON(RPWON) TEST (RPWON) PCM_RX/TDI TEST : DAI/JTAG PCM_CLK/TCK TEST : DAI/JTAG PCM_SYNC/TMS TEST : DAI/JTAG UART2 (Receive Data) PCM TX /TDO TEST : DAI/JTAG POWER GND...
3. H/W Circuit Description 3.5.12. Keypad Switching & Scanning Table 3-10. Keypad Map KBC0 KBC1 KBC2 KBC3 KBC4 KBR0 LEFT RIGHT DOWN KBR1 CLEAR KBR2 VOL_UP KBR3 VOL_DOWN KBR4 STAR SHAP SEND DBB supports 25 Key Map and Switch-ON Key is connected directly to ABB as (Figure16 ). VBAT KEY BACKLIGHT R309...
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3. H/W Circuit Description 3.5.13. Keypad back-light Illumination There are 6 Deep Blue LEDs in Main Board for Keypad Backlight and 6 Deep Blue LEDs in Upper Board for Upper Board Backlight. Keypad Back-light is driven by ‘LEDB’ line from IOTA . VBAT KEY BACKLIGHT R309...
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Figure 19. Microphone system Microphone circuits When a call is established, MICBIAS signal goes up to ‘2.5V’ in the MG180c. IOTA(ABB) provides bot h 2.0V and 2.5V for MICBIAS to circuit designer. VA202, VA203 are employed to enhance ESD immunity.
4. TROUBLE SHOOTING 4.5 Power On Trouble 4.5.1 Power On Sequence Connecting Battery • Power-On Key Detection • PWON signal goes to ABB and then ABB reset DBB by ON_OFF signal • ON_OFF turn low(1.5V) to HIGH(2.8V) and it resets Calypso 4.5.2 Check Points •...
4. TROUBLE SHOOTING 4.6 Charging Trouble • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 5.2V • Charging temperature ADC range • Charging time : 2h 30 min under - ~ -20°C : small charging operation. •...
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4. TROUBLE SHOOTING Charging Procedure Trouble Shooting Setup • Connecting TA & Charger Detection • Connect Battery & TA to the handset. • Control the charging Current by ABB • Charging Current flows into the Battery Check Points Trouble Shooting Procedure •...
4. TROUBLE SHOOTING 4.7 LCD Display Trouble LCD FPCB LCD Connector Check connector LCD Control Signals From Main Board • MLED , L_MAIN_CS, L_SUB_CS ,LCD_RESET, L_WR, LCD_ID • L_A(1), L_D(0)~L_D(15), IFMODE Check Points • The Assembly status of the LCD Module. •...
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4. TROUBLE SHOOTING START Power is supplied to Refer to the board? Power On Trouble Connection between Reconnect LCD Module and board is OK? Module MAIN CN300 Re_Connected is Connected well? MAIN CN300 After changing the board, The board is broken. LCD Display is OK? Change the board.
4. TROUBLE SHOOTING 4.8 Receiver Trouble Block Diagram Control SPKP/SPKN Calypso YMU762 SPEAKER (U101) (U201) SPK_EN Analog SW (U200) RCV_P/ IOTA RCVP/RCVN LC filter RECEIVER (U100) RCV_N Melody Generation • U201(YMU762,MIDI) is controlled by DBB. • U201 generates 40poly MIDI sound and it is delivered to the speaker Signals to the receiver •...
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4. TROUBLE SHOOTING Speaker Part SPEAKER U201 U200 Receiver Part Receiver Receiver Trouble Shooting Setup • Initialize GSM MS test equipment. • Connect PIF-UNION and power on. • Make a test call to 112. • Set audio part at test equipment as PRBS or continuous wave, not echo. •...
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4. TROUBLE SHOOTING 4.8.1. Receiver Trouble START Set audio part at test equipment as PRBS or continuous wave, not echo. Set the audio volume max. ABB is out of order. Does sine wave appear Change the boa rd. at L203,L204? Contacting between Re_Contact the cab le Contact pin and Pad is OK?
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4. TROUBLE SHOOTING 4.8.2. Speaker(MIDI) Trouble Enter into Engineering Mode and START go to menu "Baseband Alert Ring" D(0:7)Paths o f U201 Change the boa rd sig nals are OK? DBB is out of order. Does si ne w ave appear SPK_EN signa l is high? Change the boa rd.
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4. TROUBLE SHOOTING Microphone Signal Flow Check Points • MIC is enable by MICBIAS • Microphone bias • MICBIAS, MICP, MICN signals to ABB • Audio signal level of the microphone • Soldering of components Trouble Shooting Setup Trouble Shooting Procedure •...
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4. TROUBLE SHOOTING START START Connect the handset to Connect the handset to network equipment and network equipment and setup call. setup call. Re_sold er the Re_sold er the The vo ltage of R21 5 The vo ltage of R21 5 The so ldering of R21 5 The so ldering of R21 5 R215...
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4. TROUBLE SHOOTING START Enter into Engineering Mode and select Vibrator Signal of pin3 of Q 300 Voltage of R318 Change the board is O K? is 2. 8V Change th e Q300 Re_sold er Pin1 of Q 300 is 0V ? Check th e solder ing of R306 R306...
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4. TROUBLE SHOOTING START Enter into Engineering Mode and select Keypad On The Volt age ABB is out of order. Check th e solder ing Of LEDB signal Change th e Board. of R 320 is ab out 0V? Power off and Measure the Resistor Value of all LEDs.
4. TROUBLE SHOOTING 4.12 SIM Detect Trouble Block Diagram V_IO V_SIM VRSIM DBBSIO SIM_IO DBBSCK SIM_CLK DBBSRST SIM_RST SIMCLK SIM_PWRCTRL S IMIO SIM_CD SIMRST 100k 0.1u Connection between SIM and DBB Check Points • SIM_CLK, SIM_IO, SIM_RST • Contact between SIM and socket -.
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4. TROUBLE SHOOTING START Insert the SIM Card Re_sold er the The so lder ing of SIM con nector CN300 is O K? The all path s co nnect ed Re_sold er the to C N300 are OK? C405,C407,C408,C410,R425 When SIM in ser t that , Change the ABB V_SIM Voltage is 2.85V? SIM car d is br oken .
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4. TROUBLE SHOOTING cf) PRBS : Pse udo Ran dom Bit Sequence START Insert the earphone into the headset. Does the Audio profile chan ge 1. Earpho ne detecti on problem to the e arphon e mode? Set the audio part of test equipment to PRBS or continuous wave mode Can you...
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4. TROUBLE SHOOTING 1. Earpho ne detecti on problem The Volt age Soldering Re_sold er the at HOOK_DETECT point Of C208, R207 is OK? C208, R207 is 0V? Pin3 an d Pin4 of J 200 Change th e J200 are ope n? The ABB is out of order.
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4. TROUBLE SHOOTING Headset Output Pin Headset Input Pin (This pin connects with Microphone of Ear-Mic) The components of HSO - 67 -...
4. TROUBLE SHOOTING 4.14 RF Rx pass Trouble Shooting START E5515C : Test M ode CH190, 7 level setti ng (TCH) CH190, -60 dBm setti ng (BCCH) Spectrum Anal yzer setting Osci lloscope setting Check Regulat or C ircuit Check VCTCXO Circuit Check PLL Cont rol...
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4. TROUBLE SHOOTING 4.14.1 Checking Regulator Circuit (Rx pass continued) Check P in 5 VBAT RF2.85V Regulat or circuit is OK U502 2.85V? See next page to check VOUT VCTCXO circuit RF_EN R1114N281D-TR-F C533 C534 C535 C536 C537 1000p 4.7u 4.7u Pin 3 H igh? Repl ace U502...
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4. TROUBLE SHOOTING 4.14.2 Checking VCTCXO Circuit (Rx pass continued) Check P in 3 of X 501 VCTCXO circuit is OK 26MHz ? See next page to check PLL circuits Pin 4 2.85V ? Repl ace X501 Check U502 RF2.85V X500 26MHz R515...
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4. TROUBLE SHOOTING 4.14.3 Checking PLL Circuit (Rx pass continued) Check S _CLK, S_EN, S_DATA Signal is Down load SW norm al? PLL circuit is OK . See nest page to check FEM & Mobile SW S_CLK S_DATA C542 C541 R560 S_CLK S_EN...
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4. TROUBLE SHOOTING 4.14.4 Checking FEM & Mobile SW (1) (Rx pass continued) Check S W500 Pin 1,2 wi th no RF cabl e connected Short ? Repl ace SW500 Check S W500 Pin 1,2 wi th RF cabl e connected Open ? Repl ace SW500 Rx st andalone m ode is needed...
4. TROUBLE SHOOTING 4.15 RF Tx pass Trouble Shooting START E5515C : Test M ode CH190, 7 level setti ng (TCH) CH190, -60 dBm setti ng (BCCH) Spectrum Anal yzer setti ng Osci lloscope setti ng Check Regulat or C ircuit Check VCTCXO Circuit Check...
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4. TROUBLE SHOOTING 4.15.1 Checking Regulator Circuit (Tx pass continued) Check P in 5 VBAT RF2.85V Regulat or circuit is OK . See next page to check U502 2.85V ? VOUT VCTCXO circuit RF_EN R1114N281D-TR-F C533 C534 C535 C536 C537 Pin 3 H igh ? Repl ace U502 1000p...
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4. TROUBLE SHOOTING 4.15.2 Checking VCTCXO Circuit (Tx pass continued) Check P in 3 of X 500 VCTCXO circuit is OK 26MHz ? See next page to check FEM & Mobile SW Pin 4: 2. 85V ? Repl ace X500 Check U5 02 RF2.85V X500...
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4. TROUBLE SHOOTING 4.15.3 Checking PLL Circuit (Tx pass continued) Check S _CLK, S_EN, S_DATA Signal is Down load SW norm al? PLL circuit is OK . See nest page to chec k FEM & Mobile SW S_CLK S_DATA - 78 -...
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4. TROUBLE SHOOTING 4.15.4 Checking Tx I/Q (Tx pass continued) Check I /Q Norm al? Repl ace U100 Redownload t he sof tware and calibration TCXO_OUT C542 C541 R560 S_CLK S_EN R561 SCLK _SEN S_DATA SDIO U501 RXQN SI4210 RXQP RXIN RXIP XOUT...
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4. TROUBLE SHOOTING 4.15.5 Checking PAM Control Signal (Tx pass continued) Check AP C, PA_ON, PA_BAND Norm al? Downl oad the S W Cont rol signal is OK . See next page t o Check FE M & Mobi le SW VBAT C501 C502...
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4. TROUBLE SHOOTING 4.15.6 Checking FEM & Mobile SW (1) (Tx pass continued) Tx st andalone m ode is needed Check RF Level FL500 Pin 10,12 (Tabl e 2-1) 20dBm Repl ace U501 Check ANT_S W1, ANT_SW2 of FL500 ANT_SW1=Low & ANT_SW2=High or Repl ace ANT_SW1=High &...
5. DOWNLOAD 5. DOWNLOAD 5.1 Download Setup 5.1.1 In case of using the Data kit Figure 6-1 Describes Download Setup Preparation • Target Handset • Data kit • Battery • IBM compatible PC supporting RS-232 with Windows 98 or newer If you use data kit, you should have a battery with the voltage above 3.7V.
6. SERVICE AND CALIBRATION 6. SERVICE AND CALIBRATION 6.1 Service S/W 6.1.1 RF Calibration Program 1. Execute "Hot_KimchiD.exe" 2. Click on "APPLY" button. MG180c MG180c 3. Click on "CALIBRATION START" - 91 -...
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6. SERVICE AND CALIBRATION 6.1.2. RF Calibration Program 4. Click on "CALIBRATION START" button. MG180c - 92 -...
ON_SW ON_SW RPWON NAME VBAT VBAT VBAT V_RAM 2.8V 50mA H.KANG Approved URXD V_SIM 2.85V 10mA UTXD V_RTC 1.5V 30uA DRAWING V_ABB 2.8V 50mA Ver_1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 93 -...
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Sign & Name Sheet/ Sheets MODEL LEDC MG180c R221 Designer 06/02/06 JASON Q200 INDLED_R 2SC5585 G.C.LIM R222 Checked DRAWING AUDIO NAME H.KANG Approved DRAWING Ver_1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 94 -...
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Sheets MODEL KBC(2) MG180c Designer 06/02/06 JASON KBC(3) G.C.LIM Checked DRAWING KEY/LCD NAME VA311 VA312 VA313 VA314 H.KANG Approved EVL5M02200 EVL5M02200 EVL5M02200 EVL5M02200 DRAWING Ver_1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 95 -...
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R428 VBAT Sheets MODEL MG180c 06/02/06 JASON Designer (2012) VBATS G.C.LIM C411 C412 Checked C413 DRAWING 4.7u 0.1uF MEMORY/IO (1608) NAME H.KANG Approved DRAWING Ver._1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 96 -...
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Sheets R519 RICH C533 C534 C535 C536 C537 4.7K Designer 06/02/06 1000p 4.7u 4.7u B.Y YANG Checked DRAWING RF_AERO II NAME H.KANG Approved DRAWING Ver_1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 97 -...
10. STANDALONE TEST 10. STANDALONE TEST 10.1 Setting Method 10.1.1 COM Port In the “Dialog Menu”, select the values as explained below. • Port : select a correct COM port • Baudrate : 115200 • Leave the rest as default values 10.1.2 Tx Test 1.
11. EXPLODED VIEW & REPLACEMENT PART LIST 11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark GSM,BAR/FILP TGSM0041801 Silver AAAY00 ADDITION AAAY0142601 Silver...
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11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MFBC00 FILTER,SPEAKER MFBC0019401 Black MGAD00 GASKET,SHIELD FORM MGAD0108101 Rear (Receptacle) Gold MIDZ00 INSULATOR MIDZ0080801 REAR (SIM) Blue MPBZ00 MPBZ0132701 B/U BATTERY Black Without MSAZ00 SHEET MSAZ0038801 REAR Color...
11. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark SAFY00 PCB ASSY,MAIN SAFY0122520 SAFB00 PCB ASSY,MAIN,INSERT SAFB0038902 3 V,1.2 mAh,COIN ,MATUESHITA Backup BATTERY SBCL00...
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11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C120 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C121 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C122 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP C123 CAP,CERAMIC,CHIP ECCH0007901...
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11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C231 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C232 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C233 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP C234 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP C236 CAP,CERAMIC,CHIP ECCH0000122...
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11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C503 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C504 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C505 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C506 CAP,CERAMIC,CHIP ECCH0000196...
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11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark CN400 CONNECTOR,I/O ENRY0003501 24 PIN,0.5 mm,ANGLE , , CN401 CONN,SOCKET ENSY0016601 6 PIN,ETC , ,2.54 mm,H=2.5 D300 DIODE,SWITCHING EDSY0005301 SC-70 ,80 V,0.1 A,R/TP , D400 DIODE,SWITCHING EDSY0012101 US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t)
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11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R113 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R114 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R115 RES,CHIP ERHY0000236 620 ohm,1/16W,J,1005,R/TP R116 RES,CHIP ERHY0000236 620 ohm,1/16W,J,1005,R/TP R117 RES,CHIP ERHY0000236 620 ohm,1/16W,J,1005,R/TP R118 RES,CHIP ERHY0000236...
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11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R319 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R400 RES,CHIP ERHY0000271 39K ohm,1/16W,J,1005,R/TP R401 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP R402 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R403 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R404 RES,CHIP ERHY0000261...
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11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R513 RES,CHIP ERHY0000235 560 ohm,1/16W,J,1005,R/TP R514 RES,CHIP ERHY0000235 560 ohm,1/16W,J,1005,R/TP R515 RES,CHIP ERHY0000262 12K ohm,1/16W,J,1005,R/TP R516 THERMISTOR SETY0006501 NTC ,22000 ohm,SMD ,1005, ECTH 1005 Series, Pb Free R517 RES,CHIP ERHY0000289...
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11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark X500 VCTCXO EXSK0005601 26 MHz,2 PPM,10 pF,SMD ,3.2*2.5*1.0 , SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0044503 C229 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP C239 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP...
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11. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark VA205 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 VA304 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 VA305 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 VA306 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005...
11. EXPLODED VIEW & REPLACEMENT PART LIST 10.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark 3.7 V,830 mAh,1 CELL,PRISMATIC ,FG101 Without SBPL00 BATTERY PACK,LI-ION SBPL0077901 RUSSV423450, Innerpack...