Table of Contents

Advertisement

MZ-DH10P
• Semiconductor
Location
Ref. No. Location
D352
D-2
D602
C-7
D603
C-6
D604
F-5
D614
D-4
D615
D-4
D618
D-5
D801
E-8
D871
D-11
D904
H-3
D905
I-2
D962
E-5
D963
D-5
IC602
B-6
IC603
D-7
IC604
B-4
IC605
B-5
IC802
B-10
IC803
C-11
IC804
E-9
IC872
D-11
IC891
D-6
IC950
E-5
Q603
D-6
Q604
C-5
Q605
D-6
Q606
C-4
Q607
D-4
Q611
B-5
Q801
E-9
Q802
E-9
Q803
B-8
Q804
B-11
MZ-DH10P
6-13. PRINTED WIRING BOARD – MAIN Board (Component Side) –
1
2
3
MAIN BOARD
(COMPONENT SIDE)
A
+
C154
C254 +
C155
L152
L252
B
J351 (1/2)
i /LINE OUT
C
FB357
FB353
R355
FB354
FB355
D
5
4
D352
8
1
R253
E
F
TP901
G
R961
TP913
C940 +
D904
S893
+
OPEN/CLOSE
C924
DETECT
H
L907
L906
D905
C902
I
-2
S891-2
Hi-MD
PROTECT DETECT
-1
S891-1
(PROTECT DETECT)
J
: Uses unleaded solder.
4
5
6
IC602
3
1
4
3
C253
IC604
IC605
1
5
C255
4
R657
1
2
3
C629 R665
C660
C601
Q611
TP602
D
D
C636
D
D
G
S
R603
TP601
R634
2C1B 1E
R632
Q604
D603
2E 2B 1C
C613 +
C654
L605
R644
R664
Q606
R645
D
D
C615 +
R647
D
D
G
S
Q607
C616 +
8
5
8
R609
C639
2E
2C
Q605
2B
1B
R650
D615
1C
1E
1
4
1
D614
R619
R610
R633
C653 +
C652 +
R663
R891
1
R895
D618
D963
F351
A
K
R898
4
R964
A
K
R966
D962
4
3
L951
5
1
IC950
L607
D604
C664
TP604
34
34
7
8
9
R764
5
Q803
R876
4
R846
C847
R630
R843
R879
D602
K
A
C814
C817
C812
R839
L606
L801
C835
R813
R986
R849
5
IC603
Q603
R994
3
2
4
4
1
TP8003
R867
C810
R830
C891
C827
8
R837
R892
C823
Q801
R893
IC891
R801
R859
C892
TP8007
IC804
C852
5
2
A
K
Q802
D801
R860
R701
3
L702
R703
L703
R704
TP509
L704
R702
L701
TP516
S431
TP461
BATTERY INSERT
(GND)
DETECT
TP460
10
11
IC802
R757
48 38 37 1 2 3 5 4
22 30 29 21 6 7 18 8
24 32 31 23 44 19 43 41
25 46 33 26 20 45 42 40
27 34 35 28 12 11 9 10
C868
47 36 39 17 16 15 13 14
2C1B1E
R878
Q804
2E2B1C
R756
1
4
R840
2
3
C866
IC803
C843
R836
R854
R845
R834
R835
C813
R871
D871
K
A
+
C874
C879
4
3
+
C875
IC872
1
2
C880
1
4
TP453
(GND)
11
1-865-300-
(11)

Advertisement

Table of Contents
loading

Table of Contents