Note For Printed Wiring Boards And Schematic Diagrams - Sony MZ-E505 Service Manual

6-2.

NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS

Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been
included in this diagrams.
* Replacement of IC601 used in this set requires a spe-
cial tool.
• Lead Layouts surface
Lead layout of conventional IC CSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1 / W or less unless otherwise
4
specified.
• C : panel designation.
• A : B+ Line.
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
• Total current is measured with MD installed.
• Power voltage is dc 3 V and fed with regulated dc power
supply from external power voltage jack.
• Voltages and waveforms are dc with respect to ground in
playback mode (servo circuit ON).
no mark : PLAYBACK
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E : PLAYBACK
* Replacement of IC601 used in this set requires a spe-
cial tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
• Waveforms
1 IC501 1 (TE)
200 mV/DIV, 1 µs/DIV
Approx.
760 mVp-p
2 IC501 8 (Iy)
100 mV/DIV, 1 µs/DIV
200 mVp-p
3 IC501 9 (Ix)
100 mV/DIV, 1 µs/DIV
130 mVp-p
4 IC501 q; (Jx)
100 mV/DIV, 1 µs/DIV
150 mVp-p
5 IC501 qa (Jy)
100 mV/DIV, 1 µs/DIV
180 mVp-p
25 25
qa IC601 th (TE)
6 IC501 ed (RF OUT)
200 mV/DIV, 1 µs/DIV
500 mV/DIV, 500 ns/DIV
1.0 Vp-p
7 IC501 rs (FE) qs IC601 ih (FS4)
500 mV/DIV, 2 µs/DIV
200 mV/DIV, 1 µs/DIV
Approx.
620 mVp-p
qd IC901 th (CLK)
8 IC601 wg (OSCO)
500 mV/DIV, 10 µs/DIV 500 mV/DIV, 2 µs/DIV
2.1 Vp-p
22.2 µ s
9 IC601 ej (RFI)
500 mV/DIV, 500 ns/DIV
1.0 Vp-p
q; IC601 rj (FE)
200 mV/DIV, 1 µs/DIV
Approx.
620 mVp-p
MZ-E505
Approx.
760 mVp-p
1.9 Vp-p
5.68 µ s
1.9 Vp-p
5.68 µ s