Printed Wiring Board - Main Section - Sony MZ-R701 Service Manual

MZ-R701/R701DPC
6-5. PRINTED WIRING BOARD — MAIN SECTION —
1 2 3
A
S805
(HALF LOCK)
TP605
B
TP1002
C
TP604
D
TP1004
TP1001
C822
C830
E
C818
R807
C810
C811 C827
TP801
F
OPTICAL
PICK-UP
BLOCK
(LCX-4R)
G
R834
R839
H
1
Q603
4
I
R611
L602
R610
TP603
J
4 5 6
Note:
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Main board is four-layer printed board.
However, the patterns of layers 2 and 3 have not been in-
cluded in this diagrams.
AP566
TP1003
C512
AP553
AP551
56 50 45 43
1
5
IC551
R815 10
FB804 FB802
R831
C521
5 4
15 20 25 28
IC804
AP550
AP587
L801
C561
AP558
8 1
AP557 AP555
R830 AP560
C823 AP556
AP586
D803
AP830
AP831
R840
AP907
8
R607
5
R609
C628
D603
D607
7 8 9
* Replacement of IC801 on main board
requires a special tool.
• Lead Layouts
Lead layout of conventional IC
42
40
C557
2 4 6 8
TP333
C558
(D-IN)
RB553
C559
35 TP332
1 3 5 7
(DGND)
TP331
(DVCC)
29
AP502
C522
CN501
C554
1 C529
C553
TP512
5
C556
B C E Q501
C555
10
TP(–)
R519
TP(+)
TP505
R521
15
TP519 L502 TP902(VL)
R1046
C904
L501
20
L904
TP518
C630
TP501
R907
R908
R921
R1036 L902
R910
AP906
L906
R909 TP901(VC)
R914
D904
R917 L901
TP912
(GND)
C902
D601 L601
Q601
T601
34 34
10 11 12
surface
CSP (chip size package)
MAIN BOARD
(SIDE A)
TP339 TP335 TP334
J301 (1/2)
LINE IN
(OPTICAL)
TP337
TP336
TP338
TP343 TP341
TP344
TP342
S806
F801
(OPEN/CLOSE DETECT)
TP345
J302 (1/2)
(RVCC)
TP311
TP312
(DTCK)
TP306
TP316
(KEY-R)
R105
TP307 TP313
(RGND)
C316
TP314
TP315
TP606
TP317
11
1-679-264- (11)
13 14
• Semiconductor
Location (SIDE A)
Ref. No. Location
D601 I-8
D603 I-6
D607 J-4
D803 G-4
D904 I-7
IC551 D-6
IC804 E-4
Q501 F-8
Q601 J-7
Q603 I-3