HP 630 Maintenance And Service Manual page 86

4.
Remove the system board (3) by sliding it up and to the right at an angle.
NOTE: A heat sink is attached to the base enclosure to service a component on the bottom of
the system board. The thermal material must be thoroughly cleaned from the surfaces of
the system board (1) and the heat sink (2) attached to the base enclosure each time
the system board is removed. Replacement thermal material is included with all base enclosure
and system board spare part kits.
Reverse this procedure to install the system board.
Component replacement procedures
77