Table of Contents
Advertisement
CCD,BTU, MONITOR AND REAR CIRCUIT BOARDS
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
<02>CCD
LYB10108-001C
FOIL SIDE(B)
COMPONENT SIDE(A)
<03>BTU
LYB20042-001A
FOIL SIDE(B)
L501
R501
C502
C503
L507
COMPONENT SIDE(A)
CN501
R521
R520
C514
C509
C508
L5001
R5005
3
2
Q5001
L5002
1
C5007
C5004
C5006
C5002
R5007
R5008
R5009
C504
C501
R502
L502
C510
L504
(No.YF219)2-39
<04>MONITOR
LYB20043-001C
FOIL SIDE(B)
D7701
D7702
D7703
S7501
<05>REAR
LYB20043-001C
FOIL SIDE(B)
CN404
D101
2-40(No.YF219)
CAUTION :
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH SAME TYPE AND RATED FUSE(S).
!
ATTENTION :
POUR UNE PROTECTION PERMANENTE CONTRE LES RISQUE D'INCENDE,
REMPLACER LES FUSIBLES PAR UNAAUTRE DE MEME TYPE ET DE MEME TENSION.
COMPONENT SIDE(A)
C7724
L7705
L7704
C7722
C7723
TL7702
TL7701
CN7702
TL7704
R7702
TL7705
TL7706
TL7703
Q7701
TL7709
TL7707
Q7702
D7706
C7714
C7713
C7712
TL7708
R7712
R7715
C7708
R7707
C7707
C7716
CN7701
C7721
C7720
C7719
C7704
C7703
COMPONENT SIDE(A)
CN109
TL101
R7502
R7503
Advertisement
Table of Contents
