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LG KE970 Service Manual

LG KE970 Service Manual

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Service Manual
KE970
Date: January, 2007 / Issue 1.0

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Summary of Contents for LG KE970

  • Page 1 Service Manual KE970 Date: January, 2007 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. * This manual provides the information necessary to install, program, operate and maintain the KE970. - 3 -...
  • Page 3 - 4 -...

  • Page 4: Table Of Contents

    5.7 Microphone trouble ........84 5.8 Vibrator trouble ........86 3. TECHNICAL BRIEF ......17 5.9 Keypad back light trouble.......88 3.1 KE970 Component Block diagram..17 5.10 Micro SD and SIM card trouble....90 3.2 Baseband Processor (BBP) 5.11 RF PART TROUBLESHOOTING ..93 Introduction ..........18 3.3 Power management IC ......30...
  • Page 5 - 6 -...

  • Page 6: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the KE970 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
  • Page 7 1. INTRODUCTION E. Notice of Radiated Emissions The KE970 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

  • Page 8: Abbreviation

    Gaussian Minimum Shift Keying GPIB General Purpose Interface Bus GPRS General Packet Radio Service Global System for Mobile Communications IPUI International Portable User Identity Intermediate Frequency Liquid Crystal Display Low Drop Output Light Emitting Diode LG Electronics - 9 -...
  • Page 9 1. INTRODUCTION OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory...

  • Page 10: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Feature Item Feature Comment Standard Battery Li-ion, 800mAh AVG TCVR Current 280mA Standby Current <2.7mA @PP9 Talk time 3hours (GSM TX Level 7) Standby time 277 hours (Paging Period:9, RSSI: -85dBm) Charging time 3 hours RX Sensitivity GSM900 : -105dBm, DCS/PCS : -105dBm GSM900: 32dBm (Level 5)

  • Page 11: Technical Specification

    2. PERFORMANCE 2.2 Technical specification Item Description Specification GSM900 TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 ) EGSM Frequency Band TX: 890 + 0.2 x (n-1024) MHz RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 ) DCS1800 TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
  • Page 12 2. PERFORMANCE Item Description Specification GSM900/EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Output RF Spectrum 6,000 DCS1800/PCS1900 (due to modulation) Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 13 2. PERFORMANCE Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM850 BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS1800/PCS1900 BER (Class II) < 2.439% @-100dBm Rx Level Report accuracy 3 dB 8 3 dB...
  • Page 14 2. PERFORMANCE Item Description Specification STMR > 17 dB Stability Margin > 40 dB Idle Noise Sending < -64dB Idle Noise Receiving < -47dB Side tone Distortion Three stage distortion < 10% <Change> System frequency 2.5ppm (26 MHz) tolerance <Change>32.768KHz tolerance 30ppm Standby Power consumption...
  • Page 15 2. PERFORMANCE Item Description Specification Battery Bar Number Voltage( 0.05V) 3.86V~4.2V Battery Indicator 3.75V~3.85V 3.75V~3.69V 3.69V~3.62V 3.62V~ 3.62V↓ 0.05V (Call) Low Voltage Warning 3.50V↓ 0.05V (Standby) Forced shut down Voltage 3.35 0.05 V 1 Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 800mAh...

  • Page 16: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1. KE970 Component Block diagram. Figure 1. KE970 Hardware architecture KE970 is composed with 3 different PCB part such as main PCB, keypad FPCB and slide FPCB. - 17 -...

  • Page 17: Baseband Processor (Bbp) Introduction

    3. TECHNICAL BRIEF 3.2. Baseband Processor (BBP) Introduction Figure 2. Top level block diagram of the S-GOLD2 (PMB8876) 3.2.1 General Description S-GOLD2 is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD2 Provides multimedia extensions such as camera, software MIDI, MP3 sound.

  • Page 18: Block Description

    3. TECHNICAL BRIEF 3.2.2. Block Description • Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration. - TEAKLite DSP core • ARM-Memory - 32k Byte Boot ROM on the AHB - 96k Byte SRAM on the AHB, flexibly usable as program or data RAM - 16k Byte Cache for Program (internal) - 8k Byte tightly coupled memory for Program(internal)
  • Page 19 3. TECHNICAL BRIEF - Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes) - Pulse Number Modulation output for Automatic Frequency Correction(AFC) - Serial RF Control interface: support of direct conversion RF - A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission - 1 Serial Synchronous SPI compatible interfaces in the controller domain...
  • Page 20 3. TECHNICAL BRIEF 3.2.5. USART Interface KE970 have two UART Drivers as follow : - USART1 : Hardware Flow Control / SW upgrade / Calibration - USART2 : SW debug trace. Table 3 USART Interface Spec. USART_0(USART1) Resource Name Remark...
  • Page 21 3. TECHNICAL BRIEF 3.2.7. GPIO map Over a hundred allowable resources, KE970 is using as follows except dedicated to SIM and Memory. KE970 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table. Table 5 S-Gold2 GPIO pin Map...
  • Page 22 3. TECHNICAL BRIEF MEMORY &CLK GPIO_20 F_DPD For INTEL Memory CLK32K CLK32K For FM Radio & BLUETOOTH GPIO_22 Not Use CAMERA I/F CIF_D0 CIF_D(0) Camera DATA[0] CIF_D1 CIF_D(1) Camera DATA[1] CIF_D2 CIF_D(2) Camera DATA[2] CIF_D3 CIF_D(3) Camera DATA[3] CIF_D4 CIF_D(4) Camera DATA[4] CIF_D5 CIF_D(5)
  • Page 23 3. TECHNICAL BRIEF GPIO_99 _USB_CHG_EN USB charging (High: charge disable, Low: enable) DIF_VD (in) _TF_PWR_EN Trans-Flash card power enable(active low) DIF_RESET1_GPIO DIF_RESET1 LCD Reset EINT6 REMOTE_INT For Remote Control Headset I2C_SCL For SM-Power, FM Radio, Audio AMP I2C_SDA " PM_INT (EINT) PM_INT SM-Power interrupt SIM CARD...
  • Page 24 3. TECHNICAL BRIEF I2S1_RX I2S1_RX For Bluetooth I2S1_TX I2S1_TX " I2S1_WA0 I2S1_WA0 " MMCI_DAT[1] TF_DAT1 For T-Flash MMCI_DAT[2] TF_DAT2 " MMCI_DAT[3] TF_DAT3 " AUDIO I/F EPN1 RCV_N For Receiver EPP1 RCV_P " EPPA1 BBP_SND_L For Speaker EPPA2 BBP_SND_R For Speaker MICN1 MIC1_N For Mic...
  • Page 25 3. TECHNICAL BRIEF TRIG_IN TRIG_IN " MON1 MON1 " MON2 MON2 " TRACESYNC TRACESYNC " TRACECLK TRACECLK " PIPESTAT[2] PIPESTAT[2] " PIPESTAT[1] PIPESTAT[1] " PIPESTAT[0] PIPESTAT[0] " TRACEPKT[0] TRACEPKT[0] " TRACEPKT[1] TRACEPKT[1] " TRACEPKT[2] TRACEPKT[2] " TRACEPKT[3] TRACEPKT[3] " TRACEPKT[4] TRACEPKT[4] "...
  • Page 26 3. TECHNICAL BRIEF EBU_RD_n Read strobe EBU_BC0_n _BC0 EBU_BC1_n _BC1 EBU_A[0] A(0) Address bus[0] EBU_A[1] A(1) Address bus[1] EBU_A[2] A(2) Address bus[2] EBU_A[3] A(3) Address bus[3] EBU_A[4] A(4) Address bus[4] EBU_A[5] A(5) Address bus[5] EBU_A[6] A(6) Address bus[6] EBU_A[7] A(7) Address bus[7] EBU_A[8] A(8)
  • Page 27 3. TECHNICAL BRIEF EBU_WAIT_n _WAIT EBU_SDCLKO SDCLKO EBU_SDCLKI SDCLKI EBU_BFCLKO BFCLKO EBU_BFCLKI BFCLKI EBU_CKE Memory FCDP_RBn F_DPD TDMA RF I/F T_OUT0 TXON_PA RF Power amp turn on GPIO_44 VIBRATOR_EN Vibrator enable(High: enable, Low:disable) T_OUT2 PA_BAND RF band select T_OUT3 ANT_SW1 RF FEM control signal 1 T_OUT4 ANT_SW2...
  • Page 28 3. TECHNICAL BRIEF F32K Sleep crystal 32.768KHz OSC32K Sleep crystal 32.768KHz RESET_n _RESET Baseband processor reset CC1CC1IO TRIG_OUT For JTAG & ETM Interface Wake up signal to alarm (High; RTC_OUT RTC_OUT wake up, Low: Power off) VCXO_EN VCXO_EN 26MHz clock enable DSPIN0 _BT_RESET Bluetooth chip reset...

  • Page 29: Power Management Ic

    3. TECHNICAL BRIEF 3.3. Power management IC 3.3.1. General Description SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold2. Although optimized for usage with the Infineon S- GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well.
  • Page 30 3. TECHNICAL BRIEF Figure 3 Top level block diagram of the SM-Power(PMB6812) SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter (SDBB) cascaded by two linear regulators (LBB1/2) - SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g.
  • Page 31 3. TECHNICAL BRIEF SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator LBB1 for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being supplied by the other linear regulator LBB2.
  • Page 32 RTC block & Backup battery LRF1 2V85_RF 2.85V 250mA RF IC LRF2 2V7_RF 2.7V 10mA RF IC LRF3 2V65_BT 2.65V 150mA BT IC(Blue moon) LUSB 3V1_USB 3.1V 45mA USB I/F Figure 4 Power domain block diagram of KE970 - 33 -...
  • Page 33 3. TECHNICAL BRIEF PMIC & Li-ion CHARGER VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT C205 C206 C207 C208 0.1u 0.1u 0.1u 0.1u R204 R205 RTC_OUT PWRON VBACKUP 220K R207 470K SPOWER_INT VCH_CTL _PMRST C215 C216 C217 C218 C219 C220 C221 VBAT 2.2u...

  • Page 34: Power On/Off

    -5˚C ~ 50˚C : standard charging (up to 4.2 V) c. 50˚C ~ : low charging voltage operation (3.6V ~ 3.9V) 3.4. Power ON/OFF KE970 Power State : Defined 3cases as follow ] Power-ON : Power key detect ( SM-Power’s ON port ] Power-ON-charging : Charger detect.
  • Page 35 ON does not reach VIHdet (Vbat-0.8 ~ Vbat-0.3) the above-mentioned bit won’t be set. To support Remote power on function for factory mass production, applied an analog switch as following figure. As monitoring the RPWRON(GPIO_110) and Key matrix KP_OUT(1) & KP_IN(5), KE970 system recognize whether remote power on or End-key pushed VBAT U305...

  • Page 36: Sim Interface

    3. TECHNICAL BRIEF 3.5. SIM interface KE970 supports 3V plug in SIM, SIM interface scheme is shown in (Figure 10). SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold2) and the SIM power supply enabled by BBP (_SIM_EN). SIM Interface...

  • Page 37: Memory

    3. TECHNICAL BRIEF 3.6. Memory 512Mbit Flash & 256Mbit SDRAM employed on KE970 with 16 bit parallel data bus thru ADD(0) ~ ADD(24). The 512Mbit Sibley Wireless Flash memory with LPSDRAM stacked device family offers multiple high-performance solutions. The Sibley flash die is manufactured on 90 nm process technology.

  • Page 38: Lcd Display

    3. TECHNICAL BRIEF 3.7. LCD Display LCD module include: - LCD : 320*240 265K Color TFT LCD - Backlight : 5 piece of white LED illumination LCD module is connected to main board thru 35 pins connector. LCD FPC Interface Spec: Table 7 LCD FPC Interface Spec.

  • Page 39: Keypad Switching & Scanning

    3. TECHNICAL BRIEF 3.8. Keypad Switching & Scanning The keypad interface is a peripheral which can be used for scanning keypads up to 6 rows (outputs from Port Control Logic) and 6 columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.
  • Page 40 3. TECHNICAL BRIEF MENU SERCH KP_IN(0) LEFT RIGHT KP_IN(5) KP_OUT(0) KP_OUT(1) KP_OUT(2) VA601 VA602 ICVL0505600V150FR ICVL0505600V150FR Figure 12 LCD PCB part Navi & Scroll key matrix Most of numeric keys are located on the Keypad FPCB, Scroll key for menu navigation is on the LCD FPCB, and Power on (End key), BGM hot key, Camera shutter and volume up &...

  • Page 41: Keypad Back-Light Illumination

    3. TECHNICAL BRIEF 3.9. Keypad back-light illumination There are 2 snow white color LEDs on the KEY FPCB for keypad illumination. Keypad Back-light is controlled by SM-Power LED port which has constant current control function. The whole configuration of the SM-POWER LED drivers is shown in below Figure16. Figure 13 Keypad Back-light LEDs VBAT LEWWS44-E...

  • Page 42: Lcd Back Light Illumination

    3. TECHNICAL BRIEF 3.10. LCD back light illumination The MAX8645Y charge pump drives up to 6 white LEDs in the main display for backlighting and up to 2 white LEDs for flash, all with regulated constant current for uniform intensity. By utilizing adaptive 1x/1.5x/2x charge pump modes and very-low-dropout current regulators, it achieves high efficiency over the 1-cell lithium-battery input voltage range.
  • Page 43 3. TECHNICAL BRIEF Initial t > 200 s ENM1 and ENM2 SOFT-START SHDN 2ms (typ.) 32/32 32/32 500ns to 250us > 500ns 31/32 31/32 30/32 29/32 28/32 27/32 or I 5/32 4/32 3/32 2/32 SHDN 1/32 SHDN Figure 16 Seiral pulse dimming timing diagram Setting the Main Output Current SETM controls M1-M6 regulation current.

  • Page 44: Battery Current Consumption Monitor

    TRACESYNC Figure 18 JTAG & ETM(Embedded Trace Module) interface connector In case of KE970 mass production, the JTAG & ETM interface connector will not be mount on board. That is only for developing and software debugging purpose. - 45 -...

  • Page 45: Audio

    3. TECHNICAL BRIEF 3.13. Audio KE970 Audio signal flow diagram as following diagram. Figure 19 Audio signal flow diagram - 46 -...
  • Page 46 3. TECHNICAL BRIEF 3.13.1. Audio amplifier sub system IC with 3D effect Audio amplifier sub system IC is an audio power amplifier capable of delivering 500mW of continuous average power into a mono 8 load, 25mW per channel of continuous average power into stereo 32 single-ended (SE) loads.

  • Page 47: Multi Port Switch

    3. TECHNICAL BRIEF 3.13.2. Microphone with gain switching circuit When a call is established, MICBIAS signal goes up to ‘2.5V’ in the MKE970. PMB8876(S-Gold2) provides both 2.0V and 2.5V for MICBIAS to circuit designer. VA01, VA02 are employed to enhance ESD immunity.
  • Page 48 3. TECHNICAL BRIEF 2V72_IO VBAT R229 Pin6 TXD_0 Pin7 RXD_0 C257 0.1u VBAT U206 DG2018DN_T1_E4 R231 Pin7 COM4 MULTI_PORT_1 JACK_DETECT IN1_2 C259 IN3_4 100p COM2 Pin7 R234 Q204 VBUS_USB RN1307 R236 R244 Pin6 REMOTE_INT 100K MULTI_PORT_0 Pin7 REMOTE_ADC VA201 USB_PU R239 1.5K Pin6...

  • Page 49: Usb Charging Circuit

    3. TECHNICAL BRIEF 3.15. USB charging circuit The USB charging circuit is a fully integrated USB VBUS voltage single-cell Li-ion battery charger circuit. The charger uses a CC/CV charge profile required by Li-ion batteries. CC charging current and End of charging current is programmable I &...

  • Page 50: Bluetooth

    3. TECHNICAL BRIEF 3.16. BLUETOOTH Figure 26 BLUETOOTH Functional block diagram. - 51 -...

  • Page 51: General Features

    3. TECHNICAL BRIEF 3.16.1. General Features • Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory • Fabricated in advanced low power 0.13•Ïm CMOS technology • Very low component count (6 external components) • Ultra low power design - Peak current 40mA for basic data rate - Peak current 45mA for enhanced data rate - Bluetooth low power mode typ.
  • Page 52 3. TECHNICAL BRIEF 3.16.5. RF-Section • Integrated antenna switch to minimize external components count • Programmable RF transmit power between -55dBm...+6dBm - Fine tuning in 2dB programmable steps also supported • 20dBm power class 1 supported with external power amplifier - Separate TX output interface to PA (bypass of internal T/R switch) - Digital power step control •...
  • Page 53 HCI Three-Wire UART transport layer two interface lines (UARTTXD and UARTRXD) are needed. The hardware flow control lines (UARTRTS and UARTCTS) are supported but the use is optional. In KE970 used three-wire UART communication. The UART interface has its own supply voltage (VDDUART) to ensure compatibility with the I/O voltages used by the S-Gold2.

  • Page 54: Micro Sd External Memory Card Slot

    3. TECHNICAL BRIEF 2V72_IO 1V8_MEM BLUETOOTH C323 C324 0.1u 0.1u SCL0_P0_13 PCMFR2_SDA0_P0_12 BT_VCXO_EN SLEEPX_P0_15 CLK32_P1_5 CLK32K TRST_ 2V65_BT 1V5_CORE 1V8_MEM VBALUN RTCK WAKEUP_HOST_P1_8 JTAG_ WAKEUP_BT_P1_7 RESET_ _BT_RESET VDDSUP U307 RFOUT VDDCREG PMB8753 VDD_1 PAON VDD_2 PSEL0 VDDC1 PSEL1 VDDC2 VDDPMREG TX_CONF_RXON VDDRF VDDRFREG1...
  • Page 55 3. TECHNICAL BRIEF Table 10 Micro SD memory pad assign. SD mode Pin No. Name Type Description DAT2 Data bit [2] CD/DAT3 Data bit [3] Command response Power Power supply Clock Ground Power ground DAT0 Data bit [0] DAT1 Data bit [1] Figure 30 Micro SD memory card detection scheme Table 11 Micro SD memory card detect truth table.

  • Page 56: 18Pin Multi Media Interface Connector

    0.1u C348 2.2u Figure 31 Micro SD socket circuit with power control 3.18. 18pin Multi Media Interface connector Table 12 Multi media interface pin assign KE970 MMI Pin Function Description FM_ANT FM radio antenna / Audio ground HS_MIC Headset microphone signal...
  • Page 57 3. TECHNICAL BRIEF R318 U304 NCP348MTR2G R319 100K GATE_OUT VCHG R338 GATE 18PIN MUILTIPORT RECEPTACEL _FLAG OUT2 OUT1 2V85_IO2 R320 U306 NCS2200SQ2T2G 2V72_IO 2V65_ANA VSUPPLY 2V65_ANA VIN- R321 HOOK_DETECT C325 VIN+ 100p R322 C328 C327 220K R323 100p 1.5K MIC2_N C329 C330 R328...

  • Page 58: General Description

    3. TECHNICAL BRIEF RF circuit technical brief 3.19. General Description The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. The transceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality.
  • Page 59 3. TECHNICAL BRIEF GSM850 GSM900 DCS1800 PCS1900 2V85_RF 1V5_RF 2V85_RF C416 C417 C418 C419 C420 C421 C422 C423 2.5p 2.5p 2.2p 2.2p 1.5p 1.5p 1.2p 1.2p C424 C425 0.1u 0.1u L404 L403 L402 L405 18nH 5.6nH 22nH 5.6nH 2V85_RF 2V7_VCXO 1V5_RF R408 C432...

  • Page 60: Receiver Part

    3. TECHNICAL BRIEF 3.20. Receiver part Figure 35 Receiver part block diagram The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.

  • Page 61: Transmitter Part

    3. TECHNICAL BRIEF 3.21. Transmitter part The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N Sigma-Delta synthesizer without any external components (see Figure39). The analog I/Q modulation data from the baseband is converted to digital, filtered and transformed to polar coordinates.

  • Page 62: Rf Synthesizer

    3. TECHNICAL BRIEF control pin VBIAS for efficiency enhancement. In GMSK mode, the PA is in saturated high efficiency mode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- / down-ramping and output power level are set. In 8PSK mode, the ramping functionality is assured by an on-chip ramping generator, whereas output power is controlled by the PGA’s as described above.

  • Page 63: Front End Module Control

    3. TECHNICAL BRIEF 3.24. Front End Module control Implemented in the Transceiver are two outputs for direct control of front end modules with two logic input pins to select RX- and TX-mode as well as low- and high band operation. 2V85_RF U401 NC7WV16P6X...

  • Page 64: Pcb Layout

    4. PCB layout 4. PCB layout 4.1 Main & Sub PCB component placement Figure 39 Main PCB top Figure 40 Main PCB top placement - 65 -...
  • Page 65 4. PCB layout Figure 41 Main PCB bottom Figure 42 Main PCB bottom placement - 66 -...
  • Page 66 4. PCB layout Figure 43 KEY FPCB top Figure 44 KEY FPCB placement - 67 -...
  • Page 67 4. PCB layout Figure 45 KEY FPCB bottom Figure 46 KEY FPCB bottom placement - 68 -...
  • Page 68 4. PCB layout RF transceiver Antenna feeding Mobile SW RF PAM Charging block 26MHz Main clock SIM/T-Flash socket OVP block Camera connector Audio Amp Back Up Battery PMIC Power inductor BlueTooth Memory Audio/AF LDO 18Pin connector KEY FPCB connector Battery contact Sleep crystal - 69 -...
  • Page 69 4. PCB layout Flash LED LCD FPCB LCD Backlight connector block Key light Volume up Volume down AF trig / Shutter Microphone Main connector - 70 -...
  • Page 70 4. PCB layout Hall IC conne ctor Slide key Vibrator KEY FPCB conne ctor - 71 -...

  • Page 71: Trouble Shooting

    5. Trouble shooting 5. Trouble shooting 5.1 Trouble shooting test setup 4.000V 0. 0000A Figure 51 Equipment setup Power on all of test equipment - Connect PIF-UNION JIG or dummy battery to the DUT for power up. - Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.
  • Page 72 5. Trouble shooting VBAT U305 NLAST4599DFT2G C326 0.1u 6 NO PWRON END_KEY RPWRON R329 100K VBAT U308 R1114D281D-TR-F R331 VOUT RPWRON KP_OUT(1) C341 GND1 0.1u R311 Q301 RPWRON_EN GND2 END_KEY 2SC5585 R310 C344 R334 C345 KP_IN(5) 100K 100p 100K 0.1u End key _RESET - 73 -...
  • Page 73 5. Trouble shooting PMIC & Li-ion CHARGER VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT C205 C206 C207 C208 0.1u 0.1u 0.1u 0.1u R204 R205 RTC_OUT PWRON VBACKUP 220K R207 470K SPOWER_INT VCH_CTL _PMRST C215 C216 C217 C218 C219 C220 C221 VBAT 2.2u...
  • Page 74 5. Trouble shooting START Connect power supply to the DUT Vbat = over 3.35V Check the RPWRON, replace U305 "PWRON" signal Check solder "_RESET" U303 or replace it signal Check solder Check the all U203 or replace it LDO's output Check solder Is the 26MHz X401, U403...

  • Page 75: Charging Trouble

    5. Trouble shooting 5.3 Charging trouble Check Points -Connection of TA (check TA voltage 4.8V) -Charging Current Path component voltage drop -Battery voltage • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 4.0V •...
  • Page 76 5. Trouble shooting START Resolder the 18pin CN303 MMI(CN303) The TA can be broken Source pin Change other TA of Q201= then retest Check solder Drain pin Q201 or replace it of Q201 = D201 voltage Replace it drop Waiting until battery Battery voltage Voltage goes up to 3.4V is over 3.4V?

  • Page 77: Lcd Display Trouble

    5. Trouble shooting 5.4 LCD display trouble Check Points -LCD assembly status ( FPCB) -Connector combination CN501 KP_IN(0:5) KP_IN(0) VMICP KP_IN(1) VMICN KP_IN(2) MIC1_P L501 270nH KP_IN(3) C504 C505 270nH L502 KP_IN(4) MIC1_N KP_OUT(0:4) KP_IN(5) SPK_RCV_P KP_OUT(0) SPK_RCV_N KP_OUT(1) KP_OUT(4) SCROLL_KEY_A KP_OUT(2) SCROLL_KEY_B...
  • Page 78 5. Trouble shooting START Check LCD connector combination then LCD test with New LCD Replace LCD Is LCD connector OK? connector Replace LCD Is LCD FPCB module normal? Assemble - 79 -...

  • Page 79: Camera Trouble

    5. Trouble shooting 5.5 Camera Trouble Check Points -Connectors combination -EMI filter soldering C301 100p 1V8_MEM 2V85_IO2 CIF_PCLK OUT8 R301 CN301 CIF_RESET OUT7 C304 OUT6 0.1u OUT5 CIF_D7 OUT4 C305 CIF_D(7) 0.1u CIF_D6 OUT3 CIF_D(6) CIF_D5 OUT2 CIF_D(5) CIF_D4 OUT1 CIF_D7 CIF_D(4) CIF_D6...
  • Page 80 5. Trouble shooting START Check camera connector, 34pin main PCB connector combination then Camera test with equipped camera module FL301, FL304 are Resolder soldered well? Replace Replace New Main PCB Camera Replace Camera module Assemble - 81 -...

  • Page 81: Receiver & Speaker Trouble

    5. Trouble shooting 5.6 Receiver & Speaker trouble Check Points -Speaker wire -Audio amp soldering 3V3_AUDIO VMICP C255 C302 C256 0.1u VMICN MIC1_P MONO_IN+ 2V72_IO C303 MONO_IN- MONO+ SPK_P MIC1_N U207 ID_ENB MONO- SPK_N R233 100K LM4946SQX SPK_RCV_P RHP3D1 C260 L301 100nH 0.068u...
  • Page 82 5. Trouble shooting START Check Speaker wire Resolder or L301, L302 Replace SPK have low resistance? module Replace LCD FPCB Between L301, L302 then retest and Speaker contact Resolder or U207 is working Replace it properly? Replace Main PCB Assemble - 83 -...

  • Page 83: Microphone Trouble

    5. Trouble shooting 5.7 Microphone trouble Check Points -Microphone hole -Mic. Bias & signal come from MICROPHONE VA501 ESD9X5.0ST5G MIC1_P C501 C502 C503 MIC501 OSF213-42DC MIC1_N VA502 ESD9X5.0ST5G R503 R504 VMICP C506 R505 R507 VMICN R506 Mic. bias - 84 -...
  • Page 84 5. Trouble shooting START Check microphone sound hole Make a phone call then Check mic. Bias R503 Mic. Bias come line from BBP? 70pin connector Repair the damaged combination part is good? Replace Signal comes out from microphone Microphone Assemble - 85 -...

  • Page 85: Vibrator Trouble

    5. Trouble shooting 5.8 Vibrator trouble Check Points - Vibrator contact - IC is working correct U302 SUY98005LT1G R313 R314 L303 VIBRATOR_EN MOTOR_N R315 VOUT 100nH C322 100K 0.1u Check the wire and soldering Check the driver IC Enable signal goes to high then vibration - 86 -...
  • Page 86 5. Trouble shooting START Check Vibrator wire and soldering Check U302 or Pin1 of U302 is replace it high ? Check U302 or Pin3 of U302 is replace it low? Replace Vibrator Assemble - 87 -...

  • Page 87: Keypad Back Light Trouble

    5. Trouble shooting 5.9 Keypad back light trouble Check Points -Signal path is connected well -Control IC is working properly VBAT LEWWS44-E LD501 KEY_BACKLIGHT R501 100ohm R502 100ohm LD502 LEWWS44-E Check R501,502 resistor - 88 -...
  • Page 88 5. Trouble shooting START Check All of LEDs solder Check U203ís R181ís voltages pin17 or goes down replace it Repair the damaged 70pin connector part combination Replace Sub PCB Assemble - 89 -...

  • Page 89: Micro Sd And Sim Card Trouble

    5. Trouble shooting 5.10 Micro SD and SIM card trouble Check Points -Power control FET is working -Socket soldering -Proper SIM is used -Card detect is working 2V85_CARD 2V72_IO C236 C237 Q203 2V85_SIM 1 S1 D1 6 R212 100K TF_PWR_EN R213 R214 3 D2...
  • Page 90 5. Trouble shooting Check soldering all pin of socket Pin 1,6 / 2V85_SIM Pin 3 / SIM_CLK TF_DETECT - 91 -...
  • Page 91 5. Trouble shooting START Check All of SIM card voltage KE820/KG99 support 1.8V & 3V SIM only Repair it 6 pins are soldered well? Replace the Q202 is damaged working? part SIM connector Repair it 10 pins are soldered well? Replace the Q203 is damaged...

  • Page 92: Rf Part Troubleshooting

    5. Trouble shooting 5.11 RF PART TROUBLESHOOTING 5.11.1 RF Components SW401 U402 X401 U403 FL401 REFERENCE PART Description U402 PAM (Power Ampilifier Module) X401 VCTCXO (26MHz) FL401 FEM (Front End Module) U403 Transceiver SW401 Mobile Switch - 93 -...

  • Page 93: Trouble Shooting Of Receiver Part

    5. Trouble shooting 5.11.2 Trouble Shooting of Receiver Part Checking Flow START Setup Test Equipment Cell Power : -7 4dBm EGSM CH30 DCS CH699 Check point VCTCXO Check point PLL Control Check point Mobile SW &FEM Check point RX I/Q Signal Re-Download S/W &...

  • Page 94: Checking Vctcxo Circuit

    5. Trouble shooting 5.11.3 Checking VCTCXO Circuit Checking Points Checking Flow Pin : 2.7V Is the waveform Replace X401 of Pin3 similar to X401 Is the waveform Checking U203 of Pin4 similar to (PMIC) Pin 3: 26MHz VCTCXO Circuit is OK. See next page to check PLL Circuit.
  • Page 95 5. Trouble shooting 5.11.4 Checking PLL Control signals Checking Points Checking Flow R426 (RF_CLK) EN Signal is Check U403 OK ? R423 (RF_DATA) DA(Data) is U403 Check U403 Normal? CLK(Clock) is Check U403 R416 (RF_EN) Normal? Control Signal is OK. See next page to check Mobile SW &...
  • Page 96 5. Trouble shooting 5.11.5 Checking Mobile SW & FEM Mobile SW & FEM Circuit Diagram C404 C405 LSHS-M085FE L406 3.3nH R404 FL401 C406 SW401 L401 C407 KMS-512 100nH 1.2p WFL-R-SMT10 CN401 Checking Points SW401 FL401 RX Mode EGSM ANT_SW1 ANT_SW2 - 97 -...
  • Page 97 5. Trouble shooting Checking Flow Check Pin 1, 2 of SW401 with RF Cable Replace Mobile SW Signal is OK ? (SW401) Check Pin 20, 21, 22 of FL308? Control Signal is Check PMB8876 (U102) Pin 16, 17 or 14, Replace FEM (FL308) Mobile SW &...
  • Page 98 5. Trouble shooting 5.11.6 Checking RX I/Q Signals Checking Flow R422 RF_CLK Check RX I/Q Signals R423 RF_DA R424 Replace Signals are Transceiver C447 C448 Normal ? PMB6272(U403) R425 R426 RX Part is OK. Check Base Band Circuit C449 C450 R427 Re-Download S/W and Cal Checking Points...

  • Page 99: Checking Pll Control Signal

    5. Trouble shooting 5.11.7 Shooting of Transmitter Part Checking Flow Checking Points Setup Test Equipment Cell Power : - 74dBm EGSM CH30 DCS CH699 Check point VCTCXO Check point PLL Control Check point TX I/Q Signal Check point Transceiver Check point PAM Control Check FEM &...
  • Page 100 5. Trouble shooting 5.11.10 Checking TX I/Q Signals Checking Flow R422 RF_CLK Check TX I/Q Signals R423 RF_DA R424 C447 C448 Signals are Normal ? R425 R426 C449 C450 TX Part is OK. R427 Check Base Band Circuit Re-Download S/W and Cal Checking Points U403 - 101 -...
  • Page 101 5. Trouble shooting 5.11.11 Checking Transceiver Output Signals VBIAS VBIAS VDDTX1V5 VDDRX2 R409 VDDRX1 LBAND_PAM_IN U403 R410 VCO_ HBAND_PAM_IN PMB6272 VDDTX2V8 VDDVCO2 VDDMIX2V8 R417 R418 R412 R413 R415 C438 C439 GND3 VDDXO2 0.1u 0.1u GND4 Checking Points LBAND PAM IN U402 HBAND PAM IN (DCS/PCS) MODE...
  • Page 102 5. Trouble shooting Checking Flow Check Output Signal Replace Signals are PMB6272(U402) Normal ? Transceiver is OK. See next page to check PAM Control Circuit. - 103 -...
  • Page 103 5. Trouble shooting 5.11.12 Checking PAM Control Signals GND25 GND15 GND24 GND14 GND23 GND13 GND22 GND12 GND21 GND11 GND20 GND10 VSUPPLY GND19 GND9 GND18 GND8 GND17 GND7 U402 GND16 GND6 SKY77340 GSM_OUT TXON_PA GND5 GSM_IN LBAND_PAM_IN GND4 VRAMP PA_LEVEL R405 1.2K RSVD2 VBATT...
  • Page 104 5. Trouble shooting Checking Flow Check Control Signals Check Signals are PMB8876(U102) Normal ? PAM Control Signal is See next page to check FEM & Mobile SW Circuit - 105 -...
  • Page 105 5. Trouble shooting 5.11.13 Checking FEM & Mobile SW Mobile SW & FEM Circuit Diagram C404 C405 LSHS-M085FE L406 3.3nH R404 FL401 C406 SW401 L401 C407 KMS-512 100nH 1.2p WFL-R-SMT10 CN401 Checking Points SW401 FL401 TX Mode EGSM ANT_SW1 ANT_SW2 - 106 -...
  • Page 106 5. Trouble shooting Checking Flow Check Pin 1, 2 of SW401 with RF Cable Replace Mobile SW Signal is OK ? (SW401) Check Pin 20, 21, 22 of FL308? Control Signal is Check PMB8876 (U102) Pin 16, 17 or 14, Replace FEM (FL308) Mobile SW &...

  • Page 107: Download & S/W Upgrade

    6. Download & S/W upgrade 6. Download & S/W upgrade 6.1 S/W download setup 4.000V 0.0000A Preparation • Target terminal • PIF-Union • RS-232 Cable and PIF-UNION to Phone interface Cable • Power Supply or Battery • IBM compatible PC supporting RS-232 with Windows 98 or newer. If you are going to use battery, the voltage of the battery should be over 3.7V for stable power supplying during S/W download.

  • Page 108: Download Program User Guide

    6. Download & S/W upgrade 6.2 Download program user guide Execute Flashtool program, then below window will be appeared. Click the OK button - 109 -...
  • Page 109 6. Download & S/W upgrade When the application is started first time the following screen appears. Each section is described in the text below. Click the check box to enable or disable file download. Click on the blue text to select the file to download. This will open a normal file select box.
  • Page 110 6. Download & S/W upgrade Click on the blue text to select the COM port. - 111 -...
  • Page 111 6. Download & S/W upgrade Click on the blue text to select the Baud rate. Click OK button to next step. - 112 -...
  • Page 112 6. Download & S/W upgrade Will change the window as below Click to anywhere on the control panel to start download. Can see the “Reset the phone/module” then remote power on the target phone - 113 -...
  • Page 113 6. Download & S/W upgrade During download, the screen will look something like this: The blue bar shows the download progress. The FLS filename and the expected checksum are shown. The download statistics are shown. Click “Reset” to reset the counters. After download, the status is shown.
  • Page 114 6. Download & S/W upgrade If there is a need to stop the download process, click on the panel for the channel to be stopped. To stop the download the panel must be clicked twice. This is to avoid that the download is stopped accidentally. Furthermore, to avoid that the download is stopped on a mouse double-click, there must be at least 0.5 second between the two clicks.
  • Page 115 6. Download & S/W upgrade - 116 -...

  • Page 116: Circuit Diagram

    100nH 100nH ON_SW ON_SW RPWRON_EN VBAT VBAT VSUPPLY Engineer: OJ101 OJ102 OJ103 OJ104 URXD LG Electronics UTXD Drawn by: G.C.LIM RTS_0 R&D CHK: Size: B.Y.YANG TITLE: CTS_0 KE/ME970 MAIN DOC CTRL CHK: 12 1 8 A (Infineon S-GOLD2) MFG ENGR CHK:...
  • Page 117 MULTI_PORT_1 NLAS5223BMNR2G REMOTE_INT REMOTE_ADC C271 TXD_0 RXD_0 RCV_N 100p USB_DP USB_DM SPK_RCV_P Engineer: LG Electronics Drawn by: G.C.LIM R&D CHK: Size: B.Y.YANG TITLE: KE/ME970 MAIN DOC CTRL CHK: 12 1 8 A (PMIC, AUDIO, etc.) MFG ENGR CHK: Changed by:...
  • Page 118 VBUS_USB C343 0.1u R335 R336 BT_CLK C347 L305 1.2nH 100p C348 2.2u Engineer: LG Electronics Drawn by: G.C.LIM Size: R&D CHK: B.Y.YANG TITLE: KE/ME970 MAIN DOC CTRL CHK: 12 1 8 A (BT, External connector, etc.) MFG ENGR CHK: Changed by:...
  • Page 119 0.1u 0.1u R423 RF_DA R424 C447 C448 R425 R426 C449 C450 R427 Engineer: LG Electronics Drawn by: H.T.LEE R&D CHK: Size: B.Y.YANG TITLE: KE/ME970 MAIN DOC CTRL CHK: 12 1 8 A (RF) MFG ENGR CHK: Changed by: Date Changed:...
  • Page 120 L504 100nH KP_OUT(4) LD503 LEWWH25LA MLED_A FLASH_LED_C VA504 IN502 IN504 IN501 IN503 Engineer: LG Electronics Drawn by: JASON R&D CHK: Size: G.C.Lim TITLE: KE970/ME970 DOC CTRL CHK: 12 1 8 A KEY FPCB MFG ENGR CHK: Changed by: Date Changed:...
  • Page 121 KP_OUT(2) KP_OUT(0) KP_OUT(1) VA601 VA602 ICVL0505600V150FR ICVL0505600V150FR KP_OUT(2) MSMF05C-P VISION MARK TP601 TP602 Engineer: LG Electronics Drawn by: JASON R&D CHK: Size: G.C.LIM TITLE: KE970/ME970 DOC CTRL CHK: 12 1 8 A LCD FPCB(LGIT/HITACHI) MFG ENGR CHK: Changed by: Date Changed:...

  • Page 122: Pcb Layout

    8. PCB LAYOUT - 123 -...
  • Page 123 8. PCB LAYOUT - 124 -...
  • Page 124 8. PCB LAYOUT - 125 -...
  • Page 125 8. PCB LAYOUT - 126 -...
  • Page 126 8. PCB LAYOUT - 127 -...
  • Page 127 8. PCB LAYOUT - 128 -...

  • Page 128: Rf Calibration

    9. RF Calibration 9. RF Calibration 9.1 Test Equipment Setup 4.00 V 0.000 A 9.2 Calibration Steps 9.2.1. Turn on the Phone. 9.2.2. Execute “HK_24.exe” - 129 -...
  • Page 129 9. RF Calibration 9.2.3. Click “SETTING” Menu 9.2.4. Setup “Ezlooks” menu such as the following figure - 130 -...
  • Page 130 9. RF Calibration 9.2.5. Setup “Line System” menu such as the following figure Adjust the number of 9.2.6. Setup Logic operation such as the following figure. Operation Mode 1. By-Pass: not control by GPIB 2. Normal : control by GPIB Setup UART Port PWR : Power Supply CELL :Call-Test Equipment...
  • Page 131 9. RF Calibration 9.2.7. Select “MODEL”. 9.2.8. Click “START” for RF calibration 9.2.9. RF Calibration finishes. - 132 -...
  • Page 132 10. Stand-alone Test 9.2.10. Calibration data will be saved to the following folder. Saving format: year/month/day_PASS - 133 -...
  • Page 133 6. Download & S/W upgrade Notices: 1. The state of Phone is “ test mode “ during the CALIBRATION. 2. Calibration program automatically changes either “normal mode” or “ptest mode”. 3. RF Calibration steps as follow: TX Channel compensation: EGSM->DCS->PCS->EDGE EGSM->EDGE DCS->EDGE PCS RX Channel compensation: EGSM->DCS->PCS 4.

  • Page 134: Stand Along

    10. Stand along 10. Stand along 10.1. Test Program Setting 1 Set COM Port. 2 Check PC Baud rate. 3 Confirm EEPROM & Delta file prefix name. 4 Click “Update Info” for communicating Phone and Test -Program. Not Connected - 135 -...
  • Page 135 10. Stand along Connected 5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar. 6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished. Change "ptest mood" - 136 -...

  • Page 136: Tx Test

    10. Stand along 10.2. Tx Test 1 Click “Non signaling mode” bar and then confirm “OK” text in the command line. 2 Put the number of TX Channel in the ARFCN. 3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu. 4 Finally, Click “Write All”...

  • Page 137: Rx Test

    10. Stand along 10.3. Rx Test 1 Put the number of RX Channel in the ARFCN. 2 Select “Rx” in the RF mode menu. 3 Finally, Click “Write All” bar and try the efficiency test of Phone. 4 The Phone must be changed “normal mode” after finishing Test. 5 Change the Phone to “normal mode”...

  • Page 138: Engineering Mode

    11. ENGINEERING MODE 11. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*#” Select. Pressing END will switch back to non-engineering mode operation.
  • Page 139 - 140 -...

  • Page 140: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW 21 34 - 141 -...
  • Page 141 - 142 -...

  • Page 142: Replacement Parts

    Silver MCJA00 COVER,BATTERY MCJA0037301 PRESS, STS, , , , , Silver Aluminum APEY00 PHONE APEY0370401 KE970 EUAAV Silver Aluminum ACGM00 COVER ASSY,REAR ACGM0080801 KE970_COVER ASSY,REAR Silver MCCC00 CAP,EARPHONE JACK MCCC0043501 MOLD, Urethane Rubber S195A, , , , , Without Color...
  • Page 143 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark MICZ01 INSERT MICZ0028901 COMPLEX, (empty), , , , , Gold MTAB00 TAPE,PROTECTION MTAB0140001 COMPLEX, (empty), , , , , Green MTAZ00 TAPE MTAZ0162701 COMPLEX, (empty), , , , , Without Color MTAZ01 TAPE...
  • Page 144 1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm Black MCCH00 CAP,SCREW MCCH0097401 MOLD, Urethane Rubber S195A, , , , , Without Color MLAK00 LABEL,MODEL MLAK0006301 LG (30.5x21.5 4-1R) Pearl White MCBA00 CAN,SHIELD MCBA0012801 PRESS, STS, , , , , Silver MPBZ00 MPBZ0180401...

  • Page 145: Replacement Parts

    12. EXPLODED VIEW & REPLACEMENT PART LIST <Main component> Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Spec Color Remark 3.0 ,-2.0 dBd,, ,bluetooth, internal ,; ,SINGLE ,-2.0 ,50 SNGF00 ANTENNA,GSM,FIXED SNGF0022601...
  • Page 146 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark C505 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C506 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C507 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C508 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 147 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark U501 EUSY0295501 TQFN , PIN,R/TP ,6 BLU+2 LDO+1 Flash LED Drv, 4*4 VA503 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 VA504 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 POLYI , 0.28mm,3-1-3 RF ,KE/ME970 KEY FPCB ,;...
  • Page 148 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark C116 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C117 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C118 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP C119 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 149 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark C215 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP C216 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP C217 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP C218 CAP,CERAMIC,CHIP ECCH0005602...
  • Page 150 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark C316 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C317 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C318 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP C319 CAP,CERAMIC,CHIP ECCH0009101...
  • Page 151 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark D301 DIODE,TVS EDTY0008604 SOT-563 ,6 V,100 W,R/TP ,PB-FREE FB201 FILTER,BEAD,CHIP SFBH0001003 220 ohm,2012 , FL302 FILTER,EMI/POWER SFEY0012901 SMD ,TDFN,100Ohm & 15pF / 15kV FL303 FILTER,EMI/POWER SFEY0012901 SMD ,TDFN,100Ohm &...
  • Page 152 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark R210 RES,CHIP ERHY0000278 82K ohm,1/16W,J,1005,R/TP R220 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R222 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R302 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP R303 RES,CHIP ERHY0009515...
  • Page 153 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark VA305 DIODE,TVS EDTY0009101 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 VA306 DIODE,TVS EDTY0009101 SOD-923 ,5 V,150 mW,R/TP ,1.0*0.6*0.4 32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9 X101 X-TAL EXXY0018701 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0080601...
  • Page 154 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark C333 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP C342 CAP,TANTAL,CHIP,MAKER ECTZ0000318 33 uF,10V ,M ,STD ,3216 ,R/TP C348 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP C404 CAP,CERAMIC,CHIP ECCH0000110...
  • Page 155 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark CN202 CONN,SOCKET ENSY0017901 14 PIN,ETC , ,2.54 mm,Micro-SD, UIM Dupli Socket CONNECTOR,BOARD TO CN301 ENBY0015601 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT BOARD CN401 CONN,RF SWITCH ENWY0004001 ,SMD ,1.3 dB, SOD-123 ,40 V,1 A,R/TP , ,;...
  • Page 156 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark R226 RES,CHIP ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP R227 RES,CHIP ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP R228 RES,CHIP,MAKER ERHZ0000522 24 ohm,1/16W ,J ,1005 ,R/TP R229 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP...
  • Page 157 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Spec Color Remark R420 RES,CHIP,MAKER ERHZ0000501 620 ohm,1/16W ,J ,1005 ,R/TP R421 RES,CHIP ERHY0009502 10 ohm,1/20W(0.05W) ,J ,0603 ,R/TP R422 RES,CHIP ERHY0009501 0 ohm,1/20W(0.05W) ,J ,0603 ,R/TP R423 RES,CHIP ERHY0009501 0 ohm,1/20W(0.05W) ,J ,0603 ,R/TP...

  • Page 158: Accessory

    DATA CABLE SGDY0010901 LG-US03K ,18pin USB DataCable EAR PHONE/EAR MIKE ; ,40mW ,16 OHM ,100dB ,F0 ,10KHZ ,[empty] ,[empty] SGEY00 SGEY0005526 ,18P MMI CONNECTOR ,SILVER,LG MARK SSAD00 ADAPTOR,AC-DC SSAD0021002 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug - 159 -...
  • Page 159 Note...
  • Page 160 Note...

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