Sony Walkman MZ-RH1 Service Manual page 24

MZ-RH1
Note For Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
X : parts extracted from the component side.
Y : parts extracted from the conductor side.
f : internal component.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
* Replacement of IC401, IC501, IC601 and IC701 on the
MAIN board used in this set requires a special tool.
MAIN board is multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in this diagrams.
Lead Layouts
surface
Lead layout of conventional IC CSP (chip size package)
MZ-RH1
Note on Schematic Diagram:
All capacitors are in F unless otherwise noted. (p: pF)
50 V or less are not indicated except for electrolytics and
tantalums.
All resistors are in and 1 / W or less unless otherwise
4
specified.
f : internal component.
C : panel designation.
Note: Note:
The components identi- Les composants identifiés par
fied by mark 0 or dotted une marque 0 sont critiques
line with mark 0 are criti- pour la sécurité.
cal for safety. Ne les remplacer que par une
Replace only with part pièce por tant le numéro
number specified.
spécifié.
A : B+ Line.
Power voltage is dc 3.7 V and fed with regulated dc power
supply from battery terminal.
Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
( ) : REC
: Impossible to measure
Voltages are taken with a VOM (Input impedance 10 M ).
Voltage variations may be noted due to normal produc-
tion tolerances.
Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
Circled numbers refer to waveforms.
Signal path.
E
: PLAYBACK
j
: REC
J
: OPTICAL IN
F
: LINE IN
d : USB input from PC
G : USB output to PC
N : MIC IN
Abbreviation
CND : Canadian model
* Replacement of IC401, IC501, IC601 and IC701 on the
MAIN board used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
Waveforms
– MAIN Board –
IC901 yd (CLT)
1
2,4 Vp-p
5.7 s
500 mV/DIV, 2 s/DIV
IC451 8 (OSCOUT)
2
1 Vp-p
30.6 s
500 mV/DIV, 20 s/DIV
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