Table Of Contents - Intel BOXD2700DC Specification

Contents
1 Product Description
1.1 Overview ........................................................................................ 11
1.1.1 Feature Summary ................................................................ 11
1.1.2 Board Layout ....................................................................... 13
1.1.3 Block Diagram ..................................................................... 15
1.2 Online Support ................................................................................ 16
1.3 Processor ....................................................................................... 16
1.3.1 Intel
1.4 System Memory .............................................................................. 18
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1.5 Intel NM10 Express Chipset ............................................................. 20
1.5.2 USB ................................................................................... 21
1.5.3 SATA Support ...................................................................... 21
1.6 Real-Time Clock Subsystem .............................................................. 22
1.7 Legacy I/O Controller ....................................................................... 22
1.8 LAN Subsystem ............................................................................... 23
1.8.1 LAN Subsystem Drivers ......................................................... 23
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.9 Audio Subsystem ............................................................................. 25
1.9.1 Audio Subsystem Software .................................................... 26
1.9.2 Audio Connectors and Headers ............................................... 26
1.10 Hardware Management Subsystem .................................................... 27
1.10.1 Hardware Monitoring............................................................. 27
1.10.2 Thermal Monitoring .............................................................. 28
1.11 Power Management ......................................................................... 29
1.11.1 ACPI ................................................................................... 29
1.11.2 Hardware Support ................................................................ 32
2 Technical Reference
2.1 Memory Map ................................................................................... 35
2.1.1 Addressable Memory ............................................................. 35
2.2 Connectors and Headers ................................................................... 38
2.2.1 Back Panel .......................................................................... 39
2.2.2 Component-side Connectors and Headers ................................ 41
2.3 BIOS Configuration Jumper Block ....................................................... 50
2.4 Mechanical Considerations ................................................................ 52
2.4.1 Form Factor ......................................................................... 52
2.5 Electrical Considerations ................................................................... 53
2.5.1 Fan Header Current Capability ................................................ 53
2.5.2 Add-in Board Considerations .................................................. 53
2.6 Thermal Considerations .................................................................... 53
2.6.1 Passive Heatsink Design in a Passive System Environment ......... 55
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D2700 Graphics Subsystem .......................................... 17
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