Add-In Board Considerations; Thermal Considerations; Fan Header Current Capability - Intel BLKDQ35JO Specification

Intel Desktop Board DQ35JO Technical Product Specification
Table 28 lists the current capability of the fan headers.
Table 28. Fan Header Current Capability
Fan Header
Processor fan
Front chassis fan
Rear chassis fan
2.5.3

Add-in Board Considerations

The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (all three
expansion slots and the PCI Express x16 connector filled) must not exceed 14 A.
2.6

Thermal Considerations

CAUTION
A chassis with a maximum internal ambient temperature of 38
inlet is a requirement. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board's maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
56
Maximum Available Current
2.0 A
1.5 A
1.5 A
o
C at the processor fan