Intel BLKD510MO Technical Product Specification page 9

Product specification
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Figures
1.
Major Board Components.................................................................. 13
2.
Block Diagram ................................................................................ 15
3.
LAN Connector LED Locations ............................................................ 24
4.
Back Panel Audio Connectors ............................................................ 26
5.
Thermal Sensors and Fan Header....................................................... 28
6.
Location of the Standby Power Indicator LED ....................................... 34
7.
Detailed System Memory Address Map ............................................... 38
8.
Back Panel Connectors ..................................................................... 41
9.
I/O Shield Reference Diagram ........................................................... 42
10. Component-side Connectors and Headers ........................................... 43
11. Connection Diagram for Front Panel Header ........................................ 51
12. Connection Diagram for Front Panel USB Header.................................. 53
14. Location of the BIOS Configuration Jumper Block ................................. 54
15. Board Dimensions ........................................................................... 56
16. Localized High Temperature Zones..................................................... 58
Not Restricted)................................................................................ 61
Tables
1.
Feature Summary............................................................................ 11
2.
Board Components Shown in Figure 1-1 ............................................. 14
3.
Supported Memory Configurations ..................................................... 18
4.
LAN Connector LED States ................................................................ 24
5.
Audio Jack Support .......................................................................... 25
6.
Effects of Pressing the Power Switch .................................................. 29
7.
Power States and Targeted System Power........................................... 30
8.
Wake-up Devices and Events ............................................................ 31
9.
ENERGY STAR Requirements ............................................................. 35
10. System Memory Map ....................................................................... 39
11. Component-side Connectors and Headers Shown in Figure 2-4............... 44
12. Serial Port Header (COM 1 and COM 2)............................................... 45
13. LVDS Data Connector (30-Pin) .......................................................... 45
14. LVDS Panel Voltage Selection Jumper ................................................. 46
15. Chassis Fan Header ......................................................................... 46
16. SATA Connectors............................................................................. 46
17. LVDS Inverter Power Connector......................................................... 47
18. LVDS Inverter Power Voltage Selection Jumper.................................... 47
19. Parallel Port Header ......................................................................... 48
20. Front Panel Wireless Activity LED Header ............................................ 48
21. S/PDIF Header ................................................................................ 48
22. Front Panel Audio Header for Intel HD Audio........................................ 49
23. Front Panel Audio Header for AC '97 Audio .......................................... 49
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