Table Of Contents - Intel BLKD510MO Technical Product Specification

Contents
1 Product Description
1.1 Overview........................................................................................ 11
1.1.1 Feature Summary ................................................................ 11
1.1.2 Board Layout ....................................................................... 13
1.1.3 Block Diagram ..................................................................... 15
1.2 Online Support................................................................................ 16
1.3 Processor ....................................................................................... 16
1.3.1 Intel D510 Graphics Subsystem.............................................. 17
1.4 System Memory .............................................................................. 18
®
1.5 Intel NM10 Express Chipset............................................................. 19
1.5.2 USB ................................................................................... 21
1.5.3 SATA Support ...................................................................... 21
1.6 Real-Time Clock Subsystem .............................................................. 22
1.7 Legacy I/O Controller ....................................................................... 22
1.7.1 Serial Port Headers............................................................... 22
1.7.2 Parallel Port Header .............................................................. 23
1.8 LAN Subsystem ............................................................................... 23
1.8.1 LAN Subsystem Drivers ......................................................... 23
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.9 Audio Subsystem............................................................................. 25
1.9.1 Audio Subsystem Software .................................................... 26
1.9.2 Audio Connectors and Headers ............................................... 26
1.10 Hardware Management Subsystem .................................................... 27
1.10.1 Hardware Monitoring............................................................. 27
1.10.2 Thermal Monitoring .............................................................. 28
1.11 Power Management ......................................................................... 29
1.11.1 ACPI................................................................................... 29
1.11.2 Hardware Support ................................................................ 32
1.11.3 ENERGY STAR*, E-Standby, and EuP Compliance ...................... 35
2 Technical Reference
2.1 Memory Map................................................................................... 37
2.1.1 Addressable Memory............................................................. 37
2.2 Connectors and Headers................................................................... 40
2.2.1 Back Panel .......................................................................... 41
2.2.2 Component-side Connectors and Headers ................................ 43
2.3 BIOS Configuration Jumper Block....................................................... 54
2.4 Mechanical Considerations ................................................................ 56
2.4.1 Form Factor......................................................................... 56
2.5 Electrical Considerations ................................................................... 57
2.5.1 Fan Header Current Capability................................................ 57
2.5.2 Add-in Board Considerations .................................................. 57
vii