User's Notice; Manual Revision Information; Cooling Solutions; Item Checklist - JETWAY 865PBAR1A User Manual

M/b for lga 775 pentium 4 processor
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USER'S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED,
TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT
WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE 865PBA/865PBAP MOTHER-BOARD
AND WE DO ASSURE THIS MANUAL MEETS USER'S REQUIREMENT BUT WILL CHANGE, CORRECT
ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL "AS IS" WITHOUT
WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL
OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS,
LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER'S BENEFIT, WITHOUT
INTENT TO INFRINGE.

Manual Revision Information

Reversion
Revision History
1.0
First Release

Item Checklist

865PBA/865PBAP Motherboard
Cable for IDE/Floppy
CD for motherboard utilities
Cable for USB2 Port (Option)
SPDIF-IN/SPDIF-OUT Adaptor (Option)
Cable for Serial ATA IDE Port
865PBA/ 865PBAP User's Manual
Intel Pentium 4 Processor Family

Cooling Solutions

As processor technology pushes to faster speeds and higher performance, thermal management
becomes increasingly crucial when building computer systems. Maintaining the proper thermal
environment is key to reliable, long-term system operation. The overall goal in providing the proper
thermal environment is keeping the processor below its specified maximum case temperature.
Heatsinks induce improved processor heat dissipation through increased surface area and
concentrated airflow from attached fans. In addition, interface materials allow effective transfers of
heat from the processor to the heatsink. For optimum heat transfer, Intel recommends the use of
thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below for collection of
heatsinks evaluated and recommended by Intel for use with Intel processors. Note, those heatsinks are
recommended for maintaining the specified Maximum T case requirement. In addition, this collection
is not intended to be a comprehensive listing of all heatsinks that support Intel processors.
For vendor list of heatsink and fan, please visit :
http://developer.intel.com/design/Pentium4/components/index
Date
October 2004
ii

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