Thermal Solutions
Figure 7-7.
UP ATCA Thermal Solution
Note:
Thermal sample only, retention not production ready.
Figure 7-8.
UP ATCA System Layout
Note:
Heatsink should be optimized for the layout.
August 2010
Order Number: 323107-002US
Airflow
direction
®
Intel
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
64