Package Mechanical Specifications; Processor Package Assembly Sketch - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual

Package Mechanical Specifications

2
Package Mechanical
Specifications
2.1 Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA1366 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
of the processor package components and how they are assembled together. See
Section 3
The package components shown in
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Figure 2-1.

Processor Package Assembly Sketch

Substrate Substrate
System Board System Board
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
August 2010
Order Number: 323107-002US
and Section 4.
Die
IHS IHS
Figure 2-1 include the following:
TIM TIM
® ®
Intel Xeon Processor C5500/C3500 Series and LGA1366 Socket
Figure 2-1 shows a sketch
Capacitors Capacitors
LGA LGA1366 Socket
Thermal/Mechanical Design Guide
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