Sony UDA-1 Service Manual page 29

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• DIGITAL board is multi-layer printed board. However, the
patterns of intermediate layers have not been included in
diagrams.
• Indication of transistor.
C
Q These are omitted.
B E
* Replacement of IC201 on the DIGITAL board used in
this unit requires a special tool.
• Lead layouts
Lead layout of conventional IC CSP (Chip Size Package)
• Abbreviation
CH : Chinese model
CND : Canadian model
TW : Taiwan model
Note: When the complete AMP board is replaced, refer to
"NOTE OF REPLACING THE IC350 AND IC351
ON THE AMP BOARD AND THE COMPLETE AMP
BOARD" on page 3.
UDA-1
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• : Internal component.
f
• 2 : Nonfl ammable resistor.
• C : Panel designation.
Note: The components identifi ed by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specifi ed.
Note: Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spécifi é.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
surface
no mark : POWER ON
* : Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO (ANALOG)
J : AUDIO (DIGITAL)
: AUDIO IN (ANALOG)
L
c : AUDIO IN (DIGITAL)
d : USB
* Replacement of IC201 on the DIGITAL board used in
this unit requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
• Abbreviation
CH : Chinese model
CND : Canadian model
TW : Taiwan model
Note: When the complete AMP board is replaced, refer to
"NOTE OF REPLACING THE IC350 AND IC351
ON THE AMP BOARD AND THE COMPLETE AMP
BOARD" on page 3.
• Circuit Boards Location
DCDC board
HP board
F-USB board
FRONT-L board
29 29
PRIMARY board
SPTM board
AMP board
DIGITAL board
FRONT-R board
UDA-1
Ver. 1.1
DAC board