Clocking; Boosterpack Plug-In Module Pinout; Software Examples - Texas Instruments MSPM0L1306 User Manual

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5. For the most accurate current measurements, place the device in "Free Run" mode and disconnect
programming signals between the MSPM0L1306 and the debug portion of the board (header J101).
6. Measure the current. Keep in mind that if the current levels are fluctuating, then getting a stable
measurement can be difficult. Measuring quiescent states is easier.
7. Note that the thermistor circuitry on revision E1 of this board cannot be completely unpowered, and provides
additional current to the measurements unless the thermistor is unpopulated.
EnergyTrace technology can also be used to compare various current profiles and better optimize your energy
performance.

2.7 Clocking

The internal SYSOSC is 32 MHz as default at the accuracy of 2.5%. To achieve higher accuracy, a 0.1%
100-kΩ resistor is connected to the ROSC pin, PA2. If higher accuracy is not needed, then resistor R6 can be
depopulated, and pin PA2 used for the other functions. The MCLK is sourced by 32-MHz SYSOSC at default.
CPUCLK is sourced directly from MCLK in RUN mode and disabled in other modes. The low-power clock
(ULPCLK) can be sourced by MCLK and active in RUN and SLEEP mode by configuration. For more clock
tree details see Section 2.3 Clock Module (CKM) of the
Reference Manual.

2.8 BoosterPack Plug-in Module Pinout

The LaunchPad development kit adheres to the 40-pin LaunchPad development kit pinout standard, where
pins are available. A standard was created to aid compatibility between LaunchPad development kits and
BoosterPack plug-in modules across the TI ecosystem.
While most BoosterPack plug-in modules are compliant with the standard, some are not. The MSPM0L1306
LaunchPad development kit is not compatible with all 40-pin BoosterPack plug-in modules due to the fact
that the MSPM0L1306 device does not have enough pins to fill the standard. If the reseller or owner of
the BoosterPack plug-in module does not explicitly indicate compatibility with the MSPM0L1306 LaunchPad
development kit, then compare the schematic of the candidate BoosterPack plug-in module with the LaunchPad
development kit to verify compatibility. Keep in mind that sometimes conflicts can be resolved by changing the
MSPM0L1306 device pin function configuration in software.
*These pins are not connected to the LaunchPad kit connector by default.
1
2
3
4
5
6
7
8
9
10
21
22
23
24
25
26
27
28
29
30
Figure 2-9. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout

3 Software Examples

See the MSPM0 SDK documentation
SLAU869D – OCTOBER 2022 – REVISED NOVEMBER 2023
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3V3
ADC0.
PA25
2
UART_RX PA9
UART TXD PA8
PA24
ADC0.
PA21
5
SPI_CLK PA6
PA22
I2C_SCL PA1
I2C_SDA PA0
5V
GND
ADC0.9 PA15
ADC0.8/OPA1_OUT PA16
OPA1_IN0- PA17
ADC0_7/
PA18
OPA1_IN0+
NA*
NA*
NA*
NA*
for more details about available software.
Copyright © 2023 Texas Instruments Incorporated
MSPM0 L-Series 32-MHz Microcontrollers Technical
LP-MSPM0L1306
+
Connection to LaunchPad kit connector is determined by header J14
GND
PA3
PA7
PA19
NRST
PA5
PA4
PA20
PA23
+
PA11
PA12
PA13
PA26
PA27
Timer Capture
PA10
+
PA11
NA*
NA*
NA*
NA*
MSPM0L1306 LaunchPad Development Kit (LP
20
19
PWM
SPI_CS 18
17
16
SPI_PICO 15
14
SPI_POCI
SPI_CS 13
SPI_CS 12
PWM 11
PWM
40
PWM 39
PWM 38
PWM
37
36
Timer
35
Capture
34
33
32
31
‑ MSPM0L1306)
Hardware
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