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•
Make sure there are no floating inputs/outputs (I/Os) on the MSP430FR2355. These cause
unnecessary extra current draw. Every I/O should either be driven out or, if it is an input, should be
pulled or driven to a high or low level.
•
Begin target execution.
•
Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
stable measurement. It is easier to measure quiescent states.
EnergyTrace technology can also be used to compare various current profiles and better optimize your
energy performance!
2.5
Clocking
The MSP-EXP430FR2355 provides an external clock in addition to the internal clocks in the device.
•
Q1: 32.768-kHz 12.5-pF crystal
The 32.768-kHz crystal allows for lower LPM sleep currents than do the other low-frequency clock
sources. Therefore, the presence of the crystal allows the full range of low-power modes to be used.
The internal clocks in the device default to the following configuration:
•
MCLK: DCO at 1 MHz
•
SMCLK: DCO at 1 MHz
•
ACLK: REFO at 32.768 kHz
For more information about configuring internal clocks and using the external oscillators, see the
MSP430FR4xx and MSP430FR2xx Family User's
2.6
Using the eZ-FET Debug Probe with a Different Target
The eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 derivative
devices, not just the onboard MSP430FR2355 target device.
To do this, disconnect every jumper in the isolation jumper block. This is necessary, because the debug
probe cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.
Next, make sure the target board has proper connections for SBW. Note that to be compatible with SBW,
the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430
JTAG interface circuitry is the
Finally, wire together these signals from the debug probe side of the isolation jumper block to the target
hardware:
•
5 V (if 5 V is needed)
•
3.3 V
•
GND
•
SBWTDIO
•
SBWTCK
•
TXD (if the UART backchannel is to be used)
•
RXD (if the UART backchannel is to be used)
This wiring can be done either with jumper wires or by designing the board with a connector that plugs into
the isolation jumper block.
2.7
BoosterPack Plug-in Module Pinout
The LaunchPad development kit adheres to the 40-pin LaunchPad development kit pinout standard. A
standard was created to aid compatibility between LaunchPad development kits and BoosterPack plug-in
modules across the TI ecosystem.
SLAU680 – May 2018
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Guide.
MSP430 Hardware Tools User's
MSP430FR2355 LaunchPad™ Development Kit (MSP ‑ EXP430FR2355)
Copyright © 2018, Texas Instruments Incorporated
Guide.
Hardware
13
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