HP ZBook Studio G5 Maintenance And Service Manual page 69

Mobile workstation
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3.
Remove the fan/heat sink assembly (4).
CAUTION:
When lifting the heat sink out of the computer, be careful not to bend the arms that connect
the fans.
Discrete graphics models:
UMA graphics models:
Various thermal pads are used on the system board components and the heat sink sections and that service
them. See the following images for thermal pad locations.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board components each time the fan/heat sink assembly is removed. Replacement thermal
material is included with the thermal module and system board spare part kits.
Component replacement procedures
57

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