Memory Module - HP x360 330 G1 Maintenance And Service Manual

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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board each time the fan/heat sink assembly is removed. Thermal paste is used on
the processor (1) and the fan/heat sink assembly section (2) that services it.
Reverse this procedure to install the fan/heat sink assembly.

Memory module

Description
8-GB (PCL3, 12800, 1600)
4-GB (PCL3, 12800, 1600)
2-GB (PCL3, 12800, 1600)
Before removing the memory module, follow these steps:
1.
Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn
the computer on, and then shut it down through the operating system.
2.
Disconnect all external devices connected to the computer.
3.
Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then
unplugging the AC adapter from the computer.
4.
Remove the keyboard/top cover (see
5.
Disconnect the battery cable from the system board (see
6.
Remove the WLAN module (see
7.
Remove the system board (see
Remove the memory module:
1.
Turn the system board upside down with the front toward you.
Keyboard/top cover on page
WLAN module on page
27).
System board on page
29).
Spare part number
693374-005
691740-005
691739-005
21).
Battery on page
23).
Memory module
33

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