Specifications - ASROCK H510 Pro BTC+ User Manual

1.2 Specifications

Platform
CPU
Chipset
Memory
Expansion
Slot
Graphics
2
• Solid Capacitor design
th
• Supports 10 Gen Intel® Core
TM
Intel® Core Processors (LGA1200)
• Digi Power design
• 4 Power Phase design
• Supports Intel® Turbo Boost Max 3.0 Technology
• Intel® H510
• 1 x DDR4 DIMM Slot
* 2GB DRAM per module is not supported.
• Supports DDR4 3200/2933/2800/2666/2400/2133 non-ECC,
un-buffered memory
th TM
* 11 Gen Intel® Core
TM
Core (i3), Pentium® and Celeron® support DDR4 up to 2666.
th TM
* 10 Gen Intel® Core
TM
Core (i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 32GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
• 6 x PCI Express 3.0 x16 Slots (PCIE1 at x16 / PCIE2~6 at x1)
• 1 x Mining Port (M_Port1 at x1)*
* Support USB Type Riser kit
• Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
th TM
• 11 Gen Intel® Core
Architecture (Gen 12). 10
support Gen 9 Graphics
TM
Processors and 11
(i9/i7/i5) support DDR4 up to 3200;
(i9/i7) support DDR4 up to 2933;
Processors support Intel® X
th TM
Gen Intel® Core
th
Gen
e
Graphics
Processors