Technical specifications
Article number
Data areas and their retentivity
Retentive data area (incl. timers, counters, flags),
max.
Extended retentive data area (incl. timers, coun-
ters, flags), max.
Flag
•
•
Data blocks
•
•
Local data
•
Address area
Number of IO modules
I/O address area
•
•
per integrated IO subsystem
per CM/CP
Subprocess images
•
Hardware configuration
Number of distributed IO systems
Number of DP masters
•
Number of IO Controllers
•
•
Rack
•
•
46
Size, max.
Number of clock memories
Retentivity adjustable
Retentivity preset
per priority class, max.
Inputs
Outputs
–
Inputs (volume)
–
Outputs (volume)
–
Inputs (volume)
–
Outputs (volume)
Number of subprocess images, max.
Via CM
integrated
Via CM
Modules per rack, max.
Number of lines, max.
6ES7513-1AM03-0AB0
256 kbyte; in total; available retentive memory for
bit memories, timers, counters, DBs, and technol-
ogy data (axes): 216 KB
2.5 Mbyte; When using PS 6 0W 24/48/60 V DC HF
16 kbyte
8; 8 clock memory bit, grouped into one clock
memory byte
Yes
No
64 kbyte; max. 16 KB per block
2 048; max. number of modules / submodules
32 kbyte; All inputs are in the process image
32 kbyte; All outputs are in the process image
8 kbyte
8 kbyte
8 kbyte
8 kbyte
32
32; A distributed I/O system is characterized not
only by the integration of distributed I/O via
PROFINET or PROFIBUS communication modules,
but also by the connection of I/O via AS-i master
modules or links (e.g. IE/PB-Link)
6; A maximum of 6 CMs (PROFINET + PROFIBUS)
can be inserted in total
1
6; A maximum of 6 CMs (PROFINET + PROFIBUS)
can be inserted in total
32; CPU + 31 modules
1
CPU 1513-1 PN (6ES7513-1AM03-0AB0)
Equipment Manual, 11/2023, A5E40881673-AD