Cleanliness; Emi - H3C S9820-8M Installation Manual

•
High temperature can accelerate the aging of insulation materials and significantly lower the
reliability and lifespan of the switch.
For the temperature and humidity requirements, see H3C S9820-8M Switch Hardware Information
and Specifications.

Cleanliness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points. In the worst case, electrostatic adsorption can cause
communication failure.
Table1-1 Dust concentration limits in the equipment room
Substance
Dust particles
Dust particles
Dust (suspension)
Dust (sedimentation)
Corrosive gases can accelerate corrosion and aging of components. Make sure the corrosive gases
in the equipment room do not exceed the concentration limits as shown in Table1-2.
Table1-2 Corrosive gas concentration limits in the equipment room
Gas
SO
2
H S
2
Cl
2
HCI
HF
NH
3
O
3
NO
X

EMI

All electromagnetic interference (EMI) sources, from outside or inside of the switch and application
system, adversely affect the switch in the following ways:
•
A conduction pattern of capacitance coupling.
•
Inductance coupling.
•
Electromagnetic wave radiation.
•
Common impedance (including the grounding system) coupling.
To prevent EMI, use the following guidelines:
•
If AC power is used, use a single-phase three-wire power receptacle with protection earth (PE)
to filter interference from the power grid.
Particle diameter
≥ 0.5 µm
≥ 5 µm
≤ 75 µm
75 µm to 150 µm
Average concentration (mg/m
0.3
0.1
0.1
0.1
0.01
1.0
0.05
0.5
1-2
Concentration limit
≤ 3.5 × 10
6
particles/m
≤ 3 × 10
4
particles/m
≤ 0.2 mg/m
3
≤ 1.5 mg/(m 2
h)
3
) Maximum concentration (mg/m
1.0
0.5
0.3
0.5
0.03
3.0
0.1
1.0
3
3
3
)