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corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding
the soldering iron.
6.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as
shown in below figure.
7. CPU DATA
7.1. IC801
14
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