Hardware Specifications - HP Pavilion XF125 Troubleshooting & Repair Manual

Hardware Specifications

The specifications shown below are subject to change. For the latest specifications, see the HP
Notebook web site (www.hp.com/notebooks).
Physical Attributes
13.03 x 10.72 x 1.59 in (319 x 260 x 33 mm).
6.0 lbs (2.7 kg) minimum.
CPU Technology code GE: AMD Duron and Athlon, 200-MHz FSB.
Chip Set
Technology code GE: VIA KN133 + VT8231.
RAM
133-MHz SDRAM (PC133).
Maximum memory upgrade to 1 GB by two 512-MB SODIMM (144-pin/3.3 V) modules
in two 1.25-in slots.
Mass Storage
9.5-mm, 2.5-in hard disk drive.
1.44-MB floppy disk drive.
CD/DVD Drive 24x CD-ROM, 24x8x DVD, 8x4x24x DVD/CD-RW (or higher).
Display
14.1-in XGA (1024x768) TFT LCD.
Video Chip
Integrated AGP, 3D embedded in VIA Twister.
Keyboard and
87/88/90-key spill-proof QWERTY keyboard with 101/102 key emulation.
Pointing Devices
Embedded numeric keypad.
12 function (Fn) keys.
Touch pad.
Left and right click buttons, center scroll button.
Audio Two stereo speakers.
Color-coded jacks: headphone-out (lime green) and microphone-in (pink).
Power
Rechargeable lithium-ion battery (55 W) or NiMH battery (38.4 W).
Low-battery warning.
Suspend/resume capability.
AC adapter (DC-in) jack.
Universal AC adapter: 100–240 Vac (50/60 Hz) input, 19 Vdc output,
60–65 W.
I/O Ports 25-pin bi-directional high-speed ECP/EPP parallel (burgundy).
15-pin external monitor (VGA) video out port (blue).
Two universal serial bus (USB) ports.
Built-in modem, supporting Wake up on Ring# from D3 (hot) with AC-in.
Expandability One Type II or Type III 16-/32-bit PCMCIA slot.
Options 128/256/512-MB PC133 SODIMM: 3.3 V, 144-pin, SDRAM.
Built-in LAN.
Environmental Limits
Operating temperature: 0 to 40 °C (32 to 104 °F).
Storage temperature: –20 to 65 °C (–4 to 149 °F).
Operating humidity: 20% (10% on some models) to 90% RH (0 to 40 °C).
Operating altitude: up to 3,000 m (10,000 ft) at 25 °C (77 °F).
Storage altitude: up to 12,000 m (40,000 ft).
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