Summary of Contents for Texas Instruments HDC1050EVM
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HDC1050EVM User 's Guide User's Guide Literature Number: SNAU181A June 2015 – Revised June 2015...
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SNAU181A – June 2015 – Revised June 2015 HDC1050EVM User 's Guide Introduction The Texas Instruments HDC1050EVM evaluation module (EVM) enables designers to evaluate the operation and performance of the HDC1050 Relative Humidity and Temperature sensor. The EVM contains one HDC1050 (See Table Table 1.
This connector is used for communications with the PC and provides power for the EVM. Hardware Setup The HDC1050EVM power is supplied via the USB connector. The LDO (U4) converts the 5V from the USB to 3.3V used by the HDC1050 and the MSP430. The EVM may be directly inserted into a USB port on a PC or laptop, or may be connected to the latter using the appropriate USB cable.
Launch the GUI. A detailed description of the GUI operation is presented later in this document. Reducing the Sensor Thermal Mass The HDC1050EVM can be broken into 2 sections to isolate the thermal mass of the µC from the HDC1050. The yellow arrow in...
The communications with the µC section is achieved through a 4-wire cable soldered at the pads accessible on the bottom layer of the PCB (Refer to Figure 12). Figure 12. HDC1050EVM Pads for I2C and Supply of the Smaller Sensor Section GUI Operation The section describes how to use the GUI Starting the GUI Follow these steps to start the GUI: 1.
Figure 52 Figure 53 show the board layout for the HDC1050EVM. Note that the DAP pad on the HDC1050 is grounded on the EVM, but in most system designs, should be left floating (not contacted with GND) to reduce the influence of the PCB thermals on the temperature measurement.
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.
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FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.