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5.
Remove the heat sink (2).
NOTE:
system board components, it may be necessary to move the heat sink from side to side to detach
it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the system board (1),
(2), and (3), and the heat sink components (4) each time the heat sink is removed. Thermal paste is
used on the processor and the heat sink section that services it. Thermal pads are used on the
Northbridge chip and the section of the heat sink that services it. Replacement thermal material is
included with the discrete thermal module kit (spare part number 517747-001) and the discrete memory
system board kit (spare part number 506763-001).
The following illustration shows the replacement thermal material locations for computer models
equipped with discrete graphics subsystem memory.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the system board (1)
and (2) , and the heat sink components (3) each time the heat sink is removed. Thermal paste is used
on the processor and the heat sink section that services it. Thermal pads are used on the Northbridge
chip and the section of the heat sink that services it. Replacement thermal material is included with the
UMA thermal module kit, spare part number 517746-001) and the UMA memory system board (spare
part number 506762-001), spare part kits.
78
Chapter 4 Removal and replacement procedures
Due to the adhesive quality of the thermal material located between the heat sink and
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