Requirements; Environmental Requirements; Table 3-1 Environmental Conditions - Emerson AXP1620 Installation And Use Manual

Requirements

3.2.3
3.2.3.1
AXP1620 Installation and Use (6806800E23E)
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4. Is suitable equipment available to lift the system into the rack?
5. Is there enough space to run a system console terminal? Is the cable long enough to reach
the system?
6. Are the inlet and outlet of the fans and therefore the airflow not blocked?
Requirements
Before and during system installation and operation, you always have to ensure that the
requirements listed in the following sections are met.

Environmental Requirements

To ensure proper function of the system, make sure that the environment in which the system
is to be used fulfills the environmental requirements.
The environmental values must be tested and proven in the planned system configuration, that
is, the delivered system and other third-party products you want to integrate.
Operating temperatures refer to the temperature of the air circulating at the air
intake of the system and not to component temperatures.
Some of the climatic values may exceed the specification of some system
components (for example, hard disks). As Emerson cannot guarantee the
functionality of third party products that are handled or operated out of their
specifications, the environmental conditions may be limited to the specifications of
these components.
The following table lists the environmental requirements.

Table 3-1 Environmental Conditions

Feature Operating
Temperature +5ºC (41°F) to +40ºC (104°F) (normal
operation) according to NEBS standard
GR-63-CORE
-5°C (23°F) to +55°C (131°F) (exceptional
operation) according to NEBS standard
GR-63-CORE
Temp. +/-0.25°C/min
change according to NEBS standard GR-63-CORE
Relative 5% to 90% non-condensing
humidity according to Emerson-internal
environmental requirements
Shock Half-sine, 11 ms, 30 m/s
Non-Operating (packed state)
-40°C (-40°F) to +70°C (158°F)
+/-0.25°C/min
5% to 95% non-condensing
according to Emerson-internal
environmental requirements
2
Blade level packaging
Half-sine, 6 ms at 180 m/s
Site Preparation
2
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